品牌是'AMD' (1092)

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品牌

数据表

库存

价格(含增值税)

数量

Rohs

安装类型

包装/外壳

供应商器件包装

厂商

操作温度

系列

尺寸/尺寸

容差

终止次数

温度系数

类型

电阻

组成

颜色

功率(瓦特)

屏蔽/屏蔽

频率

频率稳定性

引脚数量

ESR(等效串联电阻)

失败率

线规

配置

界面

振荡器类型

负载电容

速度

内存大小

操作模式

电压 - 供电 (Vcc/Vdd)

核心处理器

频率容差

周边设备

程序存储器类型

芯尺寸

程序内存大小

连接方式

建筑学

规格说明

EEPROM 大小

筛选水平

速度等级

主要属性

寄存器数量

闪光大小

特征

座位高度(最大)

长度

评级结果

XCZU3CG-L1UBVA530I
XCZU3CG-L1UBVA530I
AMD 数据表

527 In Stock

-

最小起订量: 1

最小包装量: 1

530-WFBGA, FCBGA

530-FCBGA (16x9.5)

AMD

Tray

活跃

82

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

XCZU1CG-2SBVA484E
XCZU1CG-2SBVA484E
AMD 数据表

2741 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

Tray

活跃

-

0°C ~ 100°C (TJ)

Zynq® UltraScale+™

CAN/Serial I2C/SPI/U

533MHz, 1.333GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

MPU, FPGA

-

-

XCVC1702-1LSENSVG1369
XCVC1702-1LSENSVG1369
AMD 数据表

651 In Stock

-

最小起订量: 1

最小包装量: 1

1369-BFBGA

1369-BGA (35x35)

AMD

Tray

活跃

500

0°C ~ 100°C (TJ)

Versal™ AI Core

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1M Logic Cells

-

XCVC1802-2MSIVSVA2197
XCVC1802-2MSIVSVA2197
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

Tray

活跃

770

-40°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

XCVC1902-2MLEVSVD1760
XCVC1902-2MLEVSVD1760
AMD 数据表

831 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

Tray

活跃

692

0°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XCZU2EG-1UBVA530E
XCZU2EG-1UBVA530E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

530-WFBGA, FCBGA

530-FCBGA (16x9.5)

AMD

Tray

活跃

82

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

XCVC1902-2MLEVIVA1596
XCVC1902-2MLEVIVA1596
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

1596-FCBGA (40x40)

AMD

Tray

活跃

500

0°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XCZU42DR-2FSVE1156E
XCZU42DR-2FSVE1156E
AMD 数据表

520 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

Tray

活跃

366

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 489K+ Logic Cells

-

XC7Z014S-2CLG484E
XC7Z014S-2CLG484E
AMD 数据表

2179 In Stock

-

最小起订量: 1

最小包装量: 1

484-LFBGA, CSPBGA

484-CSPBGA (19x19)

Amphenol Socapex

1.05 V

200

Box

USBFTVX7

活跃

1.0000 V

0.95 V

0 to 100 °C

USBF TVX

-

Shielded

24 AWG, 28 AWG

A Female to A Male (Circular Coupling)

766MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

USB 2.0

2

Artix™-7 FPGA, 65K Logic Cells

-

Data Transfer and Charge, Extension Cable, Industrial Environments - IP68, Panel Mount

3.28 (1.00m)

XCZU15EG-2FFVC900I
XCZU15EG-2FFVC900I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

64-LQFP

64-LQFP (10x10)

Infineon Technologies

0.8500 V

0.808 V

0.892 V

51

Tray

CY9AF312

A/D 9x12b SAR

活跃

-40°C ~ 105°C (TA)

FM3 CY9A310

External, Internal

40MHz

16K x 8

2.7V ~ 5.5V

ARM® Cortex®-M3

DMA, LVD, POR, PWM, WDT

FLASH

32-Bit Single-Core

128KB (128K x 8)

CSIO, I²C, LINbus, SPI, UART/USART

MCU, FPGA

-

2

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

XCZU9CG-2FFVC900I
XCZU9CG-2FFVC900I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

0.808 V

0.892 V

204

Tray

XCZU9

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

XCZU4EV-3FBVB900E
XCZU4EV-3FBVB900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

