品牌是'AMD' (1092)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 底架 | 安装类型 | 包装/外壳 | 越来越多的功能 | 外壳材料 | 供应商器件包装 | 材料 | 质量 | 形状 | 厂商 | 操作温度 | 系列 | 尺寸/尺寸 | 容差 | 零件状态 | 终端 | 温度系数 | 连接器类型 | 类型 | 电阻 | 定位的数量 | 颜色 | 应用 | 电容量 | 紧固类型 | 额定功率 | 额定电流 | 电压 - 供电 | 方向 | 屏蔽/屏蔽 | 入口保护 | 电阻器类型 | 外壳完成 | 引脚数量 | 外壳尺寸-插入 | 输出类型 | 工作电源电压 | 引线间距 | 镀层 | 附着方法 | 速度 | 内存大小 | 外壳尺寸,MIL | 引线样式 | 配件类型 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 数据总线宽度 | 波长 | 筛选水平 | 速度等级 | 电阻公差 | 主要属性 | 寄存器数量 | 闪光大小 | 接近检测 | 特征 | 产品长度 | 产品宽度 | 设备核心 | 高度 | 座位高度(最大) | 长度 | 宽度 | 厚度(最大) | 电镀厚度 | 触点表面处理厚度 - 配套 | 评级结果 | |||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | XCVM1302-2MSINSVF1369 | AMD | 数据表 | 753 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | Tray | 活跃 | 316 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-1MLINBVB1024 | AMD | 数据表 | 905 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | Tray | 活跃 | 316 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XA7Z020-1CLG400I | AMD | 数据表 | 2596 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | AMD | 130 | Tray | XA7Z020 | 活跃 | -40°C ~ 100°C (TJ) | Automotive, AEC-Q100, Zynq®-7000 XA | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 85K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z015-1CL485I | AMD | 数据表 | 2280 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) | AMD | 130 | Bulk | XC7Z015 | 活跃 | -40°C ~ 100°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 74K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU9CG-1FFVC900E | AMD | 数据表 | 604 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU9 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4CG-L2SFVC784E | AMD | 数据表 | 659 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | Tray | XCZU4 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2L | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU46DR-L2FSVH1760I | AMD | 数据表 | 680 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 6-WDFN | 6-DFN (2x2) | ams欧司朗 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Obsolete | 574 | -30°C ~ 70°C | - | Ambient | 2.7V ~ 3.6V | SMBus | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 640nm | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EV-L2FFVC1156E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Free Hanging (In-Line) | 1156-BBGA, FCBGA | - | 铝合金 | 1156-FCBGA (35x35) | ITT Cannon, LLC | 50V | Bulk | Metal | CA310 | 活跃 | Silver | 360 | -55°C ~ 125°C | MIL-DTL-5015, CA | Crimp | Plug, Male Pins | 10 | 橄榄色 | Threaded | 22A | N (Normal) | - | IP65 - Dust Tight, Water Resistant | 橄榄色镉 | 18-19 | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | Shrink Boot Adapter | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU48DR-L1FSVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | PEI-Genesis | 活跃 | 366 | Bulk | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU46DR-2FSVH1760E | AMD | 数据表 | 586 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | -- | 574 | Tray | 活跃 | 0°C ~ 100°C (TJ) | -- | 活跃 | 533MHz, 1.333GHz | 256KB | -- | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5EG-3FBVB900E | AMD | 数据表 | 857 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU5 | 活跃 | 0°C ~ 100°C (TJ) | * | 活跃 | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XAZU3EG-1SBVA484Q | AMD | 数据表 | 504 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | 128 | Tray | XAZU3 | 活跃 | -40°C ~ 125°C (TJ) | * | 活跃 | 500MHz, 1.2GHz | 1.8MB | Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™ | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z007S-1CLG225I | AMD | 数据表 | 80 In Stock | - | 最小起订量: 1 最小包装量: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | 铍铜 | -- | AMD | 活跃 | 54 | Tray | XC7Z007 | 121°C | 插槽安装 | 活跃 | Fingerstock | Zinc + Clear Chromate | Slot | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 23K Logic Cells | - | 0.130 (3.30mm) | 0.975 (24.77mm) | 0.370 (9.40mm) | 299.21µin (7.60µm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1502-2LSEVSVA2197 | AMD | 数据表 | 642 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | Tray | 活跃 | 608 | Versal™ Prime | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1502-1LSEVFVC1760 | AMD | 数据表 | 915 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | Glenair | 活跃 | 378 | 零售包装 | 0°C ~ 100°C (TJ) | * | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EG-3FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU7 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU47DR-1FSVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | Tray | 活跃 | 366 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1702-1MSIVSVA1596 | AMD | 数据表 | 529 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | AMD | 500 | Tray | 活跃 | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EG-2FFVC1156I | AMD | 数据表 | 959 In Stock |
