品牌是'AMD' (1092)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 越来越多的功能 | 触点形状 | 外壳材料 | 供应商器件包装 | 介电材料 | 插入材料 | 厂商 | Voltage Rating AC | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | 零件状态 | 湿度敏感性等级(MSL) | 终端 | 连接器类型 | 类型 | 定位的数量 | 颜色 | 应用 | 电容量 | 紧固类型 | 触点类型 | 额定电流 | 电压 - 供电 | 方向 | 屏蔽/屏蔽 | 入口保护 | 外壳完成 | 引脚数量 | 外壳尺寸-插入 | 房屋颜色 | 输出类型 | 引线间距 | 注意 | 速度 | 内存大小 | 电缆长度 | 外壳尺寸,MIL | 配件类型 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 包括 | 波长 | 筛选水平 | 速度等级 | 主要属性 | 寄存器数量 | 闪光大小 | 接近检测 | 特征 | 座位高度(最大) | 触点表面处理厚度 - 配套 | 材料可燃性等级 | 评级结果 | ||||||||||||||||||
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![]() | XCZU2EG-1SFVA625E | AMD | 数据表 | 41 In Stock | - | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | 0.8500 V | 0.808 V | 180 | 0.892 V | 180 | Tray | AMD | XCZU2 | 活跃 | 103,320 | FCBGA | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 625 | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 扩展工业 | 1 | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 94,464 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU6CG-1FFVC900I | AMD | 数据表 | 710 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU6 | 活跃 | AMD | 0.85 V | 0.808 V | 0.892 V | 204 | Tray | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU6CG-2FFVB1156I | AMD | 数据表 | 830 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 0.808 V | 0.892 V | 328 | Bulk | XCZU6 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU15EG-1FFVC900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU15 | 活跃 | AMD | 0.8500 V | 0.808 V | 0.892 V | 204 | Tray | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EG-L1FFVF1517I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | PEI-Genesis | Bulk | 活跃 | 464 | XCZU7 | -40°C ~ 100°C (TJ) | * | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU48DR-1FSVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Knowles Syfer | Tape & Reel (TR) | 活跃 | 366 | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU46DR-L2FSVH1760I | AMD | 数据表 | 680 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 6-WDFN | 6-DFN (2x2) | ams欧司朗 | 574 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Obsolete | -30°C ~ 70°C | - | Ambient | 2.7V ~ 3.6V | SMBus | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 640nm | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EV-L2FFVC1156E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Free Hanging (In-Line) | 1156-BBGA, FCBGA | - | 铝合金 | 1156-FCBGA (35x35) | ITT Cannon, LLC | 50V | Bulk | Metal | CA310 | 活跃 | Silver | 360 | -55°C ~ 125°C | MIL-DTL-5015, CA | Crimp | Plug, Male Pins | 10 | 橄榄色 | Threaded | 22A | N (Normal) | - | IP65 - Dust Tight, Water Resistant | 橄榄色镉 | 18-19 | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | Shrink Boot Adapter | - | |||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU48DR-L1FSVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | PEI-Genesis | Bulk | 活跃 | 366 | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU46DR-2FSVH1760E | AMD | 数据表 | 586 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | -- | 574 | Tray | 活跃 | 0°C ~ 100°C (TJ) | -- | 活跃 | 533MHz, 1.333GHz | 256KB | -- | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5EG-3FBVB900E | AMD | 数据表 | 857 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU5 | 活跃 | 0°C ~ 100°C (TJ) | * | 活跃 | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XAZU3EG-1SBVA484Q | AMD | 数据表 | 504 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | 128 | Tray | XAZU3 | 活跃 | -40°C ~ 125°C (TJ) | * | 活跃 | 500MHz, 1.2GHz | 1.8MB | Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™ | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1502-2LSEVSVA2197 | AMD | 数据表 | 642 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 608 | Tray | 活跃 | Versal™ Prime | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1502-1LSEVFVC1760 | AMD | 数据表 | 915 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | Glenair | 零售包装 | 活跃 | 378 | 0°C ~ 100°C (TJ) | * | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU46DR-2FFVH1760E | AMD | 数据表 | 884 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 通孔 | Radial | 