AMD的应用特定微控制器_正品采购_价格信息

品牌是'AMD' (158)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	表面安装	终端数量																JESD-609代码	端子表面处理	附加功能	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	JESD-30代码	温度等级	uPs/uCs/外围ICs类型	座位高度-最大	总线兼容性	长度	宽度
XCZU6EG-3FFVB1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1156	FCBGA-1156	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	SQUARE	网格排列	0.9 V	有	活跃	ADVANCED MICRO DEVICES INC	e1	锡银铜		BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B1156	INDUSTRIAL	PROGRAMMABLE SoC	3.42 mm		35 mm	35 mm
XCZU19EG-1LFFVB1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1517	ADVANCED MICRO DEVICES INC	FCBGA-1517	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA1517,39X39,40	SQUARE	网格排列	0.85 V	有	活跃	e1	锡银铜		BOTTOM	BALL		1 mm	compliant		S-PBGA-B1517	INDUSTRIAL	PROGRAMMABLE SoC	3.51 mm	CAN, I2C, SPI, UART	40 mm	40 mm
XCZU6CG-L1SFVA625I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	有	活跃	ADVANCED MICRO DEVICES INC	BGA-625	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.742 V	0.698 V	0.72 V	e1	锡银铜	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B625	INDUSTRIAL	PROGRAMMABLE SoC	3.43 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	21 mm	21 mm
XCZU4EG-1LSFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	ADVANCED MICRO DEVICES INC	FCBGA-784	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃	e1	锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B784	INDUSTRIAL	PROGRAMMABLE SoC	3.32 mm	CAN, I2C, SPI, UART	23 mm	23 mm
XCZU17EG-1LFFVE1924I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1924	ADVANCED MICRO DEVICES INC	FCBGA-1924	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA1924,44X44,40	SQUARE	网格排列	0.85 V	有	活跃	e1	锡银铜		BOTTOM	BALL		1 mm	compliant		S-PBGA-B1924	INDUSTRIAL	PROGRAMMABLE SoC	3.71 mm	CAN, I2C, SPI, UART	45 mm	45 mm
XCZU6CG-2LFFVC900E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	FCBGA-900	4	110 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC	e1	锡银铜		BOTTOM	BALL		1 mm	compliant		S-PBGA-B900	OTHER	PROGRAMMABLE SoC	3.42 mm	CAN, I2C, SPI, UART	31 mm	31 mm
XCZU2EG-2LSFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	ADVANCED MICRO DEVICES INC	FCBGA-784	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃	e1	锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B784	INDUSTRIAL	PROGRAMMABLE SoC	3.32 mm	CAN, I2C, SPI, UART	23 mm	23 mm
XCZU9CG-2LFFVC900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	FCBGA-900	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC				BOTTOM	BALL		1 mm	compliant		S-PBGA-B900	INDUSTRIAL	PROGRAMMABLE SoC	3.42 mm	CAN, I2C, SPI, UART	31 mm	31 mm
XCZU5EV-2LSFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	FCBGA-784	4	110 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC	e1	锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B784	OTHER	PROGRAMMABLE SoC	3.32 mm	CAN, I2C, SPI, UART	23 mm	23 mm
XCZU3EG-1LSBVA484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	ADVANCED MICRO DEVICES INC	FCBGA-484	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃	e1	锡银铜		BOTTOM	BALL		0.8 mm	compliant		S-PBGA-B484	INDUSTRIAL	PROGRAMMABLE SoC	2.61 mm	CAN, I2C, SPI, UART	19 mm	19 mm
XCZU7EG-3FFVC1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1156	FCBGA-1156	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	SQUARE	网格排列	0.9 V	有	活跃	ADVANCED MICRO DEVICES INC	e1	锡银铜		BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B1156	INDUSTRIAL	PROGRAMMABLE SoC	3.51 mm		35 mm	35 mm
XCZU19EG-1LFFVE1924I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1924	ADVANCED MICRO DEVICES INC	FCBGA-1924	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA1924,44X44,40	SQUARE	网格排列	0.85 V	有	活跃	e1	锡银铜		BOTTOM	BALL		1 mm	compliant		S-PBGA-B1924	INDUSTRIAL	PROGRAMMABLE SoC	3.71 mm	CAN, I2C, SPI, UART	45 mm	45 mm
