AMD的应用特定微控制器_正品采购_价格信息

品牌是'AMD' (158)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	表面安装	终端数量			厂商																			系列	JESD-609代码	ECCN 代码	端子表面处理	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	资历状况	温度等级	端口的数量	uPs/uCs/外围ICs类型	电源电流-最大值	座位高度-最大	边界扫描	低功率模式	筛选水平	外部数据总线宽度	内存(字)	串行I/O数	总线兼容性
XCZU6CG-1SBVA484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	BGA-484		e1		锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B484		INDUSTRIAL		PROGRAMMABLE SoC			2.61 mm						I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)			19 mm	19 mm
XCZU19EG-2LFFVD1760E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1760	BGA	BGA1760,42X42,40	SQUARE	网格排列	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-1760	4	110 °C	PLASTIC/EPOXY		e1		锡银铜		BOTTOM	BALL		1 mm	compliant			S-PBGA-B1760		OTHER		PROGRAMMABLE SoC			3.71 mm						CAN, I2C, SPI, UART			42.5 mm	42.5 mm
XCZU6CG-2SFVA625E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	100 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	BGA-625	4		e1		锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B625		OTHER		PROGRAMMABLE SoC			3.43 mm						I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)			21 mm	21 mm
XCZU2CG-2LSFVA625E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-625	4	110 °C	PLASTIC/EPOXY		e1		锡银铜		BOTTOM	BALL		0.8 mm	compliant			S-PBGA-B625		OTHER		PROGRAMMABLE SoC			3.43 mm						CAN, I2C, SPI, UART			21 mm	21 mm
XCZU11EG-3FFVF1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1517	PLASTIC/EPOXY	BGA	SQUARE	网格排列	0.9 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-1517	4	100 °C	-40 °C		e1		锡银铜		BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B1517		INDUSTRIAL		PROGRAMMABLE SoC			3.51 mm									40 mm	40 mm
XCZU6CG-1FBVB900E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	100 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.876 V	0.825 V	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	BGA-900	4		e1		锡银铜		BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B900		OTHER		PROGRAMMABLE SoC			2.88 mm						I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)			31 mm	31 mm
XCZU9CG-2SFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	100 °C	PLASTIC/EPOXY	FBGA	BGA78428X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	BGA-784	4		e1		锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		OTHER		PROGRAMMABLE SoC			3.32 mm						I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)			23 mm	23 mm
AM9551CC	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	28	RECTANGULAR	DIP28,.6	DIP	CERAMIC, METAL-SEALED COFIRED	70 °C	3.125 MHz	DIP, DIP28,.6	DIP	ADVANCED MICRO DEVICES INC	Obsolete	无	5 V	4.75 V		5.25 V	IN-LINE		e0		Tin/Lead (Sn/Pb)	8542.31.00.01	DUAL	THROUGH-HOLE		2.54 mm	unknown		28	R-CDIP-T28	不合格	COMMERCIAL		SERIAL IO/COMMUNICATION CONTROLLER, SERIAL		120 mA	5.715 mm	NO	NO	8	0	1	8080A	ASYNC, BIT; ETHERNET	NRZ	37.338 mm	15.24 mm
XCZU7EV-2LFBVB900E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-900	4	110 °C	PLASTIC/EPOXY		e1		锡银铜		BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B900		OTHER		PROGRAMMABLE SoC			2.88 mm						CAN, I2C, SPI, UART			31 mm	31 mm
XCZU9CG-2SBVA484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	BGA-484		e1		锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B484		INDUSTRIAL		PROGRAMMABLE SoC			2.61 mm						I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)			19 mm	19 mm
XCZU7CG-2LFBVB900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-900	4	100 °C		e1		锡银铜		BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B900		INDUSTRIAL		PROGRAMMABLE SoC			2.88 mm						CAN, I2C, SPI, UART			31 mm	31 mm
XCZU9CG-1SBVA484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	BGA-484		e1		锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B484		INDUSTRIAL		PROGRAMMABLE SoC			2.61 mm						I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)			19 mm	19 mm
