品牌是'AMD' (1092)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

安装类型

包装/外壳

越来越多的功能

触点形状

外壳材料

供应商器件包装

材料

插入材料

电阻材料

厂商

操作温度

包装

系列

尺寸/尺寸

容差

零件状态

湿度敏感性等级(MSL)

温度系数

连接器类型

类型

定位的数量

颜色

功率(瓦特)

紧固类型

触点类型

电压 - 供电

方向

屏蔽/屏蔽

入口保护

频率

频率稳定性

输出量

外壳完成

外壳尺寸-插入

终端样式

功能

基本谐振器

最大电流源

执行器类型

房屋颜色

电流 - 电源(禁用)(最大值)

注意

速度

内存大小

外壳尺寸,MIL

核心处理器

周边设备

连接方式

建筑学

套管螺纹

调整类型

转弯数量

包括

锥度

速度等级

内置开关

绝对牵引范围 (APR)

执行器直径

主要属性

轮调

插座数量

电阻(欧姆)

发光二极管

闪光大小

特征

座位高度(最大)

长度

执行器长度

材料可燃性等级

评级结果

XCZU17EG-2FFVC1760I
XCZU17EG-2FFVC1760I
AMD 数据表

719 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

--

512

Tray

AMD

XCZU17

活跃

-40°C ~ 100°C (TJ)

*

活跃

--

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 926K+ Logic Cells

-

XCZU19EG-1FFVB1517I
XCZU19EG-1FFVB1517I
AMD 数据表

676 In Stock

-

最小起订量: 1

最小包装量: 1

面板安装

1517-BBGA, FCBGA

1517-FCBGA (40x40)

Carbon

--

644

Tray

AMD

XCZU19

活跃

-40°C ~ 100°C (TJ)

Bulk

RV4

±10%

活跃

--

--

2W

焊片

Slotted

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3/8-32

用户定义

1

Linear

None

0.249 (6.32mm)

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

314°

1

100k

-

0.875 (22.23mm)

XCZU4CG-2FBVB900E
XCZU4CG-2FBVB900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

Nylon

--

204

Tray

AMD

XCZU4

活跃

0°C ~ 100°C (TJ)

RL2

活跃

--

White

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

所有矩形LED

-

0.330 (8.38mm)

XCVM1302-1MSENBVB1024
XCVM1302-1MSENBVB1024
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1024-BFBGA

1024-BGA (31x31)

316

Tray

活跃

AMD

0°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.3GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCVM1302-2LSENBVB1024
XCVM1302-2LSENBVB1024
AMD 数据表

578 In Stock

-

最小起订量: 1

最小包装量: 1

1024-BFBGA

1024-BGA (31x31)

316

Tray

活跃

AMD

0°C ~ 100°C (TJ)

Versal™ Prime

450MHz, 1.08GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCVM1402-2LLEVFVC1596
XCVM1402-2LLEVFVC1596
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

748

Tray

活跃

AMD

0°C ~ 100°C (TJ)

Versal™ Prime

450MHz, 1.08GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCVM1302-1LSIVFVC1596
XCVM1302-1LSIVFVC1596
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

532

Tray

活跃

AMD

-40°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCVM1402-2MLIVSVD1760
XCVM1402-2MLIVSVD1760
AMD 数据表

990 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

748

Tray

活跃

AMD

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCVM1802-1MSIVSVA2197
XCVM1802-1MSIVSVA2197
AMD 数据表

927 In Stock

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

770

Tray

活跃

AMD

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCVM1402-2HSIVSVD1760
XCVM1402-2HSIVSVD1760
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

726

Tray

活跃

AMD

-40°C ~ 100°C (TJ)

Versal™ Prime

800MHz, 1.65GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCZU7CG-1FFVF1517I
XCZU7CG-1FFVF1517I
AMD 数据表

688 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

1517-FCBGA (40x40)

464

Tray

XCZU7

AMD

活跃

-40°C ~ 85°C

Tape & Reel (TR)

SiT8208

0.276 L x 0.197 W (7.00mm x 5.00mm)

活跃

XO (Standard)

1.8V

25.000625MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

31mA

30mA

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

--

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

0.039 (1.00mm)

--

XCZU7EG-2FFVF1517I
XCZU7EG-2FFVF1517I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

1517-FCBGA (40x40)

464

Tray

XCZU7

AMD

活跃

-40°C ~ 85°C

Tape & Reel (TR)

SiT8208

0.276 L x 0.197 W (7.00mm x 5.00mm)

活跃

XO (Standard)

2.5V

24MHz

±10ppm

LVCMOS, LVTTL

Standby (Power Down)