XCZU3EG-2LSFVA625E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	FCBGA-625	4	110 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC	e1	锡银铜		BOTTOM	BALL		0.8 mm	compliant		S-PBGA-B625	OTHER	PROGRAMMABLE SoC	3.43 mm	CAN, I2C, SPI, UART	21 mm	21 mm
XCZU6CG-2LFFVC900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	FCBGA-900	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC				BOTTOM	BALL		1 mm	compliant		S-PBGA-B900	INDUSTRIAL	PROGRAMMABLE SoC	3.42 mm	CAN, I2C, SPI, UART	31 mm	31 mm
XCZU2CG-2LSFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	FCBGA-784	4	110 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC	e1	锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B784	OTHER	PROGRAMMABLE SoC	3.32 mm	CAN, I2C, SPI, UART	23 mm	23 mm
XCZU9CG-2SFVA625I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	有	活跃	ADVANCED MICRO DEVICES INC	BGA-625	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	e1	锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B625	INDUSTRIAL	PROGRAMMABLE SoC	3.43 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	21 mm	21 mm
XCZU19EG-3FFVC1760I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1760	FCBGA-1760	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	SQUARE	网格排列	0.9 V	有	活跃	ADVANCED MICRO DEVICES INC	e1	锡银铜		BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B1760	INDUSTRIAL	PROGRAMMABLE SoC	3.71 mm		42.5 mm	42.5 mm
XCZU9CG-L1FBVB900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	有	活跃	ADVANCED MICRO DEVICES INC	BGA-900	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.742 V	0.698 V	0.72 V	e1	锡银铜	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B900	INDUSTRIAL	PROGRAMMABLE SoC	2.88 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	31 mm	31 mm
XCZU6CG-1SFVA625I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	有	活跃	ADVANCED MICRO DEVICES INC	BGA-625	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	e1	锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B625	INDUSTRIAL	PROGRAMMABLE SoC	3.43 mm	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	21 mm	21 mm
XCZU5CG-2LSFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	ADVANCED MICRO DEVICES INC	FCBGA-784	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃	e1	锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B784	INDUSTRIAL	PROGRAMMABLE SoC	3.32 mm	CAN, I2C, SPI, UART	23 mm	23 mm
XCZU3CG-2LSFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	FCBGA-784	4	110 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC	e1	锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B784	OTHER	PROGRAMMABLE SoC	3.32 mm	CAN, I2C, SPI, UART	23 mm	23 mm
XCZU4EV-1LFBVB900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	ADVANCED MICRO DEVICES INC	FCBGA-900	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	活跃	e1	锡银铜		BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B900	INDUSTRIAL	PROGRAMMABLE SoC	2.88 mm	CAN, I2C, SPI, UART	31 mm	31 mm
XCZU17EG-1LFFVC1760I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1760	ADVANCED MICRO DEVICES INC	FCBGA-1760	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA1760,42X42,40	SQUARE	网格排列	0.85 V	有	活跃	e1	锡银铜		BOTTOM	BALL		1 mm	compliant		S-PBGA-B1760	INDUSTRIAL	PROGRAMMABLE SoC	3.71 mm	CAN, I2C, SPI, UART	42.5 mm	42.5 mm
XCZU17EG-2LFFVB1517E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1517	FCBGA-1517	4	110 °C	PLASTIC/EPOXY	BGA	BGA1517,39X39,40	SQUARE	网格排列	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC	e1	锡银铜		BOTTOM	BALL		1 mm	compliant		S-PBGA-B1517	OTHER	PROGRAMMABLE SoC	3.51 mm	CAN, I2C, SPI, UART	40 mm	40 mm
XCZU17EG-2LFFVE1924E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1924	FCBGA-1924	4	110 °C	PLASTIC/EPOXY	BGA	BGA1924,44X44,40	SQUARE	网格排列	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC	e1	锡银铜		BOTTOM	BALL		1 mm	compliant		S-PBGA-B1924	OTHER	PROGRAMMABLE SoC	3.71 mm	CAN, I2C, SPI, UART	45 mm	45 mm