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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 越来越多的功能 | 触点形状 | 外壳材料 | 供应商器件包装 | 房屋材料 | 插入材料 | 本体材质 | 后壳材料，电镀 | 触点材料 - 电镀 | 厂商 | 操作温度 | 包装 | 系列 | 零件状态 | 终端 | 连接器类型 | 类型 | 定位的数量 | 颜色 | 应用 | 性别 | 紧固类型 | 触点类型 | 额定电流 | 方向 | 屏蔽/屏蔽 | 入口保护 | 绝缘颜色 | 外壳完成 | 引脚数量 | 外壳尺寸-插入 | 房屋颜色 | 工作电源电压 | 注意 | 界面 | 速度 | 内存大小 | 外壳尺寸，MIL | 核心处理器 | 周边设备 | 程序存储器类型 | 连接方式 | 电缆开口 | 建筑学 | 数据总线宽度 | 螺纹尺寸 | 定位/联系数 | 包括 | 内部开关 | 筛选水平 | 主要属性 | 以太网 | USB | 本体颜色 | 面板孔尺寸 | 业界认可的配合直径 | 实际直径 | 信号线 | 闪光大小 | 配套长度/深度 | SPI,SPI | CAN | 特征 | 设备核心 | 触点表面处理厚度 - 配套 | 材料可燃性等级 | |||||||||||||||||||||||||||||||||||||||||
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 | XCVC1502-1MSIVSVA1596 | AMD | 数据表 | 931 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | AMD | 活跃 | 478 | Tray | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU15EG-2FFVC900E | AMD | 数据表 | 645 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | XCZU15 | 活跃 | 204 | Tray | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU5CG-1SFVC784I | AMD | 数据表 | 898 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | XCZU5 | 活跃 | 252 | Tray | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU2CG-1SFVA625I | AMD | 数据表 | 2982 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | XCZU2 | 活跃 | 180 | Tray | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z015-1CLG485I | AMD | 数据表 | 91 In Stock | - | 最小起订量: 1 最小包装量: 1 | 485-LFBGA, CSPBGA | 485-CSPBGA (19x19) | AMD | XC7Z015 | 活跃 | 130 | Tray | -40°C ~ 100°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 74K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z035-3FBG676E | AMD | 数据表 | 795 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | AMD | XC7Z035 | 活跃 | 130 | Tray | 0°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 275K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1802-2LLIVSVD1760 | AMD | 数据表 | 876 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | AMD | 500 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVE1752-2MSEVSVA1596 | AMD | 数据表 | 802 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | AMD | 活跃 | 500 | Tray | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVE1752-2MSENSVG1369 | AMD | 数据表 | 857 In Stock |
- | 最小起订量: 1 最小包装量: 1 | AMD | 500 | Tray | 活跃 | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1702-1LLIVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 608 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU11EG-2FFVC1156E | AMD | 数据表 | 725 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | XCZU11 | 活跃 | 360 | Tray | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVE1752-2MSINSVG1369 | AMD | 数据表 | 514 In Stock |
- | 最小起订量: 1 最小包装量: 1 | AMD | 500 | Tray | 活跃 | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z007S-2CLG400E | AMD | 数据表 | 15 In Stock | - | 最小起订量: 1 最小包装量: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | AMD | XC7Z007 | 活跃 | 100 | Tray | 0°C ~ 100°C (TJ) | Zynq®-7000 | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 23K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU3CG-1SFVC784I | AMD | 数据表 | 40 In Stock | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | Bulk | 252 | 活跃 | XCZU3 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AU1500-400MBD | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Au1500 | 400 | Microprocessor | Ethernet/UART/USB | 0 | 0 | 2 | 16KB | 16KB | 0 | 1 | 无 | 10Mbps/100Mbps | 表面贴装 | 17 | 17 | 399 | BGA | BGA | Ball | Compliant | 5A991.b | 8542.31.00.01 | 无 | 无 | Obsolete | System-On-Chip | 399 | ROMLess | 2 | 1 | 0 | 0 | MIPS32 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU65DR-2FFVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 面板安装 | Bulkhead - Front Side Nut | Composite | Thermoplastic | - | Amphenol Aerospace Operations | Composite | CTVS07RF | 活跃 | Copper Alloy | Gold | - | Bulk | -65°C ~ 200°C | MIL-DTL-38999 Series III, Tri-Start™ TV | Crimp | Receptacle, Male Pins | 5 | Silver | Aviation, Marine, Military | Threaded | - | B | Shielded | 抗环境干扰 | 化学镍 | 11-5 | - | - | - | 50.0µin (1.27µm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU65DR-1FSVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | EDAC Inc. | Bulk | 活跃 | * | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU43DR-L2FSVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | PEI-Genesis | Bulk | 活跃 | 366 | -40°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU43DR-2FSVG1517E | AMD | 数据表 | 702 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 面板安装 | 1517-BBGA, FCBGA | Flange | Circular | Aluminum | 1517-FCBGA (40x40) | - | Amphenol Aerospace Operations | Bulk | TVP00RW | 22D | 活跃 | 561 | -65°C ~ 175°C | MIL-DTL-38999 Series III, Tri-Start™ TV | 插座外壳 | 用于内螺纹插座 | 66 | Threaded | Crimp | C | Shielded | 抗环境干扰 | Cadmium | 19-35 | 橄榄色 | 不包括触点 | 533MHz, 1.333GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-1FFVG1517I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | CAN/Serial I2C/SPI/UART/USB | 有 | 表面贴装 | 561 | Tray | 活跃 | Industrial grade | RISC | 1.8, 2.5, 3.3 V | 6 | -40 to 100 °C | Zynq® UltraScale+™ RFSoC | 2, 15 V | CAN/Serial I2C/SPI/U | 500MHz, 1.2GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 64 Bit | Industrial | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-L2FSVG1517I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 561 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU49DR-2FSVF1760E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 622 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-2FFVE1156I | AMD | 数据表 | 664 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 通孔 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | -- | Copper Alloy | Tin | AMD | 表面贴装 | 366 | Tray | 活跃 | Industrial grade | -- | Copper Alloy | -- | RISC | 1.8, 2.5, 3.3 V | CAN/Serial I2C/SPI/UART/USB | 有 | -20°C ~ 65°C | Bulk | -- | Obsolete | Solder | Phono (RCA) Jack | Female | Unshielded | Black | 3.4, 5.5 V | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | -- | MCU, FPGA | 64 Bit | -- | 2 Conductors, 2 Contacts | -- | 不含开关 | Industrial | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | Silver | -- | 3.20mm ID, 9.00mm OD (RCA) | -- | Mono | - | -- | 安装硬件 | ARM Cortex-A53/ARM Cortex-R5 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU43DR-1FSVE1156I | AMD | 数据表 | 610 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU49DR-1FFVF1760I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | CAN/Serial I2C/SPI/UART/USB | 有 | 表面贴装 | 622 | Tray | 活跃 | Industrial grade | RISC | 1.8/2.5/3.3 V | FCBGA | -40 to 100 °C | Zynq® UltraScale+™ RFSoC | 1760 | 0.85 V | CAN/Serial I2C/SPI/U | 500MHz, 1.2GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 64 Bit | Industrial | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ARM Cortex-A53/ARM Cortex-A5 |
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XCVC1502-1MSIVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
134,967.064969
-
XCZU15EG-2FFVC900E
AMD
分类:Embedded - System On Chip (SoC)
37,907.590703
-
XCZU5CG-1SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
12,227.998758
-
XCZU2CG-1SFVA625I
AMD
分类:Embedded - System On Chip (SoC)
2,563.255569
-
XC7Z015-1CLG485I
AMD
分类:Embedded - System On Chip (SoC)
-
XC7Z035-3FBG676E
AMD
分类:Embedded - System On Chip (SoC)
14,060.165623
-
XCVM1802-2LLIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
126,354.519812
-
XCVE1752-2MSEVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
141,824.226969
-
XCVE1752-2MSENSVG1369
AMD
分类:Embedded - System On Chip (SoC)
135,062.073456
-
XCVC1702-1LLIVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU11EG-2FFVC1156E
AMD
分类:Embedded - System On Chip (SoC)
41,111.354498
-
XCVE1752-2MSINSVG1369
AMD
分类:Embedded - System On Chip (SoC)
169,889.399478
-
XC7Z007S-2CLG400E
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU3CG-1SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
-
AU1500-400MBD
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU65DR-2FFVE1156I
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU65DR-1FSVE1156I
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU43DR-L2FSVE1156I
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU43DR-2FSVG1517E
AMD
分类:Embedded - System On Chip (SoC)
183,189.864599
-
XCZU48DR-1FFVG1517I
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU48DR-L2FSVG1517I
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU49DR-2FSVF1760E
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU48DR-2FFVE1156I
AMD
分类:Embedded - System On Chip (SoC)
204,963.300592
-
XCZU43DR-1FSVE1156I
AMD
分类:Embedded - System On Chip (SoC)
126,572.767232
-
XCZU49DR-1FFVF1760I
AMD
分类:Embedded - System On Chip (SoC)