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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 底架 | 安装类型 | 包装/外壳 | 越来越多的功能 | 引脚数 | 外壳材料 | 供应商器件包装 | 材料 | 介电材料 | 质量 | 插入材料 | 后壳材料，电镀 | 包装数量 | 厂商 | Voltage Rating AC | 操作温度 | 系列 | 尺寸/尺寸 | 容差 | 终端 | 连接器类型 | 类型 | 电阻 | 定位的数量 | 最高工作温度 | 最小工作温度 | 颜色 | 应用 | 功率(瓦特) | 电容量 | 紧固类型 | 额定电流 | 电压 - 供电 | 方向 | 屏蔽/屏蔽 | 入口保护 | 频率 | 频率稳定性 | 输出量 | 外壳完成 | 引脚数量 | 外壳尺寸-插入 | 终端样式 | 功能 | 基本谐振器 | 最大电流源 | 输出的数量 | 审批机构 | 效率 | 电压-隔离度 | 电压 - 输入（最大值） | 工作电源电压 | 电压 - 输入（最小值） | ESR（等效串联电阻） | 引线间距 | 界面 | 最大电源电压 | 振荡器类型 | 最大输出电流 | 速度 | 内存大小 | 外壳尺寸，MIL | 电压 - 供电 (Vcc/Vdd) | 核心处理器 | 照明 | 周边设备 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 扩频带宽 | 连接方式 | 电缆开口 | 电压 - 输出 | 拓扑 | 建筑学 | 数据总线宽度 | EEPROM 大小 | 筛选水平 | 总高度 | 速度等级 | 绝对牵引范围 (APR) | 调光 | 主要属性 | 寄存器数量 | 完成 | 闪光大小 | 特征 | 设备核心 | 粘合剂类型 | 座位高度(最大) | 触点表面处理厚度 - 配套 | 面板厚度 | 材料可燃性等级 | 达到SVHC | 评级结果 | |||||||||||||||||||||||||||
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 | XCZU5EG-L2SFVC784E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | Tray | XCZU5 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU4CG-2FBVB900I | AMD | 数据表 | 878 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | 0.892 V | 204 | Tray | XCZU4 | 活跃 | Industrial grade | AMD | 192,150 | FCBGA | 0.8500 V | 0.808 V | 204 | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 900 | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 2 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 175,680 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU7EG-L2FBVB900E | AMD | 数据表 | 738 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU7 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU7EG-L1FFVC1156I | AMD | 数据表 | 971 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 360 | Tray | XCZU7 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU4EV-1FBVB900I | AMD | 数据表 | 11 In Stock | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 0.8500 V | 0.808 V | 0.892 V | 204 | Tray | XCZU4 | 活跃 | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XAZU2EG-L1SFVC784I | AMD | 数据表 | 2322 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 128 | Tray | XAZU2 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 1.2GHz | 1.2MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU2CG-1SFVC784I | AMD | 数据表 | 50 In Stock | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | Tray | XCZU2 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU3CG-1SBVA484E | AMD | 数据表 | 2152 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | 82 | Tray | XCZU3 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1302-2MLENBVB1024 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | Non-Compliant | 316 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z007S-2CLG400I | AMD | 数据表 | 90 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | AMD | 1.0000 V | 0.95 V | 1.05 V | 100 | Tray | XC7Z007 | 活跃 | -40 to 100 °C | Zynq®-7000 | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Artix™-7 FPGA, 23K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XAZU3EG-1SFVA625Q | AMD | 数据表 | 967 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | 0.8500 V | 0.808 V | 0.892 V | 128 | Tray | XAZU3 | 活跃 | -40 to 125 °C | Zynq® UltraScale+™ MPSoC EG | 625 | 500MHz, 1.2GHz | 1.8MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU47DR-2FSVE1156E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-BQFP | 100-QFP (14x20) | Infineon Technologies | Discontinued at Digi-Key | A/D 8x8/10b | MB90F546 | Tray | 81 | -40°C ~ 105°C (TA) | F²MC-16LX MB90545G | External | 16MHz | 8K x 8 | 4.5V ~ 5.5V | F²MC-16LX | POR, WDT | FLASH | 16-Bit | 256KB (256K x 8) | CANbus, EBI/EMI, SCI, Serial I/O, UART/USART | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU46DR-1FSVH1760I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Free Hanging (In-Line) | 1760-BBGA, FCBGA | - | 铝合金 | 1760-FCBGA (42.5x42.5) | Rubber | - | 6 | JTAG | 有 | 574 | Industrial grade | ITT Cannon, LLC | 500VAC, 700VDC | Bulk | Metal | FRCIR | 活跃 | Copper Alloy | Gold | RISC | -40°C ~ 125°C | CIR | Crimp | Plug, Male Pins | 35 | Black | Aerospace, Medical, Military | 卡口锁 | 13A | W | Shielded | 环境防护 | 黑色阳极氧化 | 1760 | 28-15 | 0.85 V | JTAG | 500MHz, 1.2GHz | 38 Mb | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 0.610 ~ 0.937 (15.49mm ~ 23.80mm) | MCU, FPGA | 32 Bit | Industrial | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Backshell, Cable Clamp, Coupling Nut, Flame Retardant | Arm Cortex A53/Arm Cortex R5 | - | Flame Retardant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-2FFVE1156E | AMD | 数据表 | 623 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | PEI-Genesis | Bulk | 活跃 | 366 | 0°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-L2FFVE1156I | AMD | 数据表 | 966 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 底座安装 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | 1.7 lbs (771.1 g) | Advanced Energy | LXV76 | Obsolete | 366 | Box | -35°C ~ 70°C | LXV76 (76W) | 6.97 L x 2.66 W x 1.46 H (177.0mm x 67.5mm x 37.0mm) | 恒压 | 76 W | 电线引线 | 1 | CE, cULus, EN | 89% | 3 kV | 305VAC | 90VAC | 1.81A | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 42V | 交流直流转换器 | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | OTP, OVP, SCP | IP67 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU43DR-1FSVG1517E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | Radial - 4 Leads | 1517-FCBGA (40x40) | Polypropylene (PP), Metallized | Vishay Beyschlag/Draloric/BC Components | 活跃 | 800V | 561 | - | Tray | -40°C ~ 85°C | MKP1848H DC-Link | 1.654 L x 1.181 W (42.00mm x 30.00mm) | ±5% | PC引脚 | Automotive; DC Link, DC Filtering | 20 µF | 4.6 mOhms | 1.476 (37.50mm) | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 85C/85% Humidity; Low