1760-FCBGA (42.5x42.5) | Polyester, Metallized | AMD | -- | 250V | 574 | Tray | 活跃 | 160V | -55°C ~ 105°C | Bulk | MKT369 | 0.492 L x 0.173 W (12.50mm x 4.40mm) | ±10% | 活跃 | -- | PC引脚 | 通用型 | 0.082µF | 0.394 (10.00mm) | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 长寿命 | 0.370 (9.40mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | XA7Z030-1FBG484I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Free Hanging (In-Line) | 484-BBGA, FCBGA | - | Circular | 锌压铸件 | 484-FCBGA (23x23) | Polyamide (PA66), Nylon 6/6 | Amphenol Sine Systems Corp | Bulk | MB1JJN | 1.0mm (5), 2.0mm (4) | 活跃 | 130 | -20°C ~ 130°C | MotionGrade™ M23 Power Standard Series, Threaded | 插座外壳 | 用于公引脚 | 9 (5 + 3 Power + PE) | Threaded | Crimp | Keyed | Shielded | IP67 - Dust Tight, Waterproof | Nickel | M23-9 | Silver | 不包括触点 | 667MHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Kintex™-7 FPGA, 125K Logic Cells | - | - | UL94 V-0 | |||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z030-2FBG676I | AMD | 数据表 | 2501 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | AMD | 130 | Tray | XC7Z030 | 活跃 | -40°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU9EG-2FFVC900E | AMD | 数据表 | 691 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU9 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | Black | 533MHz, 600MHz, 1.3GHz | 256KB | 762 mm | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU19EG-2FFVD1760I | AMD | 数据表 | 866 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | Non-Compliant | 308 | Tray | XCZU19 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-1LSEVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU46DR-2FSVH1760I | AMD | 数据表 | 964 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 574 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5CG-2SFVC784I | AMD | 数据表 | 960 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | Tray | XCZU5 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU49DR-L2FSVF1760I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 622 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVE1752-1MSIVSVA1596 | AMD | 数据表 | 630 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | AMD | 500 | Tray | 活跃 | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EG-1SFVC784I | AMD | 数据表 | 716 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | Tray | XCZU4 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - |
XCZU2EG-1SFVA625E
AMD
分类:Embedded - System On Chip (SoC)
XCZU6CG-1FFVC900I
AMD
分类:Embedded - System On Chip (SoC)
20,567.061880
XCZU6CG-2FFVB1156I
AMD
分类:Embedded - System On Chip (SoC)
27,023.819272
XCZU15EG-1FFVC900E
AMD
分类:Embedded - System On Chip (SoC)
XCZU7EG-L1FFVF1517I
AMD
分类:Embedded - System On Chip (SoC)
XCZU48DR-1FSVE1156I
AMD
分类:Embedded - System On Chip (SoC)
XCZU46DR-L2FSVH1760I
AMD
分类:Embedded - System On Chip (SoC)
262,146.531370
XCZU7EV-L2FFVC1156E
AMD
分类:Embedded - System On Chip (SoC)
XCZU48DR-L1FSVE1156I
AMD
分类:Embedded - System On Chip (SoC)
XCZU46DR-2FSVH1760E
AMD
分类:Embedded - System On Chip (SoC)
192,624.133887
XCZU5EG-3FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
31,578.733060
XAZU3EG-1SBVA484Q
AMD
分类:Embedded - System On Chip (SoC)
7,886.787473
XCVM1502-2LSEVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
67,202.779462
XCVM1502-1LSEVFVC1760
AMD
分类:Embedded - System On Chip (SoC)
49,854.256868
XCZU46DR-2FFVH1760E
AMD
分类:Embedded - System On Chip (SoC)
193,864.779737
XA7Z030-1FBG484I
AMD
分类:Embedded - System On Chip (SoC)
XC7Z030-2FBG676I
AMD
分类:Embedded - System On Chip (SoC)
2,711.944042
XCZU9EG-2FFVC900E
AMD
分类:Embedded - System On Chip (SoC)
31,253.965931
XCZU19EG-2FFVD1760I
AMD
分类:Embedded - System On Chip (SoC)
72,059.788074
XCVC1902-1LSEVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
XCZU46DR-2FSVH1760I
AMD
分类:Embedded - System On Chip (SoC)
249,139.998134
XCZU5CG-2SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
16,707.169963
XCZU49DR-L2FSVF1760I
AMD
分类:Embedded - System On Chip (SoC)
XCVE1752-1MSIVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
139,653.597667
XCZU4EG-1SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
9,914.485285
