品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 组织的记忆 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | GS8161Z18BGD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 70 °C | 0 °C | 2 | 20 b | 18 Mb | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS78116AGB-8I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | YES | 119 | 119 | 网格排列 | 3 | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 8 ns | 85 °C | 有 | GS78116AGB-8I | 524288 words | 3.3 V | BGA | RECTANGULAR | GSI技术 | 生命周期结束 | GSI TECHNOLOGY | 5.22 | BGA | BGA, | e1 | 有 | 3A991.B.2.B | 锡银铜 | THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT. | 8542.32.00.41 | CMOS | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | INDUSTRIAL | ASYNCHRONOUS | 512KX16 | 1.99 mm | 16 | 8388608 bit | PARALLEL | 标准SRAM | 3.6 V | 3 V | 22 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS78116AB-12I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks, 5 Days | YES | 119 | 119 | Compliant | BGA, | 网格排列 | 3 | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 12 ns | 85 °C | 无 | GS78116AB-12I | 524288 words | 3.3 V | BGA | RECTANGULAR | GSI技术 | 生命周期结束 | GSI TECHNOLOGY | 1.7 | BGA | e0 | 无 | 3A991.B.2.B | 锡铅 | 85 °C | -40 °C | THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT. | 8542.32.00.41 | CMOS | 3.3 V | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | INDUSTRIAL | 1 | ASYNCHRONOUS | 512KX16 | 1.99 mm | 16 | 19 b | 8 Mb | 8388608 bit | PARALLEL | 标准SRAM | 3.6 V | 3 V | 22 mm | 14 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8640Z36GT-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | TQFP-100 | YES | 100 | 100-TQFP (20x14) | 100 | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 300 MHz | + 85 C | 3.6 V | - 40 C | GSI Technology Inc. | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Tray | GS8640Z | 活跃 | LQFP, | FLATPACK, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 5.5 ns | 85 °C | 有 | GS8640Z36GT-300I | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.32 | QFP | Industrial grade | 181.8@Flow-Through/300@Pipelined MHz | TQFP | -40 to 85 °C | Tray | GS8640Z36GT | 有 | 3A991.B.2.B | NBT Pipeline/Flow Through | Pure Matte Tin (Sn) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | SRAM - Synchronous, ZBT | 2.3V ~ 2.7V, 3V ~ 3.6V | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | INDUSTRIAL | 72 Mbit | 4 | SYNCHRONOUS | 300 MHz | 320 mA, 440 mA | 5.5 ns | SRAM | Parallel | Flow-Through/Pipelined | 2 M x 36 | 1.6 mm | 36 | - | 21 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 2M x 36 | 20 mm | 14 mm | |||||||||||||
![]() | GS8182D37BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | BGA-165 | YES | 165 | 165-FPBGA (15x13) | 165 | GSI技术 | SigmaQuad-II+ | Details | DDR | Tray | GSI Technology Inc. | GS8182D37 | 活跃 | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8182D37BGD-400I | 400 MHz | 524288 words | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.21 | BGA | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | -40°C ~ 85°C (TA) | Tray | GS8182D37BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad II+ | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | SRAM - Quad Port, Synchronous | 1.7V ~ 1.9V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 18 Mbit | SYNCHRONOUS | 400 MHz | 680 mA | SRAM | Parallel | 512 k x 36 | 3-STATE | 1.4 mm | 36 | - | SRAM | 0.185 A | 18874368 bit | PARALLEL | SEPARATE | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 512K x 36 | 15 mm | 10 mm | |||||||||||||||||||||
![]() | GS8342T38BD-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 表面贴装 | 500 MHz | Parallel | SMD/SMT | 1.7 V | 0 C | 1.9 V | + 70 C | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 无 | GS8342T38BD-500 | 500 MHz | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.34 | BGA | Commercial grade | 500 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 0 to 85 °C | e0 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 36 Mbit | 1 | SYNCHRONOUS | 945 mA | Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 19 Bit | 36 Mbit | 0.24 A | 37748736 bit | Commercial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||
