品牌是'AMD' (1092)

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包装/外壳

供应商器件包装

厂商

操作温度

系列

性别

引脚数量

工作电源电压

速度

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核心处理器

周边设备

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速度等级

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寄存器数量

闪光大小

产品长度

设备核心

XCZU7EV-L1FFVF1517I
XCZU7EV-L1FFVF1517I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

Glenair

464

XCZU7

零售包装

活跃

-40°C ~ 100°C (TJ)

*

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU7CG-L2FFVC1156E
XCZU7CG-L2FFVC1156E
AMD 数据表

616 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

KYOCERA AVX

360

XCZU7

Tape & Reel (TR)

活跃

0°C ~ 100°C (TJ)

*

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2L

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU4EG-3FBVB900E
XCZU4EG-3FBVB900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

PEI-Genesis

204

XCZU4

Bulk

活跃

0°C ~ 100°C (TJ)

*

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

XCZU7CG-L2FFVF1517E
XCZU7CG-L2FFVF1517E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

XCZU7

活跃

464

Tray

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2L

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU7EG-L1FFVF1517I
XCZU7EG-L1FFVF1517I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

PEI-Genesis

464

XCZU7

Bulk

活跃

-40°C ~ 100°C (TJ)

*

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU48DR-1FSVE1156I
XCZU48DR-1FSVE1156I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

Knowles Syfer

Tape & Reel (TR)

活跃

366

-40°C ~ 100°C (TJ)

*

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCVC1502-2MLENSVG1369
XCVC1502-2MLENSVG1369
AMD 数据表

984 In Stock

-

最小起订量: 1

最小包装量: 1

AMD

Tray

活跃

*

XCZU4EV-3SFVC784E
XCZU4EV-3SFVC784E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

XCZU4

活跃

252

Tray

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EV

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

XCZU11EG-L2FFVB1517E
XCZU11EG-L2FFVB1517E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

XCZU11

活跃

488

Tray

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

XC7Z100-1FF900I
XC7Z100-1FF900I
AMD 数据表

810 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

2

CAN/I2C/SPI/UART

AMD

130

Tray

XC7Z100

活跃

Straight

Solder

法兰安装

RISC

1.5, 2, 2.5 V

FBGA

-40 to 100 °C

Zynq®-7000

Plug

900

1, 1.8 V

667MHz

256 KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32 Bit

Kintex™-7 FPGA, 444K Logic Cells

-

86.1 mm

ARM Cortex A9

XA7Z010-1CLG400I
XA7Z010-1CLG400I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

400-LFBGA, CSPBGA

400-CSPBGA (17x17)

AMD

RISC

1.8, 3.3 V

CSBGA

1

CAN/GPIO/SPI/UART

表面贴装

130

Tray

活跃

-40 to 100 °C

Automotive, AEC-Q100, Zynq®-7000 XA

400

1 V

667MHz

256 KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32 Bit

Artix™-7 FPGA, 28K Logic Cells

-

ARM Cortex A9

XC7Z035-1FFG900I
XC7Z035-1FFG900I
AMD 数据表

783 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

表面贴装

130

AMD

Tray

XC7Z035

活跃

Industrial grade

275,000

FCBGA

1.0000 V

0.95 V

362

1.05 V

-40 to 100 °C

Zynq®-7000

900

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

1

Kintex™-7 FPGA, 275K Logic Cells

343,800

-

XC7Z030-1FBG484C
XC7Z030-1FBG484C
AMD 数据表

58 In Stock

-

最小起订量: 1

最小包装量: 1

484-BBGA, FCBGA

484-FCBGA (23x23)

AMD

XC7Z030

活跃

130

Tray

0°C ~ 85°C (TJ)

Zynq®-7000

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 125K Logic Cells

-

XCZU11EG-2FFVF1517I
XCZU11EG-2FFVF1517I
AMD 数据表

627 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

XCZU11

活跃

464

Tray

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

XCVC1902-2LLEVSVD1760
XCVC1902-2LLEVSVD1760
AMD 数据表

790 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

692

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XCVC1702-2MSIVSVA2197
XCVC1702-2MSIVSVA2197
AMD 数据表

740 In Stock

-

最小起订量: 1

最小包装量: 1

AMD

Tray

活跃

*

XCVM1502-1LSEVSVA2197
XCVM1502-1LSEVSVA2197
AMD 数据表

556 In Stock

-

最小起订量: 1

最小包装量: 1

AMD

Tray

活跃

*

XC7Z045-2FBG676CES
XC7Z045-2FBG676CES
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

676-BBGA, FCBGA

676-FCBGA (27x27)

AMD

XC7Z045

Obsolete

130

Tray

0°C ~ 85°C (TJ)

Zynq®-7000

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 350K Logic Cells

-

XC7Z045-2FBG676E
XC7Z045-2FBG676E
AMD 数据表

21 In Stock

-

最小起订量: 1

最小包装量: 1

676-BBGA, FCBGA

676-FCBGA (27x27)

AMD

Tray

活跃

XC7Z045

130

0°C ~ 100°C (TJ)

Zynq®-7000

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 350K Logic Cells

-

XCZU19EG-2FFVC1760I
XCZU19EG-2FFVC1760I
AMD 数据表

1760 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

Tray

活跃

XCZU19

512

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

XCVE1752-2MSIVSVA1596
XCVE1752-2MSIVSVA1596
AMD 数据表

880 In Stock

-

最小起订量: 1

最小包装量: 1

AMD

Tray

活跃

*

XCZU5CG-1FBVB900I
XCZU5CG-1FBVB900I
AMD 数据表

635 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

Tray

活跃

XCZU5

204

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

XC7Z045-1FFG900I
XC7Z045-1FFG900I
AMD 数据表

822 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

Thumb-2

1.2, 3.3 V

FCBGA

2

表面贴装

130

Tray

XC7Z045

活跃

-40 to 100 °C

Zynq®-7000

900

1 V

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32 Bit

Kintex™-7 FPGA, 350K Logic Cells

-

ARM Cortex A9

XC7Z030-2FB484I
XC7Z030-2FB484I
AMD 数据表

2887 In Stock

-

最小起订量: 1

最小包装量: 1

484-BBGA, FCBGA

484-FCBGA (23x23)

AMD

RISC

1.2, 3.3 V

FCBGA

1

表面贴装

130

Tray

XC7Z030

活跃

-40 to 100 °C

Zynq®-7000

484

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32 Bit

Kintex™-7 FPGA, 125K Logic Cells

-

ARM Cortex A9

XC7Z035-2FFG676E
XC7Z035-2FFG676E
AMD 数据表

621 In Stock

-

最小起订量: 1

最小包装量: 1

676-BBGA, FCBGA

676-FCBGA (27x27)

130

AMD

Tray

XC7Z035

活跃

0.95 V

250

1.05 V

表面贴装

275,000

FCBGA

1.0000 V

0 to 100 °C

Zynq®-7000

676

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

扩展工业

2

Kintex™-7 FPGA, 275K Logic Cells

343,800

-