活跃

204

Tray

XCZU4

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EV

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

XCZU11EG-1FFVC1156E
XCZU11EG-1FFVC1156E
AMD 数据表

838 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

XCZU11

活跃

0.8500 V

0.808 V

0.892 V

360

Tray

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

XCZU3CG-L1SFVA625I
XCZU3CG-L1SFVA625I
AMD 数据表

955 In Stock

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

活跃

180

Tray

XCZU3

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

XCZU4EV-2SFVC784I
XCZU4EV-2SFVC784I
AMD 数据表

720 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

0.8500 V

0.808 V

0.892 V

AMD

252

Tray

XCZU4

活跃

Industrial grade

192,150

FCBGA

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EV

784

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

2

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

175,680

-

XCZU7CG-1FFVF1517E
XCZU7CG-1FFVF1517E
AMD 数据表

693 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

XCZU7

活跃

0.8500 V

0.808 V

0.892 V

464

Tray

0 to 100 °C

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU5EV-3SFVC784E
XCZU5EV-3SFVC784E
AMD 数据表

309 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

XCZU5

活跃

0.9000 V

0.873 V

0.927 V

252

Tray

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EV

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

XCZU4EV-2SFVC784E
XCZU4EV-2SFVC784E
AMD 数据表

743 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

252

AMD

Tray

XCZU4

活跃

192,150

0.8500 V

252

表面贴装

0 to 100 °C

Zynq® UltraScale+™ MPSoC EV

784

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

扩展工业

2

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

175,680

-

XCZU11EG-3FFVC1760E
XCZU11EG-3FFVC1760E
AMD 数据表

788 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

XCZU11

活跃

653100

0.9000 V

512

512

Tray

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

1760

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

扩展工业

3

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

597120

-

XCZU5EG-L2SFVC784E
XCZU5EG-L2SFVC784E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

活跃

252

Tray

XCZU5

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

XCZU4CG-2FBVB900I
XCZU4CG-2FBVB900I
AMD 数据表

878 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

FCBGA

0.8500 V

0.808 V

204

AMD

0.892 V

204

Tray

XCZU4

活跃

Industrial grade

192,150

-40 to 100 °C

Zynq® UltraScale+™ MPSoC CG

900

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

2

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

175,680

-

XCVM1402-2MSINBVB1024
XCVM1402-2MSINBVB1024
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

1024-BGA (31x31)

Suntsu Electronics, Inc.

活跃

424

Bulk

-10°C ~ 70°C

SXT224

0.098 L x 0.079 W (2.50mm x 2.00mm)

兆赫晶体

14.31818 MHz

±20ppm

120 Ohms

11pF

600MHz, 1.4GHz

-

Fundamental

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

±20ppm

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

0.026 (0.65mm)

-

XCVM1802-2MSEVFVC1760
XCVM1802-2MSEVFVC1760
AMD 数据表

568 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

PEI-Genesis

活跃

500

Bulk

0°C ~ 100°C (TJ)

*

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XC7Z014S-2CLG400I
XC7Z014S-2CLG400I
AMD 数据表

2020 In Stock

-

最小起订量: 1

最小包装量: 1

1206 (3216 Metric)

1206

KOA Speer Electronics, Inc.

125

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

RN73R2B

活跃

-55°C ~ 155°C

RN73R

0.126 L x 0.063 W (3.20mm x 1.60mm)

±1%

2

±10ppm/°C

142 Ohms

Thin Film

0.25W, 1/4W

-

766MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 65K Logic Cells

-

Automotive AEC-Q200, Moisture Resistant

0.028 (0.70mm)

AEC-Q200

XCZU6EG-L1FFVB1156I
XCZU6EG-L1FFVB1156I
AMD 数据表

499 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

1156-FCBGA (35x35)

Suntsu Electronics, Inc.

活跃

328

XCZU6

Bulk

-40°C ~ 85°C

SXT214

0.079 L x 0.063 W (2.00mm x 1.60mm)

兆赫晶体

37.4 MHz

±25ppm

100 Ohms

15pF

500MHz, 600MHz, 1.2GHz

256KB

Fundamental

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

±25ppm

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

0.020 (0.50mm)

-