品牌是'AMD' (1092)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 供应商器件包装 | 厂商 | 操作温度 | 系列 | 尺寸/尺寸 | 容差 | 终止次数 | 温度系数 | 类型 | 电阻 | 组成 | 颜色 | 功率(瓦特) | 屏蔽/屏蔽 | 频率 | 频率稳定性 | 引脚数量 | ESR(等效串联电阻) | 失败率 | 线规 | 配置 | 界面 | 振荡器类型 | 负载电容 | 速度 | 内存大小 | 操作模式 | 电压 - 供电 (Vcc/Vdd) | 核心处理器 | 频率容差 | 周边设备 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 建筑学 | 规格说明 | EEPROM 大小 | 筛选水平 | 速度等级 | 主要属性 | 寄存器数量 | 闪光大小 | 特征 | 座位高度(最大) | 长度 | 评级结果 | |||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | XCZU3CG-L1UBVA530I | AMD | 数据表 | 527 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | Tray | 活跃 | 82 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU1CG-2SBVA484E | AMD | 数据表 | 2741 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | Tray | 活跃 | - | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1702-1LSENSVG1369 | AMD | 数据表 | 651 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | Tray | 活跃 | 500 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1802-2MSIVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | Tray | 活跃 | 770 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-2MLEVSVD1760 | AMD | 数据表 | 831 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | Tray | 活跃 | 692 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU2EG-1UBVA530E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | Tray | 活跃 | 82 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-2MLEVIVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | Tray | 活跃 | 500 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU42DR-2FSVE1156E | AMD | 数据表 | 520 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | Tray | 活跃 | 366 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z014S-2CLG484E | AMD | 数据表 | 2179 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) | Amphenol Socapex | 1.05 V | 200 | Box | USBFTVX7 | 活跃 | 1.0000 V | 0.95 V | 0 to 100 °C | USBF TVX | - | Shielded | 24 AWG, 28 AWG | A Female to A Male (Circular Coupling) | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | USB 2.0 | 2 | Artix™-7 FPGA, 65K Logic Cells | - | Data Transfer and Charge, Extension Cable, Industrial Environments - IP68, Panel Mount | 3.28 (1.00m) | ||||||||||||||||||||||||||||||||||||
![]() | XCZU15EG-2FFVC900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LQFP | 64-LQFP (10x10) | Infineon Technologies | 0.8500 V | 0.808 V | 0.892 V | 51 | Tray | CY9AF312 | A/D 9x12b SAR | 活跃 | -40°C ~ 105°C (TA) | FM3 CY9A310 | External, Internal | 40MHz | 16K x 8 | 2.7V ~ 5.5V | ARM® Cortex®-M3 | DMA, LVD, POR, PWM, WDT | FLASH | 32-Bit Single-Core | 128KB (128K x 8) | CSIO, I²C, LINbus, SPI, UART/USART | MCU, FPGA | - | 2 | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||
![]() | XCZU9CG-2FFVC900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 0.808 V | 0.892 V | 204 | Tray | XCZU9 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EV-3FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 活跃 | 204 | Tray | XCZU4 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU11EG-1FFVC1156E | AMD | 数据表 | 838 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | XCZU11 | 活跃 | 0.8500 V | 0.808 V | 0.892 V | 360 | Tray | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3CG-L1SFVA625I | AMD | 数据表 | 955 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | 活跃 | 180 | Tray | XCZU3 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EV-2SFVC784I | AMD | 数据表 | 720 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | 0.8500 V | 0.808 V | 0.892 V | AMD | 252 | Tray | XCZU4 | 活跃 | Industrial grade | 192,150 | FCBGA | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 784 | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 2 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 175,680 | - | |||||||||||||||||||||||||||||||||||||
![]() | XCZU7CG-1FFVF1517E | AMD | 数据表 | 693 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | XCZU7 | 活跃 | 0.8500 V | 0.808 V | 0.892 V | 464 | Tray | 0 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5EV-3SFVC784E | AMD | 数据表 | 309 In Stock | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | XCZU5 | 活跃 | 0.9000 V | 0.873 V | 0.927 V | 252 | Tray | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EV-2SFVC784E | AMD | 数据表 | 743 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | 252 | AMD | Tray | XCZU4 | 活跃 | 192,150 | 0.8500 V | 252 | 表面贴装 | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 784 | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 扩展工业 | 2 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 175,680 | - | |||||||||||||||||||||||||||||||||||||||
