AMD的应用特定微控制器_正品采购_价格信息

品牌是'AMD' (158)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	表面安装	终端数量			厂商																			系列	JESD-609代码	ECCN 代码	端子表面处理	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	资历状况	温度等级	端口的数量	uPs/uCs/外围ICs类型	电源电流-最大值
XCZU6CG-2SFVA625E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	100 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	BGA-625	4		e1		锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B625		OTHER		PROGRAMMABLE SoC		3.43 mm		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)		21 mm	21 mm
XCZU2CG-2LSFVA625E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-625	4	110 °C	PLASTIC/EPOXY		e1		锡银铜		BOTTOM	BALL		0.8 mm	compliant			S-PBGA-B625		OTHER		PROGRAMMABLE SoC		3.43 mm		CAN, I2C, SPI, UART		21 mm	21 mm
XCZU11EG-3FFVF1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1517	PLASTIC/EPOXY	BGA	SQUARE	网格排列	0.9 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-1517	4	100 °C	-40 °C		e1		锡银铜		BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B1517		INDUSTRIAL		PROGRAMMABLE SoC		3.51 mm				40 mm	40 mm
XCZU6CG-1FBVB900E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	100 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.876 V	0.825 V	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	BGA-900	4		e1		锡银铜		BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B900		OTHER		PROGRAMMABLE SoC		2.88 mm		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)		31 mm	31 mm
XCZU4EG-3SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	PLASTIC/EPOXY	FBGA	SQUARE	GRID ARRAY, FINE PITCH	0.9 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-784	4	100 °C	-40 °C		e1		锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		INDUSTRIAL		PROGRAMMABLE SoC		3.32 mm				23 mm	23 mm
XCZU7EV-1LFFVC1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1156	-40 °C	PLASTIC/EPOXY	BGA	BGA1156,34X34,40	SQUARE	网格排列	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-1156	4	100 °C		e1		锡银铜		BOTTOM	BALL		1 mm	compliant			S-PBGA-B1156		INDUSTRIAL		PROGRAMMABLE SoC		3.51 mm		CAN, I2C, SPI, UART		35 mm	35 mm
AM33C93A-20KC/W	AMD	数据表	3479 In Stock	1: ¥171.507704 10: ¥161.799721 100: ¥152.641245 500: ¥144.001176 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Advanced Micro Devices	Bulk	活跃			*
XCZU27DR-2FFVE1156E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1156	0.876 V	0.825 V	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	100 °C	PLASTIC/EPOXY	BGA	RECTANGULAR	网格排列		e1		锡银铜		BOTTOM	BALL	245		compliant	30		R-PBGA-B1156		OTHER		RFSOC					4
ID82C55A	AMD	数据表	170 In Stock	-	最小起订量: 1 最小包装量: 1	NO	40	24	70 °C	CERAMIC, METAL-SEALED COFIRED	DIP	RECTANGULAR	IN-LINE	5.5 V	4.5 V	5 V	Obsolete	ADVANCED MICRO DEVICES INC		DIP	HERMETIC SEALED, CERAMIC, DIP-40	2.5 MHz			EAR99		8542.39.00.01	DUAL	THROUGH-HOLE		2.54 mm	unknown		40	R-CDIP-T40	不合格	COMMERCIAL	3	PARALLEL IO PORT, GENERAL PURPOSE		5.715 mm	8			52.324 mm	15.24 mm
XCZU3EG-1LSFVA625I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	-40 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-625	4	100 °C		e1		锡银铜		BOTTOM	BALL		0.8 mm	compliant			S-PBGA-B625		INDUSTRIAL		PROGRAMMABLE SoC		3.43 mm		CAN, I2C, SPI, UART		21 mm	21 mm
XCZU7EV-2LFFVF1517E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1517	BGA	BGA1517,39X39,40	SQUARE	网格排列	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-1517	4	110 °C	PLASTIC/EPOXY		e1		锡银铜		BOTTOM	BALL		1 mm	compliant			S-PBGA-B1517		OTHER		PROGRAMMABLE SoC		3.51 mm		CAN, I2C, SPI, UART		40 mm	40 mm
XCZU7EV-2LFFVC1156E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1156	BGA	BGA1156,34X34,40	SQUARE	网格排列	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-1156	4	110 °C	PLASTIC/EPOXY		e1		锡银铜		BOTTOM	BALL		1 mm	compliant			S-PBGA-B1156		OTHER		PROGRAMMABLE SoC		3.51 mm		CAN, I2C, SPI, UART		35 mm	35 mm