MEMS

33mA

70µA

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

--

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

0.039 (1.00mm)

--

XCZU5EV-L2SFVC784E
XCZU5EV-L2SFVC784E
AMD 数据表

705 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

784-FCBGA (23x23)

252

Tray

XCZU5

AMD

活跃

-40°C ~ 85°C

Tape & Reel (TR)

SiT8208

0.276 L x 0.197 W (7.00mm x 5.00mm)

活跃

XO (Standard)

2.8V

24MHz

±10ppm

LVCMOS, LVTTL

Standby (Power Down)

MEMS

33mA

70µA

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2L

--

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

0.039 (1.00mm)

--

XCZU17EG-1FFVB1517E
XCZU17EG-1FFVB1517E
AMD 数据表

953 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

1517-FCBGA (40x40)

644

Tray

XCZU17

AMD

活跃

-40°C ~ 85°C

Tape & Reel (TR)

SiT8209

0.197 L x 0.126 W (5.00mm x 3.20mm)

活跃

XO (Standard)

1.8V

133.3333MHz

±10ppm

LVCMOS, LVTTL

Standby (Power Down)

MEMS

33mA

10µA

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

--

Zynq®UltraScale+™ FPGA, 926K+ Logic Cells

-

0.032 (0.80mm)

--

XCZU3EG-L1SBVA484I
XCZU3EG-L1SBVA484I
AMD 数据表

659 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

6-SMD, No Lead

484-FCBGA (19x19)

82

Tray

XCZU3

AMD

活跃

-20°C ~ 70°C

Tape & Reel (TR)

SiT9120

0.197 L x 0.126 W (5.00mm x 3.20mm)

活跃

XO (Standard)

3.3V

166.6MHz

±10ppm

LVDS

Enable/Disable

MEMS

55mA

35mA

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

--

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

0.032 (0.80mm)

--

XCZU11EG-1FFVC1760I
XCZU11EG-1FFVC1760I
AMD 数据表

949 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

1760-FCBGA (42.5x42.5)

512

Tray

XCZU11

AMD

活跃

-20°C ~ 70°C

Tape & Reel (TR)

SiT8208

0.106 L x 0.094 W (2.70mm x 2.40mm)

活跃

XO (Standard)

1.8V

33.33333MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

31mA

30mA

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

--

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

0.032 (0.80mm)

--

XCZU2CG-2SFVC784I
XCZU2CG-2SFVC784I
AMD 数据表

2045 In Stock

-

最小起订量: 1

最小包装量: 1

面板安装

784-BFBGA, FCBGA

Flange

Circular

Aluminum

784-FCBGA (23x23)

-

Bulk

TVP00RW

20

Amphenol Aerospace Operations

活跃

252

-65°C ~ 175°C

MIL-DTL-38999 Series III, Tri-Start™ TV

插座外壳

用于公引脚

41

Threaded

Crimp

A

Shielded

抗环境干扰

Cadmium

21-41

橄榄色

不包括触点

533MHz, 1.3GHz

256KB

-

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

2

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

-

-

XCVE1752-2MLEVSVA2197
XCVE1752-2MLEVSVA2197
AMD 数据表

844 In Stock

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

608

Tray

活跃

AMD

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

-

XCZU17EG-3FFVD1760E
XCZU17EG-3FFVD1760E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

308

Tray

XCZU17

AMD

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 926K+ Logic Cells

-

XCZU4CG-1SFVC784I
XCZU4CG-1SFVC784I
AMD 数据表

734 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

252

Tray

XCZU4

AMD

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

XCZU17EG-1FFVD1760E
XCZU17EG-1FFVD1760E
AMD 数据表

744 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

308

Tray

活跃

AMD

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 926K+ Logic Cells

-

XCZU17EG-L1FFVB1517I
XCZU17EG-L1FFVB1517I
AMD 数据表

919 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

644

Tray

XCZU17

AMD

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1L

Zynq®UltraScale+™ FPGA, 926K+ Logic Cells

-

XCZU4EG-L2FBVB900E
XCZU4EG-L2FBVB900E
AMD 数据表

890 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

204

Tray

XCZU4

AMD

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2L

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

XCVM1302-1LSENBVB1024
XCVM1302-1LSENBVB1024
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1024-BFBGA

1024-BGA (31x31)

316

Tray

活跃

AMD

0°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCZU57DR-L1FSVE1156I
XCZU57DR-L1FSVE1156I
AMD 数据表

778 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

-

Tray

活跃

AMD

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC DR

500MHz, 1.2GHz

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq® UltraScale+™ RFSoC

-