- | 最小起订量: 1 最小包装量: 1 | External | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | 100 g | Rectangular | AMD | XCZU7 | 活跃 | Compliant | 360 | Tray | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | 55 mm | 44 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1502-1LLINFVB1369 | AMD | 数据表 | 810 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Surface Mount, MLCC | 0508 (1220 Metric) | KYOCERA AVX | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 活跃 | 25V | 478 | -55°C ~ 125°C | IDC, W | 0.050 L x 0.080 W (1.27mm x 2.03mm) | ±20% | X7R | Bypass, Decoupling | 0.047 µF | - | 400MHz, 1GHz | 256KB | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | Low ESL (Multi-Terminal) | - | 0.022 (0.55mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVP1802-2MLELSVC4072 | AMD | 数据表 | 518 In Stock |
- | 最小起订量: 1 最小包装量: 1 | AMD | 780 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal® Premium | - | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EG-1FBVB900I | AMD | 数据表 | 785 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU7 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z030-2FBG484I | AMD | 数据表 | 2226 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BBGA, FCBGA | 484-FCBGA (23x23) | 130 | Tray | XC7Z030 | AMD | 活跃 | Thumb-2 | 1.2, 3.3 V | FCBGA | 2 | 表面贴装 | -40 to 100 °C | Zynq®-7000 | 200 ppm/K | 20 Ohm | 0.2 W | Pulse Proof, High Power | 484 | 5.5, 3 V | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | 5 | Kintex™-7 FPGA, 125K Logic Cells | - | ARM Cortex A9 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z045-L2FFG900I | AMD | 数据表 | 811 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | 1.0000 V | 0.95 V | 362 | 1.05 V | 表面贴装 | 130 | AMD | Tray | XC7Z045 | 活跃 | Industrial grade | 350,000 | FCBGA | -40 to 100 °C | Zynq®-7000 | 200 ppm/K | 1 MOhm | 0.25 W | 通用型 | 900 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 2L | 5 | Kintex™-7 FPGA, 350K Logic Cells | 437,200 | - | 3.2 | 1.6 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z035-1FBG676C | AMD | 数据表 | 839 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | 表面贴装 | 130 | Tray | XC7Z035 | AMD | 活跃 | Commercial grade | 275,000 | FCBGA | 1.0000 V | 130 | 0 to 85 °C | Zynq®-7000 | 50.0000 ppm/°C | 825 Ohm | 0.5 W | Industrial | 676 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Commercial | 1 | 1 | Kintex™-7 FPGA, 275K Logic Cells | 343,800 | - | 6.1 |
XCVM1302-2MSINSVF1369
AMD
分类:Embedded - System On Chip (SoC)
37,599.719988
XCVM1302-1MLINBVB1024
AMD
分类:Embedded - System On Chip (SoC)
34,746.793598
XA7Z020-1CLG400I
AMD
分类:Embedded - System On Chip (SoC)
1,014.349233
XC7Z015-1CL485I
AMD
分类:Embedded - System On Chip (SoC)
1,582.498909
XCZU9CG-1FFVC900E
AMD
分类:Embedded - System On Chip (SoC)
18,375.009168
XCZU4CG-L2SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
9,809.611574
XCZU46DR-L2FSVH1760I
AMD
分类:Embedded - System On Chip (SoC)
262,146.531370
XCZU7EV-L2FFVC1156E
AMD
分类:Embedded - System On Chip (SoC)
XCZU48DR-L1FSVE1156I
AMD
分类:Embedded - System On Chip (SoC)
XCZU46DR-2FSVH1760E
AMD
分类:Embedded - System On Chip (SoC)
192,624.133887
XCZU5EG-3FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
31,578.733060
XAZU3EG-1SBVA484Q
AMD
分类:Embedded - System On Chip (SoC)
7,886.787473
XC7Z007S-1CLG225I
AMD
分类:Embedded - System On Chip (SoC)
XCVM1502-2LSEVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
67,202.779462
XCVM1502-1LSEVFVC1760
AMD
分类:Embedded - System On Chip (SoC)
49,854.256868
XCZU7EG-3FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
XCZU47DR-1FSVE1156I
AMD
分类:Embedded - System On Chip (SoC)
XCVC1702-1MSIVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
143,855.079419
XCZU7EG-2FFVC1156I
AMD
分类:Embedded - System On Chip (SoC)
30,897.153546
XCVM1502-1LLINFVB1369
AMD
分类:Embedded - System On Chip (SoC)
81,403.835303
XCVP1802-2MLELSVC4072
AMD
分类:Embedded - System On Chip (SoC)
497,599.550022
XCZU7EG-1FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
21,740.064497
XC7Z030-2FBG484I
AMD
分类:Embedded - System On Chip (SoC)
2,460.950348
XC7Z045-L2FFG900I
AMD
分类:Embedded - System On Chip (SoC)
24,221.123811
XC7Z035-1FBG676C
AMD
分类:Embedded - System On Chip (SoC)
9,555.757394
