品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 数据率 | 建筑学 | 组织结构 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 记忆密度 | 筛选水平 | 并行/串行 | 内存IC类型 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||||||||||||||||
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![]() | GS81302DT37E-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | Commercial grade | 450 MHz | FBGA | QDR | 1.8000 V | Synchronous | 4 MWords | 36 Bit | 表面贴装 | Compliant | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302DT37E | SigmaQuad-II+ B4 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 114 Mbit | 2 | 1.4 A | Pipelined | 4 M x 36 | 20 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881E36CGT-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | 3.6 V | - 40 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | 表面贴装 | 2.7, 3.6 V | 36 Bit | 256 kWords | Synchronous | 2.3, 3 V | 2.5, 3.3 V | SDR | TQFP | Compliant | 有 | 250 MHz | + 85 C | -40 to 85 °C | Tray | GS881E36CGT | DCD Pipeline/Flow Through | 85 °C | -40 °C | Memory & Data Storage | 9 Mbit | 4 | 175 mA, 215 mA | 5.5 ns | Flow-Through/Pipelined | 256 k x 36 | 18 Bit | SRAM | 9 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8642Z18B-250M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 119 | 119 | BGA, | 网格排列 | 4000000 | PLASTIC/EPOXY | -55 °C | 未说明 | 6.5 ns | 125 °C | 无 | GS8642Z18B-250M | 2.5 V | BGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.71 | BGA | Military grade | 153.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 4 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | -55 to 125 °C | Bulk | 3A991.B.2.B | 125 °C | -55 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE, LATE WRITE, IT ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | MILITARY | 2 | SYNCHRONOUS | Flow-Through/Pipelined | 4MX18 | 1.99 mm | 18 | 22 Bit | 72 Mbit | 75497472 bit | Military | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | 22 mm | 14 mm | 无 | ||||||||||||||||||||||||||||
![]() | GS88018CGT-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | 2.7 V | 0 C | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Commercial grade | 150 MHz | TQFP | SDR | 表面贴装 | 2, 2.7 V | 18 Bit | 512 kWords | Synchronous | 1.7, 2.3 V | 1.8, 2.5 V | Compliant | 有 | 150 MHz | + 70 C | 0 to 70 °C | Tray | GS88018CGT | 同步突发 | 70 °C | 0 °C | Memory & Data Storage | 9 Mbit | 2 | 105 mA, 115 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 18 | 19 Bit | SRAM | 9 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS74116AGX-12E | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-48 | 48 | 256 kWords | 16 Bit | 3.6 V | 表面贴装 | Compliant | 3.6 V | 135 | 3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | FBGA | 3.3000 V | 3 V | Asynchronous | -40 to 125 °C | GS74116AGX | Asynchronous | Memory & Data Storage | 4 Mbit | 1 | 90 mA | 12 ns | 256 k x 16 | 18 Bit | SRAM | 4 Mbit | 扩展工业 | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302Q08E-300M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | GSI技术 | SigmaQuad-II | QDR-II | Military grade | 300 MHz | BGA | QDR | 1.8000 V | Synchronous | 16 MWords | 8 Bit | 表面贴装 | 有 | 300 MHz | + 125 C | 1.9 V | - 55 C | 10 | 1.7 V | SMD/SMT | Parallel | Tray | GS81302Q08E | SigmaQuad-II | Memory & Data Storage | 144 Mbit | Pipelined | 16 M x 8 | 24 Bit | SRAM | 144 Mbit | Military | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8673ED18BGK-675 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-260 | YES | 260 | 260 | 4 MWords | 18 Bit | 表面贴装 | 有 | 675 MHz | + 85 C | 1.4 V | 0 C | 8 | 1.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-IIIe | Details | DDR | HBGA, | GRID ARRAY, HEAT SINK/SLUG | 4000000 | PLASTIC/EPOXY | 未说明 | 85 °C | 有 | GS8673ED18BGK-675 | 1.35 V | HBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.73 | Commercial grade | 675/450 MHz | BGA | QDR | 1.3500 V | Synchronous | 0 to 70 °C | Tray | GS8673ED18BGK | 3A991.B.2.B | SigmaQuad-IIIe B4 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B260 | OTHER | 72 Mbit | SYNCHRONOUS | 2.26 A | 1.35 Gb/s | Pipelined | 4 M x 18 | 2.3 mm | 18 | 20 Bit | SRAM | 72 Mbit | 75497472 bit | Commercial | PARALLEL | DDR SRAM | 1.4 V | 1.3 V | SRAM | 22 mm | 14 mm | ||||||||||||||||||
