品牌是'AMD' (1092)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

触点镀层

安装类型

包装/外壳

越来越多的功能

触点形状

外壳材料

供应商器件包装

插入材料

厂商

操作温度

系列

温度系数

连接器类型

类型

电阻

定位的数量

紧固类型

额定功率

触点类型

螺距

方向

屏蔽/屏蔽

入口保护

电阻器类型

外壳完成

引脚数量

外壳尺寸-插入

触点性别

房屋颜色

工作电源电压

注意

界面

速度

内存大小

外壳尺寸,MIL

核心处理器

周边设备

连接方式

建筑学

数据总线宽度

包括

筛选水平

速度等级

电阻公差

主要属性

寄存器数量

闪光大小

特征

产品长度

产品宽度

设备核心

材料可燃性等级

XCZU9CG-2FFVB1156I
XCZU9CG-2FFVB1156I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

活跃

328

Tray

XCZU9

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

XCZU2CG-2SBVA484I
XCZU2CG-2SBVA484I
AMD 数据表

2664 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

活跃

82

Tray

XCZU2

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

XC7Z010-L1CLG225I
XC7Z010-L1CLG225I
AMD 数据表

2871 In Stock

-

最小起订量: 1

最小包装量: 1

225-LFBGA, CSPBGA

225-CSPBGA (13x13)

Tray

XC7Z010

活跃

AMD

RISC

1.2, 3.3 V

CSBGA

2

CAN/I2C/SPI/UART/USB

表面贴装

86

-40 to 100 °C

Zynq®-7000

100.0000 ppm/°C

1.21 kOhm

1.0000 W

High Reliability, MIL-PRF-39017

225

3.3 V

667MHz

256 KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32 Bit

1

Artix™-7 FPGA, 28K Logic Cells

-

15.87

ARM Cortex A9

XC7Z015-2CL485I
XC7Z015-2CL485I
AMD 数据表

2510 In Stock

-

最小起订量: 1

最小包装量: 1

Gold

484-LFBGA, CSPBGA

484-CSPBGA (19x19)

Thermoplastic

磷青铜

表面贴装

74,000

CSBGA

1.0000 V

0.95 V

130

1.05 V

130

AMD

Bulk

XC7Z015

活跃

Industrial grade

Straight

Solder

-20 to 85 °C

Zynq®-7000

1.0000 mm

485

Socket

Black

766MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

2

Artix™-7 FPGA, 74K Logic Cells

92,400

-

19.7 mm

XC7Z035-1FFG676I
XC7Z035-1FFG676I
AMD 数据表

896 In Stock

-

最小起订量: 1

最小包装量: 1

676-BBGA, FCBGA

676-FCBGA (27x27)

0.95 V

130

1.05 V

表面贴装

130

Tray

XC7Z035

活跃

AMD

Industrial grade

AEC-Q200

275,000

FCBGA

1.0000 V

-40 to 100 °C

Zynq®-7000

100 ppm/K

64.9 kOhm

0.5 W

通用型

676

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

1

1

Kintex™-7 FPGA, 275K Logic Cells

343,800

-

3.2 mm

2.5 mm

XCVC1502-2MLIVSVA1596
XCVC1502-2MLIVSVA1596
AMD 数据表

712 In Stock

-

最小起订量: 1

最小包装量: 1

面板安装

1596-BFBGA, FCBGA

Flange

Circular

Composite

-

Amphenol Aerospace Operations

22D (97), 8 Twinax (2)

活跃

478

Bulk

CTVPS00RF

-65°C ~ 200°C

MIL-DTL-38999 Series III, Tri-Start™ TV

插座外壳

用于公引脚

99 (97 + 2 Twinax)

Threaded

Crimp

D

Shielded

抗环境干扰

化学镍

25-7

Silver

不包括触点

600MHz, 1.4GHz

256KB

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

-

Versal™ AI Core FPGA, 800k Logic Cells

-

-

-

XCZU3CG-2UBVA530E
XCZU3CG-2UBVA530E
AMD 数据表

2515 In Stock

-

最小起订量: 1

最小包装量: 1

530-WFBGA, FCBGA

530-FCBGA (16x9.5)

AMD

82

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

XAZU1EG-L1SFVA625I
XAZU1EG-L1SFVA625I
AMD 数据表

2054 In Stock

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

180

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq®UltraScale+™ FPGA, 82K Logic Cells

-

XCVM1802-1LSEVFVC1760
XCVM1802-1LSEVFVC1760
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

500

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCVM1802-2MLIVFVC1760
XCVM1802-2MLIVFVC1760
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

500

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCVM1402-1LSEVFVC1596
XCVM1402-1LSEVFVC1596
AMD 数据表

623 In Stock

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

AMD

748

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCZU47DR-1FFVE1156E
XCZU47DR-1FFVE1156E
AMD 数据表

843 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

366

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU43DR-2FFVG1517I
XCZU43DR-2FFVG1517I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

Tray

活跃

Industrial grade

AMD

RISC

1.8/2.5/3.3 V

FCBGA

6

表面贴装

561

-40 to 100 °C

Zynq® UltraScale+™ RFSoC

1517

3.3 V

CAN/Serial I2C/SPI/U

533MHz, 1.333GHz

256 KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

64 Bit

Industrial

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

ARM Cortex-A53/ARM Cortex-R5

XCZU47DR-2FFVE1156E
XCZU47DR-2FFVE1156E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

366

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCVM1302-2LLENBVB1024
XCVM1302-2LLENBVB1024
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1024-BFBGA

1024-BGA (31x31)

AMD

316

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ Prime

450MHz, 1.08GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCZU65DR-L2FSVE1156I
XCZU65DR-L2FSVE1156I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

XCVC1802-2HSIVSVD1760
XCVC1802-2HSIVSVD1760
AMD 数据表

751 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

726

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ AI Core

800MHz, 1.65GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

XCVE1752-2LLENSVG1369
XCVE1752-2LLENSVG1369
AMD 数据表

823 In Stock

-

最小起订量: 1

最小包装量: 1

1369-BFBGA

1369-BGA (35x35)

AMD

500

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

450MHz, 1.08GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1M Logic Cells

-

XCZU2EG-L1UBVA530I
XCZU2EG-L1UBVA530I
AMD 数据表

2718 In Stock

-

最小起订量: 1

最小包装量: 1

530-WFBGA, FCBGA

530-FCBGA (16x9.5)

AMD

82

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

XCVM1402-2MLINSVF1369
XCVM1402-2MLINSVF1369
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1369-BFBGA

1369-BGA (35x35)

AMD

424

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCVE1752-2LSEVSVA2197
XCVE1752-2LSEVSVA2197
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

608

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

450MHz, 1.08GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1M Logic Cells

-

XCZU1EG-L2UBVA494E
XCZU1EG-L2UBVA494E
AMD 数据表

2076 In Stock

-

最小起订量: 1

最小包装量: 1

494-WFBGA, FCBGA

494-FCBGA (14x14)

AMD

82

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

MPU, FPGA

Zynq®UltraScale+™ FPGA, 81K+ Logic Cells

-

XCVM1802-2MLIVSVA2197
XCVM1802-2MLIVSVA2197
AMD 数据表

925 In Stock

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

770

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCVC1802-2MLIVSVA2197
XCVC1802-2MLIVSVA2197
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

770

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

XCVC1902-2MLIVSVA2197
XCVC1902-2MLIVSVA2197
AMD 数据表

967 In Stock

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

770

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-