![]() | GS816036DGT-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | 有 | 200 MHz | + 85 C | 3.6 V | 0 C | 36 | 2.3 V | Tray | GS816036DGT | Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 210 mA | 6.5 ns | 512 k x 36 | SRAM | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D36BGD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 36 Bit | 1.9 V | 表面贴装 | Compliant | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 有 | GS8662D36BGD-300 | 300 MHz | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.19 | BGA | 300 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 0 to 85 °C | GS8662D36BGD | e1 | 有 | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | 流水线结构 | 8542.32.00.41 | SRAMs | CMOS | 1.8 V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 72 Mbit | 2 | SYNCHRONOUS | 0.735 mA | Pipelined | 2MX36 | 3-STATE | 1.4 mm | 36 | 19 Bit | 72 Mbit | 75497472 bit | Commercial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | 15 mm | 13 mm | 无 | |||||||||||||||||||||||||
![]() | GS8662Q36BD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 250 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 无 | GS8662Q36BD-250 | 250 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.25 | BGA | Commercial grade | 250 MHz | FBGA | QDR | 0 to 85 °C | Bulk | GS8662Q36BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II | Tin/Lead (Sn/Pb) | 85 °C | 0 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 72 Mbit | 2 | SYNCHRONOUS | 895 mA | Pipelined | 2 M x 36 | 3-STATE | 1.4 mm | 36 | 20 Bit | SRAM | 72 Mbit | 75497472 bit | Commercial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||||||||||||||
![]() | GS81302D38GE-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | Tray | GS81302D38GE | SigmaQuad-II+ | Memory & Data Storage | 144 Mbit | 1.54 A | 4 M x 36 | SRAM | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8642Z36GB-167IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 119-BGA | YES | 119 | 119-FPBGA (22x14) | 119 | 36 Bit | 2, 2.7 V | 表面贴装 | Tray | GS8642Z | 活跃 | Volatile | 167 MHz | GSI Technology Inc. | + 85 C | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | BGA, | 网格排列 | 3 | 2000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 8 ns | 85 °C | 有 | GS8642Z36GB-167IV | 1.8 V | BGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 4.64 | BGA | Industrial grade | 125@Flow-Through/167@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | -40 to 85 °C | - | e1 | 有 | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | SRAM - Synchronous, ZBT | 1.7V ~ 2V, 2.3V ~ 2.7V | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | INDUSTRIAL | 72Mbit | 4 | SYNCHRONOUS | 167 MHz | 240 mA, 290 mA | 8 ns | SRAM | Parallel | Flow-Through/Pipelined | 2 M x 36 | 1.99 mm | 36 | - | 21 Bit | 72 Mbit | 75497472 bit | Industrial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | 2M x 36 | 22 mm | 14 mm | ||||||||||||||||||||||
![]() | GS74108AGP-10 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 44 | Compliant | 70 °C | 0 °C | 3.3 V | 1 | 19 b | 4 Mb | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182D18BD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | GSI技术 | GSI技术 | SigmaQuad-II | DDR | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | Tray | GS8182D18BD | SigmaQuad-II | Memory & Data Storage | 18 Mbit | 485 mA | 1 M x 18 | SRAM | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672T20BGE-550 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | 有 | 550 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | Tray | GS8672T20BGE | SigmaDDR-II+ B2 | Memory & Data Storage | 72 Mbit | 1.36 A | 4 M x 18 | SRAM | 72 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816118DGT-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | 有 | 250 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | Tray | GS816118DGT | Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 210 mA, 230 mA | 5.5 ns | 1 M x 18 | SRAM | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672T38BE-550I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR-II | 有 | 550 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | Tray | GS8672T38BE | SigmaDDR-II+ B2 | Memory & Data Storage | 72 Mbit | 1.87 A | 2 M x 36 | SRAM | 72 | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8162Z36DB-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | 有 | 250 MHz | + 70 C | 3.6 V | 0 C | 21 | 2.3 V | Tray | GS8162Z36DB | NBT Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 230 mA, 250 mA | 5.5 ns | 512 k x 36 | SRAM | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161E36DD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | GSI技术 | GSI技术 | SyncBurst | SDR | 有 | 200 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | Tray | GS8161E36DD | DCD Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 