![]() | XCZU11EG-3FFVC1760E | AMD | 数据表 | 788 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | XCZU11 | 活跃 | 653100 | 0.9000 V | 512 | 512 | Tray | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 1760 | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 扩展工业 | 3 | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | 597120 | - | ||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5EG-L2SFVC784E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 活跃 | 252 | Tray | XCZU5 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4CG-2FBVB900I | AMD | 数据表 | 878 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | FCBGA | 0.8500 V | 0.808 V | 204 | AMD | 0.892 V | 204 | Tray | XCZU4 | 活跃 | Industrial grade | 192,150 | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 900 | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 2 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 175,680 | - | ||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-2MSINBVB1024 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 1024-BGA (31x31) | Suntsu Electronics, Inc. | 活跃 | 424 | Bulk | -10°C ~ 70°C | SXT224 | 0.098 L x 0.079 W (2.50mm x 2.00mm) | 兆赫晶体 | 14.31818 MHz | ±20ppm | 120 Ohms | 11pF | 600MHz, 1.4GHz | - | Fundamental | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | ±20ppm | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | 0.026 (0.65mm) | - | |||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-2MSEVFVC1760 | AMD | 数据表 | 568 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | PEI-Genesis | 活跃 | 500 | Bulk | 0°C ~ 100°C (TJ) | * | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z014S-2CLG400I | AMD | 数据表 | 2020 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1206 (3216 Metric) | 1206 | KOA Speer Electronics, Inc. | 125 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | RN73R2B | 活跃 | -55°C ~ 155°C | RN73R | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±1% | 2 | ±10ppm/°C | 142 Ohms | Thin Film | 0.25W, 1/4W | - | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 65K Logic Cells | - | Automotive AEC-Q200, Moisture Resistant | 0.028 (0.70mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||
![]() | XCZU6EG-L1FFVB1156I | AMD | 数据表 | 499 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 1156-FCBGA (35x35) | Suntsu Electronics, Inc. | 活跃 | 328 | XCZU6 | Bulk | -40°C ~ 85°C | SXT214 | 0.079 L x 0.063 W (2.00mm x 1.60mm) | 兆赫晶体 | 37.4 MHz | ±25ppm | 100 Ohms | 15pF | 500MHz, 600MHz, 1.2GHz | 256KB | Fundamental | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | ±25ppm | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | 0.020 (0.50mm) | - |
XCZU3CG-L1UBVA530I
AMD
分类:Embedded - System On Chip (SoC)
4,243.421492
XCZU1CG-2SBVA484E
AMD
分类:Embedded - System On Chip (SoC)
2,471.451312
XCVC1702-1LSENSVG1369
AMD
分类:Embedded - System On Chip (SoC)
144,343.120096
XCVC1802-2MSIVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
XCVC1902-2MLEVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
245,535.977347
XCZU2EG-1UBVA530E
AMD
分类:Embedded - System On Chip (SoC)
XCVC1902-2MLEVIVA1596
AMD
分类:Embedded - System On Chip (SoC)
XCZU42DR-2FSVE1156E
AMD
分类:Embedded - System On Chip (SoC)
105,701.626696
XC7Z014S-2CLG484E
AMD
分类:Embedded - System On Chip (SoC)
1,072.123737
XCZU15EG-2FFVC900I
AMD
分类:Embedded - System On Chip (SoC)
XCZU9CG-2FFVC900I
AMD
分类:Embedded - System On Chip (SoC)
XCZU4EV-3FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
XCZU11EG-1FFVC1156E
AMD
分类:Embedded - System On Chip (SoC)
26,303.948546
XCZU3CG-L1SFVA625I
AMD
分类:Embedded - System On Chip (SoC)
4,706.320838
XCZU4EV-2SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
12,573.558665
XCZU7CG-1FFVF1517E
AMD
分类:Embedded - System On Chip (SoC)
21,551.221659
XCZU5EV-3SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
XCZU4EV-2SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
12,333.527452
XCZU11EG-3FFVC1760E
AMD
分类:Embedded - System On Chip (SoC)
64,359.706672
XCZU5EG-L2SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
XCZU4CG-2FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
15,162.023718
XCVM1402-2MSINBVB1024
AMD
分类:Embedded - System On Chip (SoC)
XCVM1802-2MSEVFVC1760
AMD
分类:Embedded - System On Chip (SoC)
76,598.687205
XC7Z014S-2CLG400I
AMD
分类:Embedded - System On Chip (SoC)
1,111.318755
XCZU6EG-L1FFVB1156I
AMD
分类:Embedded - System On Chip (SoC)
