品牌是'AMD' (1092)

对比

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产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

底架

安装类型

包装/外壳

越来越多的功能

外壳材料

供应商器件包装

材料

质量

形状

厂商

操作温度

系列

尺寸/尺寸

容差

零件状态

终端

温度系数

连接器类型

类型

电阻

定位的数量

颜色

应用

电容量

紧固类型

额定功率

额定电流

电压 - 供电

方向

屏蔽/屏蔽

入口保护

电阻器类型

外壳完成

引脚数量

外壳尺寸-插入

输出类型

工作电源电压

引线间距

镀层

附着方法

速度

内存大小

外壳尺寸,MIL

引线样式

配件类型

核心处理器

周边设备

连接方式

建筑学

数据总线宽度

波长

筛选水平

速度等级

电阻公差

主要属性

寄存器数量

闪光大小

接近检测

特征

产品长度

产品宽度

设备核心

高度

座位高度(最大)

长度

宽度

厚度(最大)

电镀厚度

触点表面处理厚度 - 配套

评级结果

XCVM1302-2MSINSVF1369
XCVM1302-2MSINSVF1369
AMD 数据表

753 In Stock

-

最小起订量: 1

最小包装量: 1

1369-BFBGA

1369-BGA (35x35)

AMD

Tray

活跃

316

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCVM1302-1MLINBVB1024
XCVM1302-1MLINBVB1024
AMD 数据表

905 In Stock

-

最小起订量: 1

最小包装量: 1

1024-BFBGA

1024-BGA (31x31)

AMD

Tray

活跃

316

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.3GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XA7Z020-1CLG400I
XA7Z020-1CLG400I
AMD 数据表

2596 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA, CSPBGA

400-CSPBGA (17x17)

AMD

130

Tray

XA7Z020

活跃

-40°C ~ 100°C (TJ)

Automotive, AEC-Q100, Zynq®-7000 XA

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 85K Logic Cells

-

XC7Z015-1CL485I
XC7Z015-1CL485I
AMD 数据表

2280 In Stock

-

最小起订量: 1

最小包装量: 1

484-LFBGA, CSPBGA

484-CSPBGA (19x19)

AMD

130

Bulk

XC7Z015

活跃

-40°C ~ 100°C (TJ)

Zynq®-7000

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 74K Logic Cells

-

XCZU9CG-1FFVC900E
XCZU9CG-1FFVC900E
AMD 数据表

604 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU9

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

XCZU4CG-L2SFVC784E
XCZU4CG-L2SFVC784E
AMD 数据表

659 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

252

Tray

XCZU4

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2L

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

XCZU46DR-L2FSVH1760I
XCZU46DR-L2FSVH1760I
AMD 数据表

680 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

6-WDFN

6-DFN (2x2)

ams欧司朗

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Obsolete

574

-30°C ~ 70°C

-

Ambient

2.7V ~ 3.6V

SMBus

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

640nm

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

无

XCZU7EV-L2FFVC1156E
XCZU7EV-L2FFVC1156E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Free Hanging (In-Line)

1156-BBGA, FCBGA

-

铝合金

1156-FCBGA (35x35)

ITT Cannon, LLC

50V

Bulk

Metal

CA310

活跃

Silver

360

-55°C ~ 125°C

MIL-DTL-5015, CA

Crimp

Plug, Male Pins

10

橄榄色

Threaded

22A

N (Normal)

-

IP65 - Dust Tight, Water Resistant

橄榄色镉

18-19

533MHz, 600MHz, 1.3GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

Shrink Boot Adapter

-

XCZU48DR-L1FSVE1156I
XCZU48DR-L1FSVE1156I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

PEI-Genesis

活跃

366

Bulk

-40°C ~ 100°C (TJ)

*

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU46DR-2FSVH1760E
XCZU46DR-2FSVH1760E
AMD 数据表

586 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

--

574

Tray

活跃

0°C ~ 100°C (TJ)

--

活跃

533MHz, 1.333GHz

256KB

--

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU5EG-3FBVB900E
XCZU5EG-3FBVB900E
AMD 数据表

857 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU5

活跃

0°C ~ 100°C (TJ)

*

活跃

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

XAZU3EG-1SBVA484Q
XAZU3EG-1SBVA484Q
AMD 数据表

504 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

128

Tray

XAZU3

活跃

-40°C ~ 125°C (TJ)