ESR, Low ESL | 1.791 (45.50mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-1FFVE1156E | AMD | 数据表 | 597 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 1156-FCBGA (35x35) | SiTime | Strip | 活跃 | RISC | 6 | 有 | 366 | -20°C ~ 70°C | SiT1602B | 0.197 L x 0.126 W (5.00mm x 3.20mm) | XO (Standard) | 1.8V | 74.176 MHz | ±20ppm | HCMOS, LVCMOS | 1156 | Enable/Disable | MEMS | 4.1mA | 0.85 V | JTAG | 500MHz, 1.2GHz | 38 Mb | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | - | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Extended | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Arm Cortex A53/Arm Cortex R5 | 0.031 (0.80mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU43DR-2FFVG1517E | AMD | 数据表 | 831 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 561 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-2FSVG1517E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 561 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU46DR-1FSVH1760E | AMD | 数据表 | 592 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 通孔 | 1760-BBGA, FCBGA | 2 | 1760-FCBGA (42.5x42.5) | AMD | Compliant | RISC | 有 | 574 | Tray | 活跃 | 0 to 100 °C | Zynq® UltraScale+™ RFSoC | 120 Ω | 165 °C | -40 °C | 1760 | 30 V | JTAG | 30 V | 500MHz, 1.2GHz | 38 Mb | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Extended | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Arm Cortex A53/Arm Cortex R5 | Unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU43DR-L2FFVG1517I | AMD | 数据表 | 828 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 561 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU4CG-L1SFVC784I | AMD | 数据表 | 34 In Stock | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | Tray | XCZU4 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU47DR-L1FFVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | 热塑橡胶 | 4000 | AMD | 135 °C | -40 °C | 12.5 mm | 366 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 孔扣眼 | Black | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 6.4 mm | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 1.6 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU46DR-1FFVH1760I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 574 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-L1FFVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Corner Holes | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Vinyl | AMD | US | EAR99 | 366 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | Green/Red on White | 通用型 | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 不发光 | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | Gloss | - | Repositionable Acrylic |
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XCZU5EG-L2SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
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XCZU4CG-2FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
15,162.023718
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XCZU7EG-L2FBVB900E
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分类:Embedded - System On Chip (SoC)
31,865.340628
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XCZU7EG-L1FFVC1156I
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分类:Embedded - System On Chip (SoC)
30,951.317925
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XCZU4EV-1FBVB900I
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XAZU2EG-L1SFVC784I
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分类:Embedded - System On Chip (SoC)
3,709.140162
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XCZU2CG-1SFVC784I
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XCZU3CG-1SBVA484E
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3,198.259771
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XCVM1302-2MLENBVB1024
AMD
分类:Embedded - System On Chip (SoC)
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XC7Z007S-2CLG400I
AMD
分类:Embedded - System On Chip (SoC)
603.145377
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XAZU3EG-1SFVA625Q
AMD
分类:Embedded - System On Chip (SoC)
7,433.211160
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XCZU47DR-2FSVE1156E
AMD
分类:Embedded - System On Chip (SoC)
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XCZU46DR-1FSVH1760I
AMD
分类:Embedded - System On Chip (SoC)
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XCZU48DR-2FFVE1156E
AMD
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179,758.511849
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XCZU48DR-L2FFVE1156I
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分类:Embedded - System On Chip (SoC)
243,965.384822
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XCZU43DR-1FSVG1517E
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XCZU48DR-1FFVE1156E
AMD
分类:Embedded - System On Chip (SoC)
128,397.797891
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XCZU43DR-2FFVG1517E
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XCZU48DR-2FSVG1517E
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XCZU46DR-1FSVH1760E
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156,606.781668
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XCZU43DR-L2FFVG1517I
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248,399.565833
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XCZU4CG-L1SFVC784I
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分类:Embedded - System On Chip (SoC)
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XCZU47DR-L1FFVE1156I
AMD
分类:Embedded - System On Chip (SoC)
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XCZU46DR-1FFVH1760I
AMD
分类:Embedded - System On Chip (SoC)
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XCZU48DR-L1FFVE1156I
AMD
分类:Embedded - System On Chip (SoC)