210 mA | 6.5 ns | 512 k x 36 | SRAM | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS841Z36CGT-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | 有 | 200 MHz | + 85 C | 3.6 V | - 40 C | 72 | 2.3 V | Tray | GS841Z36CGT | NBT Pipeline/Flow Through | Memory & Data Storage | 4 Mbit | 160 mA, 190 mA | 6.5 ns | 128 k x 36 | SRAM | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672Q20BGE-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | Tray | GS8672Q20BGE | SigmaQuad-II+ B2 | Memory & Data Storage | 72 Mbit | 1.49 A | 4 M x 18 | SRAM | 72 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816218DB-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | 有 | 150 MHz | + 70 C | 3.6 V | 0 C | 21 | 2.3 V | Tray | GS816218DB | Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 170 mA, 180 mA | 7.5 ns | 1 M x 18 | SRAM | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881Z32CGT-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | 有 | 150 MHz | + 70 C | 3.6 V | 0 C | 72 | 2.3 V | Tray | GS881Z32CGT | NBT Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 130 mA, 140 mA | 7.5 ns | 256 k x 32 | SRAM | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS880Z36CGT-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | TQFP-100 | YES | 100 | 100-TQFP (20x14) | 100 | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 300 MHz | + 85 C | 3.6 V | - 40 C | GSI Technology Inc. | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Tray | GS880Z | 活跃 | LQFP, | FLATPACK, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | -40 °C | 未说明 | 5 ns | 85 °C | 有 | GS880Z36CGT-300I | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.8 | QFP | Industrial grade | 200@Flow-Through/300@Pipelined MHz | TQFP | -40 to 85 °C | Tray | GS880Z36CGT | e3 | 有 | 3A991.B.2.B | NBT | Matte Tin (Sn) | 85 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | SRAM - Synchronous, ZBT | 2.3V ~ 2.7V, 3V ~ 3.6V | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | INDUSTRIAL | 9 Mbit | 1 | SYNCHRONOUS | 300 MHz | 185 mA, 245 mA | 5 ns | SRAM | Parallel | Flow-Through/Pipelined | 256 k x 36 | 1.6 mm | 36 | - | 18 Bit | SRAM | 9 Mbit | 9437184 bit | Industrial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 256K x 36 | 20 mm | 14 mm | 无 | |||||||||
![]() | GS8182Q09BD-167 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | N | DDR | 有 | 167 MHz | + 70 C | 1.9 V | 0 C | 18 | 1.7 V | Tray | GS8182Q09BD | SigmaQuad-II | 70 °C | 0 °C | Memory & Data Storage | 1.8 V | 18 Mbit | 2 | 435 mA | 2 M x 9 | 20 b | SRAM | 18 Mb | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816136DGT-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | TQFP-100 | YES | 100 | 100 | 2.3, 3 V | Synchronous | 512 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 200 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | QFP | 5.26 | GSI TECHNOLOGY | 活跃 | RECTANGULAR | QFP | 2.5 V | GS816136DGT-200I | 有 | 85 °C | 6.5 ns | 未说明 | -40 °C | PLASTIC/EPOXY | 512000 | FLATPACK | QFP, | Industrial grade | 153.8@Flow-Through/200@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | -40 to 85 °C | Tray | GS816136DGT | 3A991.B.2.B | Pipeline/Flow Through | FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | compliant | R-PQFP-G100 | INDUSTRIAL | 18 Mbit | 4 | SYNCHRONOUS | 230 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 36 | 36 | 19 Bit | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM |
GS8161Z18BGD-200
GSI Technology
分类:Memory
GS78116AGB-8I
GSI Technology
分类:Memory
GS78116AB-12I
GSI Technology
分类:Memory
GS8640Z36GT-300I
GSI Technology
分类:Memory
GS8182D37BGD-400I
GSI Technology
分类:Memory
GS8342T38BD-500
GSI Technology
分类:Memory
GS816036DGT-200
GSI Technology
分类:Memory
GS8662D36BGD-300
GSI Technology
分类:Memory
GS8662Q36BD-250
GSI Technology
分类:Memory
GS81302D38GE-450I
GSI Technology
分类:Memory
GS8642Z36GB-167IV
GSI Technology
分类:Memory
GS74108AGP-10
GSI Technology
分类:Memory
GS8182D18BD-300
GSI Technology
分类:Memory
GS8672T20BGE-550
GSI Technology
分类:Memory
GS816118DGT-250
GSI Technology
分类:Memory
GS8672T38BE-550I
GSI Technology
分类:Memory
GS8162Z36DB-250
GSI Technology
分类:Memory
GS8161E36DD-200
GSI Technology
分类:Memory
GS841Z36CGT-200I
GSI Technology
分类:Memory
GS8672Q20BGE-450
GSI Technology
分类:Memory
GS816218DB-150
GSI Technology
分类:Memory
GS881Z32CGT-150
GSI Technology
分类:Memory
GS880Z36CGT-300I
GSI Technology
分类:Memory
GS8182Q09BD-167
GSI Technology
分类:Memory
GS816136DGT-200I
GSI Technology
分类:Memory