![]() | GS81302D08E-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 10 | GSI技术 | GSI技术 | SigmaQuad-II | Industrial grade | 350 MHz | FBGA | -40 to 100 °C | Tray | GS81302D08E | Memory & Data Storage | 2 | Pipelined | 22 Bit | SRAM | 144 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302Q10GE-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | Industrial grade | 250 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 250 MHz | + 85 C | 1.9 V | -40 to 100 °C | Tray | GS81302Q10GE | SigmaQuad-II+ B2 | Memory & Data Storage | 144 Mbit | 2 | 1.07 A | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D38E-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 500 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 500 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 0 to 85 °C | 144 Mbit | 2 | 1.66 A | Pipelined | 4 M x 36 | 20 Bit | 144 Mbit | Commercial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8128418B-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-119 | YES | 119 | 119 | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 8 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 85 C | 3.6 V | - 40 C | 10 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | BGA, | 网格排列 | 8000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 7.5 ns | 85 °C | 无 | GS8128418B-200IV | 1.8 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.19 | BGA | Industrial grade | 200 MHz | SDR | -40 to 85 °C | Tray | GS8128418B | e0 | 无 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Lead (Sn/Pb) | PIPELINE AND FLOW THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 2.3V TO 2.7V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | INDUSTRIAL | 144 Mbit | 2 | SYNCHRONOUS | 360 mA, 435 mA | 7.5 ns | 8 M x 18 | 1.99 mm | 18 | SRAM | 144 Mbit | 150994944 bit | Industrial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 22 mm | 14 mm | |||||||||||
![]() | GS880Z36CGT-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | GSI技术 | NBT SRAM | Details | SDR | Commercial grade | 133.3@Flow-Through/150@Pipelined MHz | TQFP | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 36 Bit | 2, 2.7 V | 有 | 150 MHz | + 70 C | 2.7 V | 0 C | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | 0 to 70 °C | Tray | GS880Z36CGT | NBT | 70 °C | 0 °C | Memory & Data Storage | 9 Mbit | 1 | 110 mA, 125 mA | 7.5@Flow-Through/3.8 | 256 k x 36 | 18 b | SRAM | 9 Mb | 9 | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT20E-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | 165 | 表面贴装 | Compliant | 400 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | LBGA, | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS81302TT20E-400I | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 不推荐 | GSI TECHNOLOGY | 5.06 | BGA | Industrial grade | 400 MHz | FBGA | DDR | 1.8000 V | Synchronous | 8 MWords | 18 Bit | -40 to 100 °C | Bulk | GS81302TT20E | 无 | 3A991.B.2.B | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 144 Mbit | 1 | SYNCHRONOUS | 905 mA | Pipelined | 8 M x 18 | 1.5 mm | 18 | 22 Bit | 144 Mbit | 150994944 bit | Industrial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | 17 mm | 15 mm | 无 | |||||||||||||||||
![]() | GS81302Q37GE-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | Commercial grade | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 70 C | 1.9 V | 0 to 85 °C | Tray | GS81302Q37GE | SigmaQuad-II+ B2 | Memory & Data Storage | 144 Mbit | 2 | 1.33 A | Pipelined | 4 M x 36 | 21 Bit | SRAM | 144 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881E32CGT-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 72 | Tray | GS881E32CGT | DCD Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 175 mA, 215 mA | 5.5 ns | 256 k x 32 | SRAM | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881Z18CD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | 有 | 250 MHz | + 70 C | 3.6 V | 0 C | 72 | Tray | GS881Z18CD | NBT Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 145 mA, 180 mA | 5.5 ns | 512 k x 18 | SRAM | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS842Z18CB-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 84 | 2.3 V | SMD/SMT | Tray | GS842Z18CB | NBT Pipeline/Flow Through | Memory & Data Storage | 4 Mbit | 165 mA, 200 mA | 5.5 ns | 256 k x 18 | SRAM | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D20GE-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | 1.7 V | 10 | 0 C | 1.9 V | + 70 C | 500 MHz | 有 | QDR-II | Details | SigmaQuad-II+ | GSI技术 | GSI技术 | Parallel | Tray | GS81302D20GE | SigmaQuad-II+ | Memory & Data Storage | 144 Mbit | 1.36 A | 8 M x 18 | SRAM | 144 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881E36CGD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 70 °C | 0 °C | 4 | 18 b | 9 Mb | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT38GE-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | Compliant | Commercial grade | 500 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 0 to 85 °C | Bulk | 85 °C | 0 °C | 1.8 V | 2 | Pipelined | 20 Bit | 144 Mbit | Commercial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302T19GE-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR-II | Commercial grade | 450 MHz | FBGA | DDR | 1.8000 V | Synchronous | 8 MWords | 18 Bit | 表面贴装 | Compliant | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Bulk | GS81302T19GE | SigmaDDR-II+ B2 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 1 | 1 A | Pipelined | 8 M x 18 | 22 b | SRAM | 144 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302T08E-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | DDR-II | Industrial grade | 375 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 375 MHz | + 85 C | -40 to 100 °C | Bulk | GS81302T08E | SigmaDDR-II B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 855 mA | Pipelined | 16 M x 8 | 23 Bit | SRAM | 144 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8673ET18BGK-625I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-260 | YES | 260 | 260 | 4 MWords | Synchronous | 1.3 V | 1.3500 V | DDR | BGA | 625/400 MHz | Compliant | 有 | 625 MHz | + 100 C | 1.4 V | - 40 C | 8 | 1.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-IIIe | DDR-III | HBGA, | GRID ARRAY, HEAT SINK/SLUG | 4000000 | PLASTIC/EPOXY | 未说明 | 0.4 ns | 有 | GS8673ET18BGK-625I | 1.35 V | HBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.72 | Industrial grade | 表面贴装 | 1.4 V | 18 Bit | -40 to 85 °C | Tray | GS8673ET18BGK | 3A991.B.2.B | SigmaDDR-IIIe B2 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B260 | 72 Mbit | SYNCHRONOUS | 1.65 A | Pipelined | 4 M x 18 | 2.3 mm | 18 | SRAM | 72 Mbit | 72 | Industrial | PARALLEL | DDR SRAM | 1.4 V | 1.3 V | SRAM | 22 mm | 14 mm | |||||||||||||||||||
![]() | GS81302S18E-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR-II | Compliant | Industrial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | -40 to 100 °C | Tray | GS81302S18E | SigmaSIO DDR-II | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 950 mA | Pipelined | 8 M x 18 | 22 Bit | SRAM | 144 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302Q07E-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | Industrial grade | 250 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 250 MHz | + 85 C | 1.9 V | - 40 C | -40 to 100 °C | Tray | GS81302Q07E | SigmaQuad-II+ B2 | Memory & Data Storage | 144 Mbit | 2 | 1.07 A | Pipelined | 16 M x 8 | 23 Bit | SRAM | 144 Mbit | Industrial | SRAM |
GS81302DT37E-450
GSI Technology
分类:Memory
GS881E36CGT-250I
GSI Technology
分类:Memory
GS8642Z18B-250M
GSI Technology
分类:Memory
GS88018CGT-150V
GSI Technology
分类:Memory
GS74116AGX-12E
GSI Technology
分类:Memory
GS81302Q08E-300M
GSI Technology
分类:Memory
GS8673ED18BGK-675
GSI Technology
分类:Memory
GS81302D08E-350I
GSI Technology
分类:Memory
GS81302Q10GE-250I
GSI Technology
分类:Memory
GS81302D38E-500
GSI Technology
分类:Memory
GS8128418B-200IV
GSI Technology
分类:Memory
GS880Z36CGT-150V
GSI Technology
分类:Memory
GS81302TT20E-400I
GSI Technology
分类:Memory
GS81302Q37GE-300
GSI Technology
分类:Memory
GS881E32CGT-250I
GSI Technology
分类:Memory
GS881Z18CD-250
GSI Technology
分类:Memory
GS842Z18CB-250I
GSI Technology
分类:Memory
GS81302D20GE-500
GSI Technology
分类:Memory
GS881E36CGD-250
GSI Technology
分类:Memory
GS81302DT38GE-500
GSI Technology
分类:Memory
GS81302T19GE-450
GSI Technology
分类:Memory
GS81302T08E-375I
GSI Technology
分类:Memory
GS8673ET18BGK-625I
GSI Technology
分类:Memory
GS81302S18E-350I
GSI Technology
分类:Memory
GS81302Q07E-250I
GSI Technology
分类:Memory
