品牌是'AMD' (1092)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 越来越多的功能 | 触点形状 | 外壳材料 | 供应商器件包装 | 材料 | 插入材料 | 电阻材料 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | 零件状态 | 湿度敏感性等级(MSL) | 温度系数 | 连接器类型 | 类型 | 定位的数量 | 颜色 | 功率(瓦特) | 紧固类型 | 触点类型 | 电压 - 供电 | 方向 | 屏蔽/屏蔽 | 入口保护 | 频率 | 频率稳定性 | 输出量 | 外壳完成 | 外壳尺寸-插入 | 终端样式 | 功能 | 基本谐振器 | 最大电流源 | 执行器类型 | 房屋颜色 | 电流 - 电源(禁用)(最大值) | 注意 | 速度 | 内存大小 | 外壳尺寸,MIL | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 套管螺纹 | 调整类型 | 转弯数量 | 包括 | 锥度 | 速度等级 | 内置开关 | 绝对牵引范围 (APR) | 执行器直径 | 主要属性 | 轮调 | 插座数量 | 电阻(欧姆) | 发光二极管 | 闪光大小 | 特征 | 座位高度(最大) | 长度 | 执行器长度 | 材料可燃性等级 | 评级结果 | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | XCZU17EG-2FFVC1760I | AMD | 数据表 | 899 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | -- | 512 | Tray | AMD | XCZU17 | 活跃 | -40°C ~ 100°C (TJ) | * | 活跃 | -- | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU19EG-1FFVB1517I | AMD | 数据表 | 917 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 面板安装 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | Carbon | -- | 644 | Tray | AMD | XCZU19 | 活跃 | -40°C ~ 100°C (TJ) | Bulk | RV4 | ±10% | 活跃 | -- | -- | 2W | 焊片 | Slotted | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3/8-32 | 用户定义 | 1 | Linear | None | 0.249 (6.32mm) | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | 314° | 1 | 100k | - | 0.875 (22.23mm) | ||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4CG-2FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | Nylon | -- | 204 | Tray | AMD | XCZU4 | 活跃 | 0°C ~ 100°C (TJ) | RL2 | 活跃 | -- | White | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 所有矩形LED | - | 0.330 (8.38mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-1MSENBVB1024 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | 316 | Tray | 活跃 | AMD | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-2LSENBVB1024 | AMD | 数据表 | 741 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | 316 | Tray | 活跃 | AMD | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-2LLEVFVC1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | 748 | Tray | 活跃 | AMD | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-1LSIVFVC1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | 532 | Tray | 活跃 | AMD | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-2MLIVSVD1760 | AMD | 数据表 | 639 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | 748 | Tray | 活跃 | AMD | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-1MSIVSVA2197 | AMD | 数据表 | 703 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | 770 | Tray | 活跃 | AMD | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-2HSIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | 726 | Tray | 活跃 | AMD | -40°C ~ 100°C (TJ) | Versal™ Prime | 800MHz, 1.65GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7CG-1FFVF1517I | AMD | 数据表 | 764 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 1517-FCBGA (40x40) | 464 | Tray | XCZU7 | AMD | 活跃 | -40°C ~ 85°C | Tape & Reel (TR) | SiT8208 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | 活跃 | XO (Standard) | 1.8V | 25.000625MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 31mA | 30mA | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | -- | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | 0.039 (1.00mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EG-2FFVF1517I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 1517-FCBGA (40x40) | 464 | Tray | XCZU7 | AMD | 活跃 | -40°C ~ 85°C | Tape & Reel (TR) | SiT8208 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | 活跃 | XO (Standard) | 2.5V | 24MHz | ±10ppm | LVCMOS, LVTTL | Standby (Power Down) | MEMS | 33mA | 70µA | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | 0.039 (1.00mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5EV-L2SFVC784E | AMD | 数据表 | 965 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 784-FCBGA (23x23) | 252 | Tray | XCZU5 | AMD | 活跃 | -40°C ~ 85°C | Tape & Reel (TR) | SiT8208 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | 活跃 | XO (Standard) | 2.8V | 24MHz | ±10ppm | LVCMOS, LVTTL | Standby (Power Down) | MEMS | 33mA | 70µA | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2L | -- | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | 0.039 (1.00mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU17EG-1FFVB1517E | AMD | 数据表 | 755 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 1517-FCBGA (40x40) | 644 | Tray | XCZU17 | AMD | 活跃 | -40°C ~ 85°C | Tape & Reel (TR) | SiT8209 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | 活跃 | XO (Standard) | 1.8V | 133.3333MHz | ±10ppm | LVCMOS, LVTTL | Standby (Power Down) | MEMS | 33mA | 10µA | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | -- | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | 0.032 (0.80mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3EG-L1SBVA484I | AMD | 数据表 | 761 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 6-SMD, No Lead | 484-FCBGA (19x19) | 82 | Tray | XCZU3 | AMD | 活跃 | -20°C ~ 70°C | Tape & Reel (TR) | SiT9120 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | 活跃 | XO (Standard) | 3.3V | 166.6MHz | ±10ppm | LVDS | Enable/Disable | MEMS | 55mA | 35mA | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | 0.032 (0.80mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU11EG-1FFVC1760I | AMD | 数据表 | 610 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 1760-FCBGA (42.5x42.5) | 512 | Tray | XCZU11 | AMD | 活跃 | -20°C ~ 70°C | Tape & Reel (TR) | SiT8208 | 0.106 L x 0.094 W (2.70mm x 2.40mm) | 活跃 | XO (Standard) | 1.8V | 33.33333MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 31mA | 30mA | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | 0.032 (0.80mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU2CG-2SFVC784I | AMD | 数据表 | 2909 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 面板安装 | 784-BFBGA, FCBGA | Flange | Circular | Aluminum | 784-FCBGA (23x23) | - | Bulk | TVP00RW | 20 | Amphenol Aerospace Operations | 活跃 | 252 | -65°C ~ 175°C | MIL-DTL-38999 Series III, Tri-Start™ TV | 插座外壳 | 用于公引脚 | 41 | Threaded | Crimp | A | Shielded | 抗环境干扰 | Cadmium | 21-41 | 橄榄色 | 不包括触点 | 533MHz, 1.3GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 2 | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | ||||||||||||||||||||||||||||||||||||||
![]() | XCVE1752-2MLEVSVA2197 | AMD | 数据表 | 973 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | 608 | Tray | 活跃 | AMD | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU17EG-3FFVD1760E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | 308 | Tray | XCZU17 | AMD | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4CG-1SFVC784I | AMD | 数据表 | 934 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | 252 | Tray | XCZU4 | AMD | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU17EG-1FFVD1760E | AMD | 数据表 | 506 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | 308 | Tray | 活跃 | AMD | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU17EG-L1FFVB1517I | AMD | 数据表 | 515 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | 644 | Tray | XCZU17 | AMD | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1L | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EG-L2FBVB900E | AMD | 数据表 | 876 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | 204 | Tray | XCZU4 | AMD | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2L | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-1LSENBVB1024 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | 316 | Tray | 活跃 | AMD | 0°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU57DR-L1FSVE1156I | AMD | 数据表 | 620 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | - | Tray | 活跃 | AMD | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC DR | 500MHz, 1.2GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq® UltraScale+™ RFSoC | - |
XCZU17EG-2FFVC1760I
AMD
分类:Embedded - System On Chip (SoC)
59,054.738439
XCZU19EG-1FFVB1517I
AMD
分类:Embedded - System On Chip (SoC)
42,042.775432
XCZU4CG-2FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
XCVM1302-1MSENBVB1024
AMD
分类:Embedded - System On Chip (SoC)
XCVM1302-2LSENBVB1024
AMD
分类:Embedded - System On Chip (SoC)
30,922.071328
XCVM1402-2LLEVFVC1596
AMD
分类:Embedded - System On Chip (SoC)
XCVM1302-1LSIVFVC1596
AMD
分类:Embedded - System On Chip (SoC)
XCVM1402-2MLIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
78,914.324356
XCVM1802-1MSIVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
71,836.058981
XCVM1402-2HSIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
XCZU7CG-1FFVF1517I
AMD
分类:Embedded - System On Chip (SoC)
23,501.598230
XCZU7EG-2FFVF1517I
AMD
分类:Embedded - System On Chip (SoC)
XCZU5EV-L2SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
18,300.406729
XCZU17EG-1FFVB1517E
AMD
分类:Embedded - System On Chip (SoC)
34,535.978538
XCZU3EG-L1SBVA484I
AMD
分类:Embedded - System On Chip (SoC)
4,591.821363
XCZU11EG-1FFVC1760I
AMD
分类:Embedded - System On Chip (SoC)
45,592.926835
XCZU2CG-2SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
3,762.472848
XCVE1752-2MLEVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
162,081.097127
XCZU17EG-3FFVD1760E
AMD
分类:Embedded - System On Chip (SoC)
XCZU4CG-1SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
7,655.775012
XCZU17EG-1FFVD1760E
AMD
分类:Embedded - System On Chip (SoC)
40,634.822209
XCZU17EG-L1FFVB1517I
AMD
分类:Embedded - System On Chip (SoC)
42,866.274974
XCZU4EG-L2FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
16,993.625071
XCVM1302-1LSENBVB1024
AMD
分类:Embedded - System On Chip (SoC)
XCZU57DR-L1FSVE1156I
AMD
分类:Embedded - System On Chip (SoC)
132,722.807462