*

活跃

500MHz, 1.2GHz

1.8MB

Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™

DMA, WDT

CANbus, I²C, SPI, UART/USART, USB

MPU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

XC7Z007S-1CLG225I
XC7Z007S-1CLG225I
AMD 数据表

80 In Stock

-

最小起订量: 1

最小包装量: 1

225-LFBGA, CSPBGA

225-CSPBGA (13x13)

铍铜

--

AMD

活跃

54

Tray

XC7Z007

121°C

插槽安装

活跃

Fingerstock

Zinc + Clear Chromate

Slot

667MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 23K Logic Cells

-

0.130 (3.30mm)

0.975 (24.77mm)

0.370 (9.40mm)

299.21µin (7.60µm)

XCVM1502-2LSEVSVA2197
XCVM1502-2LSEVSVA2197
AMD 数据表

642 In Stock

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

Tray

活跃

608

Versal™ Prime

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1M Logic Cells

-

XCVM1502-1LSEVFVC1760
XCVM1502-1LSEVFVC1760
AMD 数据表

915 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

Glenair

活跃

378

零售包装

0°C ~ 100°C (TJ)

*

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1M Logic Cells

-

XCZU7EG-3FBVB900E
XCZU7EG-3FBVB900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU7

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU47DR-1FSVE1156I
XCZU47DR-1FSVE1156I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

Tray

活跃

366

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCVC1702-1MSIVSVA1596
XCVC1702-1MSIVSVA1596
AMD 数据表

529 In Stock

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

AMD

500

Tray

活跃

Versal™ AI Core

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1M Logic Cells

-

XCZU7EG-2FFVC1156I
XCZU7EG-2FFVC1156I
AMD 数据表

959 In Stock

-

最小起订量: 1

最小包装量: 1

External

1156-BBGA, FCBGA

1156-FCBGA (35x35)

100 g

Rectangular

AMD

XCZU7

活跃

Compliant

360

Tray

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

55 mm

44 mm

XCVM1502-1LLINFVB1369
XCVM1502-1LLINFVB1369
AMD 数据表

810 In Stock

-

最小起订量: 1

最小包装量: 1

Surface Mount, MLCC

0508 (1220 Metric)

KYOCERA AVX

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

25V

478

-55°C ~ 125°C

IDC, W

0.050 L x 0.080 W (1.27mm x 2.03mm)

±20%

X7R

Bypass, Decoupling

0.047 µF

-

400MHz, 1GHz

256KB

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1M Logic Cells

-

Low ESL (Multi-Terminal)

-

0.022 (0.55mm)

-

XCVP1802-2MLELSVC4072
XCVP1802-2MLELSVC4072
AMD 数据表

518 In Stock

-

最小起订量: 1

最小包装量: 1

AMD

780

Tray

活跃

0°C ~ 100°C (TJ)

Versal® Premium

-

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

-

XCZU7EG-1FBVB900I
XCZU7EG-1FBVB900I
AMD 数据表

785 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU7

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XC7Z030-2FBG484I
XC7Z030-2FBG484I
AMD 数据表

2226 In Stock

-

最小起订量: 1

最小包装量: 1

484-BBGA, FCBGA

484-FCBGA (23x23)

130

Tray

XC7Z030

AMD

活跃

Thumb-2

1.2, 3.3 V

FCBGA

2

表面贴装

-40 to 100 °C

Zynq®-7000

200 ppm/K

20 Ohm

0.2 W

Pulse Proof, High Power

484

5.5, 3 V

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32 Bit

5

Kintex™-7 FPGA, 125K Logic Cells

-

ARM Cortex A9

XC7Z045-L2FFG900I
XC7Z045-L2FFG900I
AMD 数据表

811 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

1.0000 V

0.95 V

362

1.05 V

表面贴装

130

AMD

Tray

XC7Z045

活跃

Industrial grade

350,000

FCBGA

-40 to 100 °C

Zynq®-7000

200 ppm/K

1 MOhm

0.25 W

通用型

900

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

2L

5

Kintex™-7 FPGA, 350K Logic Cells

437,200

-

3.2

1.6

XC7Z035-1FBG676C
XC7Z035-1FBG676C
AMD 数据表

839 In Stock

-

最小起订量: 1

最小包装量: 1

676-BBGA, FCBGA

676-FCBGA (27x27)

表面贴装

130

Tray

XC7Z035

AMD

活跃

Commercial grade

275,000

FCBGA

1.0000 V

130

0 to 85 °C

Zynq®-7000

50.0000 ppm/°C

825 Ohm

0.5 W

Industrial

676

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Commercial

1

1

Kintex™-7 FPGA, 275K Logic Cells

343,800

-

6.1