AM33C93A-20KC/W	AMD	数据表	4332 In Stock	1: ¥190.544645 10: ¥179.759098 100: ¥169.584052 500: ¥159.984956 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Advanced Micro Devices	Bulk	活跃			*
XCZU9CG-1SFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	100 °C	0.85 V	0.825 V	0.876 V	GRID ARRAY, FINE PITCH	SQUARE	BGA78428X28,32	FBGA	PLASTIC/EPOXY	有	活跃		ADVANCED MICRO DEVICES INC	BGA-784	4		e1		锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		OTHER		PROGRAMMABLE SoC			3.32 mm						I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)			23 mm	23 mm
XCZU6CG-1LFFVB1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1156	-40 °C	PLASTIC/EPOXY	BGA	BGA1156,34X34,40	SQUARE	网格排列	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-1156	4	100 °C		e1		锡银铜		BOTTOM	BALL		1 mm	compliant			S-PBGA-B1156		INDUSTRIAL		PROGRAMMABLE SoC			3.42 mm						CAN, I2C, SPI, UART			35 mm	35 mm
XCZU11EG-1LFFVC1760I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1760	-40 °C	PLASTIC/EPOXY	BGA	BGA1760,42X42,40	SQUARE	网格排列	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-1760	4	100 °C		e1		锡银铜		BOTTOM	BALL		1 mm	compliant			S-PBGA-B1760		INDUSTRIAL		PROGRAMMABLE SoC			3.71 mm						CAN, I2C, SPI, UART			42.5 mm	42.5 mm
XCZU3CG-1LSFVA625I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	-40 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-625	4	100 °C		e1		锡银铜		BOTTOM	BALL		0.8 mm	compliant			S-PBGA-B625		INDUSTRIAL		PROGRAMMABLE SoC			3.43 mm						CAN, I2C, SPI, UART			21 mm	21 mm
AM2951DMB	AMD	数据表	269 In Stock	-	最小起订量: 1 最小包装量: 1	NO	28	DIP	DIP, DIP28,.6	16	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	DIP	DIP28,.6	RECTANGULAR	IN-LINE	5.5 V	4.5 V	5 V	无	Obsolete		ADVANCED MICRO DEVICES INC		e0	EAR99	锡铅	8542.39.00.01	DUAL	THROUGH-HOLE		2.54 mm	unknown		28	R-CDIP-T28	不合格	MILITARY	2	PARALLEL IO PORT, GENERAL PURPOSE	8		5.715 mm		MIL-STD-883 Class B (Modified)							37.338 mm	15.24 mm
XCZU19EG-2LFFVC1760E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1760	BGA	BGA1760,42X42,40	SQUARE	网格排列	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-1760	4	110 °C	PLASTIC/EPOXY		e1		锡银铜		BOTTOM	BALL		1 mm	compliant			S-PBGA-B1760		OTHER		PROGRAMMABLE SoC			3.71 mm						CAN, I2C, SPI, UART			42.5 mm	42.5 mm
XCZU3CG-1LSFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	-40 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-784	4	100 °C		e1		锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		INDUSTRIAL		PROGRAMMABLE SoC			3.32 mm						CAN, I2C, SPI, UART			23 mm	23 mm
XCZU6CG-2SFVA625I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	BGA-625		e1		锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B625		INDUSTRIAL		PROGRAMMABLE SoC			3.43 mm						I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)			21 mm	21 mm
XCZU9CG-1LFFVC900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-900	4	100 °C		e1		锡银铜		BOTTOM	BALL		1 mm	compliant			S-PBGA-B900		INDUSTRIAL		PROGRAMMABLE SoC			3.42 mm						CAN, I2C, SPI, UART			31 mm	31 mm
XCZU11EG-3FFVB1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1517	PLASTIC/EPOXY	BGA	SQUARE	网格排列	0.9 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-1517	4	100 °C	-40 °C		e1		锡银铜		BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B1517		INDUSTRIAL		PROGRAMMABLE SoC			3.51 mm									40 mm	40 mm
XCZU5EV-3FBVB900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	PLASTIC/EPOXY	BGA	SQUARE	网格排列	0.9 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-900	4	100 °C	-40 °C		e1		锡银铜		BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B900		INDUSTRIAL		PROGRAMMABLE SoC			2.88 mm									31 mm	31 mm
XCZU19EG-2LFFVE1924E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1924	BGA	BGA1924,44X44,40	SQUARE	网格排列	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-1924	4	110 °C	PLASTIC/EPOXY		e1		锡银铜		BOTTOM	BALL		1 mm	compliant			S-PBGA-B1924		OTHER		PROGRAMMABLE SoC			3.71 mm						CAN, I2C, SPI, UART			45 mm	45 mm