953 In Stock

-

YES

324

活跃

ADVANCED MICRO DEVICES INC

15 X 15 MM, 0.80 MM PITCH, LEAD FREE, MO-275, CSBGA-324

500 MHz

3

85 °C

PLASTIC/EPOXY

LFBGA

BGA324,18X18,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.05 V

0.95 V

1 V

有

e1

锡银铜

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B324

218

不合格

OTHER

218

3411 CLBS

1.5 mm

现场可编程门阵列

0.46 ns

3411

15 mm

15 mm

775 In Stock

-

YES

484

ADVANCED MICRO DEVICES INC

LEAD FREE, FBGA-484

4

100 °C

-40 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.03 V

0.97 V

1 V

有

活跃

e1

锡银铜

BOTTOM

BALL

250

not_compliant

30

S-PBGA-B484

不合格

305400 CLBS

现场可编程门阵列

305400

574 In Stock

-

YES

208

HEAT SINK, PLASTIC, QFP-208

3

85 °C

PLASTIC/EPOXY

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

3.6 V

3 V

3.3 V

有

活跃

ADVANCED MICRO DEVICES INC

e3

哑光锡

TYP. GATES = 15000-23000

QUAD

鸥翼

245

0.5 mm

compliant

30

S-PQFP-G208

不合格

484 CLBS, 15000 GATES

4.1 mm

现场可编程门阵列

484

15000

28 mm

28 mm

N/A

-

YES

240

100 °C

-40 °C

PLASTIC/EPOXY

HLFQFP

HQFP240,1.37SQ,20

SQUARE

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

3.6 V

3 V

3.3 V

无

接触制造商

ADVANCED MICRO DEVICES INC

e0

锡铅

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G240

128

不合格

128

现场可编程门阵列

256

256

N/A

-

YES

676

有

活跃

ADVANCED MICRO DEVICES INC

FPBGA-676

667 MHz

3

125 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

网格排列

1.26 V

1.2 V

1.23 V

e1

锡银铜

BOTTOM

BALL

250

1 mm

compliant

30

S-PBGA-B676

376

376

7911 CLBS

2.44 mm

现场可编程门阵列

0.26 ns

7911

101261

27 mm

27 mm

N/A

-

YES

900

ADVANCED MICRO DEVICES INC

FBGA-900

3

85 °C

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

网格排列

1.26 V

1.14 V

1.2 V

无

活跃

e0

锡铅

BOTTOM

BALL

1 mm

compliant

S-PBGA-B900

不合格

OTHER

192 CLBS, 50000 GATES

2.6 mm

现场可编程门阵列

192

50000

31 mm

31 mm

N/A

-

YES

900

无

活跃

ADVANCED MICRO DEVICES INC

CSBGA-900

862 MHz

3

125 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

网格排列

1.26 V

1.2 V

1.23 V

e0

锡铅

BOTTOM

BALL

1 mm

compliant

S-PBGA-B900

498

498

7911 CLBS

2.6 mm

现场可编程门阵列

0.21 ns

7911

101261

31 mm

31 mm

N/A

-

有

活跃

ADVANCED MICRO DEVICES INC

4

e1

锡银铜

245

compliant

30

现场可编程门阵列

N/A

-

有

活跃

ADVANCED MICRO DEVICES INC

4

e1

Tin/Silver/Copper (Sn/Ag/Cu)

not_compliant

现场可编程门阵列

N/A

-

有

活跃

ADVANCED MICRO DEVICES INC

4

e1

Tin/Silver/Copper (Sn/Ag/Cu)

not_compliant

现场可编程门阵列

313 In Stock

-

YES

1156

ADVANCED MICRO DEVICES INC

FBGA-1156

4

100 °C

PLASTIC/EPOXY

BGA

BGA1156,34X34,40

SQUARE

网格排列

1.03 V

0.97 V

1 V

有

活跃

e1

锡银铜

BOTTOM

BALL

245

1 mm

compliant

30

S-PBGA-B1156

不合格

OTHER

3.35 mm

现场可编程门阵列

0.61 ns

35 mm

35 mm

N/A

-

YES

676

有

活跃

ADVANCED MICRO DEVICES INC

FPBGA-676

862 MHz

3

125 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

网格排列

1.26 V

1.2 V

1.23 V

e1

锡银铜

BOTTOM

BALL

250

1 mm

compliant

30

S-PBGA-B676

480

480

7911 CLBS

2.44 mm

现场可编程门阵列

0.21 ns

7911

101261

27 mm

27 mm

N/A

-

YES

900

4

100 °C

-40 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

0.85 V

有

活跃

ADVANCED MICRO DEVICES INC

FCBGA-900

e1

锡银铜

BOTTOM

BALL

1 mm

compliant

S-PBGA-B900

34260 CLBS

3.42 mm

FPGA SOC

34260

599550

3.42 mm

31 mm

N/A

-

有

活跃

ADVANCED MICRO DEVICES INC

3

e1

Tin/Silver/Copper (Sn/Ag/Cu)