XCZU3CG-1LSFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	-40 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-784	4	100 °C		e1		锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		INDUSTRIAL		PROGRAMMABLE SoC		3.32 mm		CAN, I2C, SPI, UART		23 mm	23 mm
XCZU7EG-1LFFVC1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1156	-40 °C	PLASTIC/EPOXY	BGA	BGA1156,34X34,40	SQUARE	网格排列	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-1156	4	100 °C		e1		锡银铜		BOTTOM	BALL		1 mm	compliant			S-PBGA-B1156		INDUSTRIAL		PROGRAMMABLE SoC		3.51 mm		CAN, I2C, SPI, UART		35 mm	35 mm
XCZU5EG-2LSFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	SQUARE	BGA784,28X28,32	FBGA	PLASTIC/EPOXY	110 °C	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-784	4	0.85 V	GRID ARRAY, FINE PITCH		e1		锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		OTHER		PROGRAMMABLE SoC		3.32 mm		CAN, I2C, SPI, UART		23 mm	23 mm
XCZU9CG-1LFFVC900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-900	4	100 °C		e1		锡银铜		BOTTOM	BALL		1 mm	compliant			S-PBGA-B900		INDUSTRIAL		PROGRAMMABLE SoC		3.42 mm		CAN, I2C, SPI, UART		31 mm	31 mm
XCZU7CG-1LFFVF1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1517	-40 °C	PLASTIC/EPOXY	BGA	BGA1517,39X39,40	SQUARE	网格排列	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-1517	4	100 °C		e1		锡银铜		BOTTOM	BALL		1 mm	compliant			S-PBGA-B1517		INDUSTRIAL		PROGRAMMABLE SoC		3.51 mm		CAN, I2C, SPI, UART		40 mm	40 mm
XCZU7CG-2LFBVB900E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-900	4	110 °C	PLASTIC/EPOXY		e1		锡银铜		BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B900		OTHER		PROGRAMMABLE SoC		2.88 mm		CAN, I2C, SPI, UART		31 mm	31 mm
XCZU2CG-2LSFVA625I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-625	100 °C	-40 °C	PLASTIC/EPOXY						BOTTOM	BALL		0.8 mm	compliant			S-PBGA-B625		INDUSTRIAL		PROGRAMMABLE SoC		3.43 mm		CAN, I2C, SPI, UART		21 mm	21 mm
XCZU17EG-1LFFVB1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1517	-40 °C	PLASTIC/EPOXY	BGA	BGA1517,39X39,40	SQUARE	网格排列	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-1517	4	100 °C		e1		锡银铜		BOTTOM	BALL		1 mm	compliant			S-PBGA-B1517		INDUSTRIAL		PROGRAMMABLE SoC		3.51 mm		CAN, I2C, SPI, UART		40 mm	40 mm
AM29811ADC	AMD	数据表	63 In Stock	-	最小起订量: 1 最小包装量: 1	NO	16	70 °C	CERAMIC, METAL-SEALED COFIRED	DIP	DIP16,.3	RECTANGULAR	IN-LINE	5.25 V	4.75 V	5 V	无	Obsolete		ADVANCED MICRO DEVICES INC	DIP	DIP, DIP16,.3		e0		Tin/Lead (Sn/Pb)	8542.31.00.01	DUAL	THROUGH-HOLE		2.54 mm	unknown		16	R-CDIP-T16	不合格	COMMERCIAL		微处理器电路	115 mA	5.08 mm				19.6215 mm	7.62 mm
XCZU7EG-3FBVB900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	PLASTIC/EPOXY	BGA	SQUARE	网格排列	0.9 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-900	4	100 °C	-40 °C		e1		锡银铜		BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B900		INDUSTRIAL		PROGRAMMABLE SoC		2.97 mm				31 mm	31 mm
XCZU6CG-1LFFVB1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1156	-40 °C	PLASTIC/EPOXY	BGA	BGA1156,34X34,40	SQUARE	网格排列	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-1156	4	100 °C		e1		锡银铜		BOTTOM	BALL		1 mm	compliant			S-PBGA-B1156		INDUSTRIAL		PROGRAMMABLE SoC		3.42 mm		CAN, I2C, SPI, UART		35 mm	35 mm
XCZU9CG-1SFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	100 °C	0.85 V	0.825 V	0.876 V	GRID ARRAY, FINE PITCH	SQUARE	BGA78428X28,32	FBGA	PLASTIC/EPOXY	有	活跃		ADVANCED MICRO DEVICES INC	BGA-784	4		e1		锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		OTHER		PROGRAMMABLE SoC		3.32 mm		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)		23 mm	23 mm
XCZU11EG-1LFFVC1760I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1760	-40 °C	PLASTIC/EPOXY	BGA	BGA1760,42X42,40	SQUARE	网格排列	0.85 V	有	活跃		ADVANCED MICRO DEVICES INC	FCBGA-1760	4	100 °C		e1		锡银铜		BOTTOM	BALL		1 mm	compliant			S-PBGA-B1760		INDUSTRIAL		PROGRAMMABLE SoC		3.71 mm		CAN, I2C, SPI, UART		42.5 mm	42.5 mm