品牌是'AMD' (1092)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

安装类型

包装/外壳

越来越多的功能

触点形状

外壳材料

供应商器件包装

介电材料

插入材料

厂商

Voltage Rating AC

操作温度

包装

系列

尺寸/尺寸

容差

零件状态

湿度敏感性等级(MSL)

终端

连接器类型

类型

定位的数量

颜色

应用

电容量

紧固类型

触点类型

额定电流

电压 - 供电

方向

屏蔽/屏蔽

入口保护

外壳完成

引脚数量

外壳尺寸-插入

房屋颜色

输出类型

引线间距

注意

速度

内存大小

电缆长度

外壳尺寸,MIL

配件类型

核心处理器

周边设备

连接方式

建筑学

包括

波长

筛选水平

速度等级

主要属性

寄存器数量

闪光大小

接近检测

特征

座位高度(最大)

触点表面处理厚度 - 配套

材料可燃性等级

评级结果

XCZU2EG-1SFVA625E
XCZU2EG-1SFVA625E
AMD 数据表

41 In Stock

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

0.8500 V

0.808 V

180

0.892 V

180

Tray

AMD

XCZU2

活跃

103,320

FCBGA

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

625

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

扩展工业

1

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

94,464

-

XCZU6CG-1FFVC900I
XCZU6CG-1FFVC900I
AMD 数据表

710 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

XCZU6

活跃

AMD

0.85 V

0.808 V

0.892 V

204

Tray

-40 to 100 °C

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

XCZU6CG-2FFVB1156I
XCZU6CG-2FFVB1156I
AMD 数据表

830 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

0.808 V

0.892 V

328

Bulk

XCZU6

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

XCZU15EG-1FFVC900E
XCZU15EG-1FFVC900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

XCZU15

活跃

AMD

0.8500 V

0.808 V

0.892 V

204

Tray

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

XCZU7EG-L1FFVF1517I
XCZU7EG-L1FFVF1517I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

PEI-Genesis

Bulk

活跃

464

XCZU7

-40°C ~ 100°C (TJ)

*

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU48DR-1FSVE1156I
XCZU48DR-1FSVE1156I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

Knowles Syfer

Tape & Reel (TR)

活跃

366

-40°C ~ 100°C (TJ)

*

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU46DR-L2FSVH1760I
XCZU46DR-L2FSVH1760I
AMD 数据表

680 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

6-WDFN

6-DFN (2x2)

ams欧司朗

574

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Obsolete

-30°C ~ 70°C

-

Ambient

2.7V ~ 3.6V

SMBus

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

640nm

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

无

XCZU7EV-L2FFVC1156E
XCZU7EV-L2FFVC1156E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Free Hanging (In-Line)

1156-BBGA, FCBGA

-

铝合金

1156-FCBGA (35x35)

ITT Cannon, LLC

50V

Bulk

Metal

CA310

活跃

Silver

360

-55°C ~ 125°C

MIL-DTL-5015, CA

Crimp

Plug, Male Pins

10

橄榄色

Threaded

22A

N (Normal)

-

IP65 - Dust Tight, Water Resistant

橄榄色镉

18-19

533MHz, 600MHz, 1.3GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

Shrink Boot Adapter

-

XCZU48DR-L1FSVE1156I
XCZU48DR-L1FSVE1156I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

PEI-Genesis

Bulk

活跃

366

-40°C ~ 100°C (TJ)

*

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU46DR-2FSVH1760E
XCZU46DR-2FSVH1760E
AMD 数据表

586 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

--

574

Tray

活跃

0°C ~ 100°C (TJ)

--

活跃

533MHz, 1.333GHz

256KB

--

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU5EG-3FBVB900E
XCZU5EG-3FBVB900E
AMD 数据表

857 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU5

活跃

0°C ~ 100°C (TJ)

*

活跃

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

XAZU3EG-1SBVA484Q
XAZU3EG-1SBVA484Q
AMD 数据表

504 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

128

Tray

XAZU3

活跃

-40°C ~ 125°C (TJ)

*

活跃

500MHz, 1.2GHz

1.8MB

Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™

DMA, WDT

CANbus, I²C, SPI, UART/USART, USB

MPU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

XCVM1502-2LSEVSVA2197
XCVM1502-2LSEVSVA2197
AMD 数据表

642 In Stock

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

608

Tray

活跃

Versal™ Prime

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1M Logic Cells

-

XCVM1502-1LSEVFVC1760
XCVM1502-1LSEVFVC1760
AMD 数据表

915 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

Glenair

零售包装

活跃

378

0°C ~ 100°C (TJ)

*

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1M Logic Cells

-

XCZU46DR-2FFVH1760E
XCZU46DR-2FFVH1760E
AMD 数据表

884 In Stock

-

最小起订量: 1

最小包装量: 1

通孔

Radial

1760-FCBGA (42.5x42.5)

Polyester, Metallized

AMD

--

250V

574

Tray

活跃

160V

-55°C ~ 105°C

Bulk

MKT369

0.492 L x 0.173 W (12.50mm x 4.40mm)

±10%

活跃

--

PC引脚

通用型

0.082µF

0.394 (10.00mm)

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

长寿命

0.370 (9.40mm)

--

XA7Z030-1FBG484I
XA7Z030-1FBG484I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Free Hanging (In-Line)

484-BBGA, FCBGA

-

Circular

锌压铸件

484-FCBGA (23x23)

Polyamide (PA66), Nylon 6/6

Amphenol Sine Systems Corp

Bulk

MB1JJN

1.0mm (5), 2.0mm (4)

活跃

130

-20°C ~ 130°C

MotionGrade™ M23 Power Standard Series, Threaded

插座外壳

用于公引脚

9 (5 + 3 Power + PE)

Threaded

Crimp

Keyed

Shielded

IP67 - Dust Tight, Waterproof

Nickel

M23-9

Silver

不包括触点

667MHz

256KB

-

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

Kintex™-7 FPGA, 125K Logic Cells

-

-

UL94 V-0

XC7Z030-2FBG676I
XC7Z030-2FBG676I
AMD 数据表

2501 In Stock

-

最小起订量: 1

最小包装量: 1

676-BBGA, FCBGA

676-FCBGA (27x27)

AMD

130

Tray

XC7Z030

活跃

-40°C ~ 100°C (TJ)

Zynq®-7000

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 125K Logic Cells

-

XCZU9EG-2FFVC900E
XCZU9EG-2FFVC900E
AMD 数据表

691 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU9

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

Black

533MHz, 600MHz, 1.3GHz

256KB

762 mm

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

XCZU19EG-2FFVD1760I
XCZU19EG-2FFVD1760I
AMD 数据表

866 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

Non-Compliant

308

Tray

XCZU19

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

XCVC1902-1LSEVSVD1760
XCVC1902-1LSEVSVD1760
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

692

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XCZU46DR-2FSVH1760I
XCZU46DR-2FSVH1760I
AMD 数据表

964 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

574

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU5CG-2SFVC784I
XCZU5CG-2SFVC784I
AMD 数据表

960 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

252

Tray

XCZU5

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

XCZU49DR-L2FSVF1760I
XCZU49DR-L2FSVF1760I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

622

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCVE1752-1MSIVSVA1596
XCVE1752-1MSIVSVA1596
AMD 数据表

630 In Stock

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

AMD

500

Tray

活跃

Versal™ AI Core

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

-

XCZU4EG-1SFVC784I
XCZU4EG-1SFVC784I
AMD 数据表

716 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

252

Tray

XCZU4

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-