260

compliant

现场可编程门阵列

N/A

-

YES

1156

有

活跃

ADVANCED MICRO DEVICES INC

FBGA-1156

1098 MHz

4

100 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA1156,34X34,40

SQUARE

网格排列

0.97 V

0.91 V

0.94 V

e1

锡银铜

BOTTOM

BALL

245

1 mm

compliant

30

S-PBGA-B1156

600

INDUSTRIAL

600

18840 CLBS

3.5 mm

现场可编程门阵列

0.4 ns

18840

241152

35 mm

35 mm

N/A

-

YES

484

有

活跃

ADVANCED MICRO DEVICES INC

CSBGA-484

667 MHz

3

125 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

1.26 V

1.2 V

1.23 V

e1

锡银铜

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B484

338

338

7911 CLBS

1.8 mm

现场可编程门阵列

0.26 ns

7911

101261

19 mm

19 mm

N/A

-

YES

100

125 °C

-55 °C

CERAMIC

QFF

QFL100,.7SQ,25

SQUARE

FLATPACK

5 V

无

接触制造商

ADVANCED MICRO DEVICES INC

50 MHz

QUAD

FLAT

0.635 mm

compliant

S-XQFP-F100

64

不合格

MILITARY

64

现场可编程门阵列

38535Q/M;38534H;883B

64

N/A

-

YES

144

BGA

SQUARE

网格排列

1.05 V

0.95 V

1 V

有

活跃

ADVANCED MICRO DEVICES INC

TQGA-144

PLASTIC/EPOXY

BOTTOM

BALL

未说明

compliant

未说明

S-PBGA-B144

469 CLBS

现场可编程门阵列

1.27 ns

469

N/A

-

无

活跃

ADVANCED MICRO DEVICES INC

3

e0

锡铅

225

not_compliant

30

现场可编程门阵列

N/A

-

YES

900

ADVANCED MICRO DEVICES INC

FBGA-900

4

85 °C

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

网格排列

1.03 V

0.97 V

1 V

有

活跃

BOTTOM

BALL

1 mm

compliant

S-PBGA-B900

500

OTHER

500

25475 CLBS

3.35 mm

现场可编程门阵列

0.61 ns

25475

31 mm

31 mm

731 In Stock

-

YES

900

活跃

ADVANCED MICRO DEVICES INC

LEAD FREE, FBGA-900

630 MHz

3

85 °C

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

网格排列

1.26 V

1.14 V

1.2 V

有

e1

锡银铜

BOTTOM

BALL

250

1 mm

compliant

30

S-PBGA-B900

633

不合格

OTHER

633

192 CLBS, 50000 GATES

2.6 mm

现场可编程门阵列

0.61 ns

192

50000

31 mm

31 mm

N/A

-

有

活跃

ADVANCED MICRO DEVICES INC

4

e1

Tin/Silver/Copper (Sn/Ag/Cu)

not_compliant

现场可编程门阵列

N/A

-

有

活跃

ADVANCED MICRO DEVICES INC

4

e1

Tin/Silver/Copper (Sn/Ag/Cu)

not_compliant

现场可编程门阵列

N/A

-

YES

1738

活跃

ADVANCED MICRO DEVICES INC

BGA-1738

4

100 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA1738,42X42,40

SQUARE

网格排列

1.05 V

0.95 V

1 V

有

锡银铜

BOTTOM

BALL

245

1 mm

compliant

30

S-PBGA-B1738

680

INDUSTRIAL

680

12160 CLBS

3.25 mm

现场可编程门阵列

0.77 ns

12160

155648

42.5 mm

42.5 mm

N/A

-

无

活跃

ADVANCED MICRO DEVICES INC

3

e0

锡铅

compliant

现场可编程门阵列