品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 数据总线宽度 | 组织结构 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 记忆密度 | 最高频率 | 筛选水平 | 并行/串行 | 内存IC类型 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 访问模式 | 产品类别 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | GS73024AGB-8I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | YES | 119 | 119 | Compliant | 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, FPBGA-119 | 网格排列 | 3 | 128000 | PLASTIC/EPOXY | -40 °C | 未说明 | 8 ns | 85 °C | 有 | GS73024AGB-8I | 131072 words | 3.3 V | BGA | RECTANGULAR | GSI技术 | Obsolete | GSI TECHNOLOGY | 5.71 | BGA | e1 | 有 | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.32.00.41 | CMOS | 3.3 V | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | INDUSTRIAL | 1 | ASYNCHRONOUS | 128KX24 | 1.99 mm | 24 | 17 b | 3 Mb | 3145728 bit | PARALLEL | 标准SRAM | 3.6 V | 3.135 V | 22 mm | 14 mm | 无 | |||||||||||||||||||||||||||||||||||||||||
![]() | GS8640Z36GT-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 250 MHz | + 70 C | 3.6 V | 0 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | LQFP, | FLATPACK, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | 未说明 | 6.5 ns | 70 °C | 有 | GS8640Z36GT-250 | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.35 | QFP | Commercial grade | 153.8@Flow-Through/250@Pipelined MHz | 0 to 70 °C | Tray | GS8640Z36GT | e3 | 有 | 3A991.B.2.B | NBT Pipeline/Flow Through | 纯哑光锡 | 70 °C | 0 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | COMMERCIAL | 72 Mbit | 4 | SYNCHRONOUS | 255 mA, 360 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 36 | 1.6 mm | 36 | 21 Bit | SRAM | 72 Mbit | 75497472 bit | Commercial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | 无 | |||||||
![]() | GS72116AGU-7 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | YES | 48 | 48 | 未说明 | 7 ns | 70 °C | 有 | GS72116AGU-7 | 3.3 V | TFBGA | RECTANGULAR | GSI技术 | 不推荐 | GSI TECHNOLOGY | 5.22 | BGA | Commercial grade | FBGA | 3.3000 V | 3 V | Asynchronous | 128 kWords | 16 Bit | 3.6 V | 表面贴装 | Compliant | TFBGA, | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | 128000 | PLASTIC/EPOXY | 0 to 70 °C | e1 | 有 | 3A991.B.2.B | 锡银铜 | 70 °C | 0 °C | 8542.32.00.41 | CMOS | 3.3 V | BOTTOM | BALL | 260 | 1 | 0.75 mm | compliant | R-PBGA-B48 | 不合格 | COMMERCIAL | 1 | ASYNCHRONOUS | 128KX16 | 1.2 mm | 16 | 17 Bit | 2 Mbit | 2097152 bit | Commercial | PARALLEL | 标准SRAM | 3.6 V | 3 V | 8 mm | 6 mm | 无 | ||||||||||||||||||||||||||||||||
![]() | GS4288C18L-33I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 144 | 未说明 | 无 | GS4288C18L-33I | 16777216 words | 1.8 V | TBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.68 | BGA | Compliant | TBGA, | GRID ARRAY, THIN PROFILE | 16000000 | PLASTIC/EPOXY | 3A991.B.2.B | 95 °C | -40 °C | 自动刷新 | 8542.32.00.28 | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B144 | 1 | SYNCHRONOUS | 18 b | 16MX18 | 1.2 mm | 18 | 23 b | 288 Mb | 301989888 bit | 300 MHz | DDR DRAM | 1.9 V | 1.7 V | 多库页面突发 | 11 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302R36E-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | DDR-II | Commercial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 350 MHz | + 70 C | 1.9 V | 0 to 85 °C | Bulk | GS81302R36E | SigmaDDR-II B4 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 895 mA | Pipelined | 4 M x 36 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS78132AB-8 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-119 | YES | 119 | 119 | 3.6 V | 表面贴装 | Compliant | + 70 C | 3.6 V | 0 C | 21 | 3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SDR | BGA, | 网格排列 | 3 | 256000 | PLASTIC/EPOXY | 未说明 | 8 ns | 70 °C | 无 | GS78132AB-8 | 3.3 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.23 | BGA | Commercial grade | FBGA | 3.3000 V | 3 V | Asynchronous | 256 kWords | 32 Bit | 0 to 70 °C | GS78132AB | e0 | 无 | 3A991.B.2.B | Asynchronous | 锡铅 | 70 °C | 0 °C | THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT. | 8542.32.00.41 | Memory & Data Storage | CMOS | 3.3 V | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | COMMERCIAL | 8 Mbit | 4 | ASYNCHRONOUS | 260 mA | 8 ns | 256 k x 32 | 1.99 mm | 32 | 18 Bit | SRAM | 8 Mbit | 8388608 bit | Commercial | PARALLEL | 标准SRAM | 3.6 V | 3 V | SRAM | 22 mm | 14 mm | 无 | |||||||||||||
![]() | GS81302T09E-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | N | DDR-II | Commercial grade | 333 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 70 C | 1.9 V | 0 C | 0 to 85 °C | Tray | GS81302T09E | SigmaDDR-II B2 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 755 mA | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D18GE-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | QDR-II | Industrial grade | 250 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 250 MHz | + 85 C | 1.9 V | - 40 C | -40 to 100 °C | Tray | GS81302D18GE | SigmaQuad-II | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 710 mA | Pipelined | 8 M x 18 | 21 Bit | SRAM | 144 Mb | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D09GE-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | QDR-II | Commercial grade | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 0 to 85 °C | Tray | GS81302D09GE | SigmaQuad-II | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 815 mA | Pipelined | 16 M x 9 | 22 Bit | SRAM | 144 Mb | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302T08E-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | DDR-II | Compliant | Industrial grade | 300 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | -40 to 100 °C | Tray | GS81302T08E | SigmaDDR-II B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 700 mA | Pipelined | 16 M x 8 | 23 Bit | SRAM | 144 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302Q08GE-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | QDR-II | Industrial grade | 250 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 250 MHz | + 85 C | 1.9 V | -40 to 100 °C | Tray | GS81302Q08GE | SigmaQuad-II | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 1.07 A | Pipelined | 16 M x 8 | 23 Bit | SRAM | 144 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302QT10E-318 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | Commercial grade | 表面贴装 | 1.9 V | 9 Bit | 16 MWords | Synchronous | 1.7 V | 1.8000 V | QDR | FBGA | 318 MHz | Compliant | 有 | 318 MHz | + 70 C | 1.9 V | 0 to 85 °C | Bulk | GS81302QT10E | SigmaQuad-II+ B2 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 1.265 A | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D18GE-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | QDR-II | Commercial grade | 375 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 375 MHz | + 70 C | 1.9 V | 0 to 85 °C | Bulk | GS81302D18GE | SigmaQuad-II | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 995 mA | Pipelined | 8 M x 18 | 21 Bit | SRAM | 144 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D36GE-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | 165 | 333 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | QDR-II | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 4000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS81302D36GE-333I | 1.8 V | LBGA | RECTANGULAR | 不推荐 | GSI TECHNOLOGY | 5.33 | BGA | Industrial grade | -40 to 100 °C | Tray | GS81302D36GE | e1 | 有 | 3A991.B.2.B | SigmaQuad-II | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 144 Mbit | 2 | SYNCHRONOUS | 1.01 A | Pipelined | 4 M x 36 | 1.5 mm | 36 | 20 Bit | SRAM | 144 Mbit | 150994944 bit | Industrial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 17 mm | 15 mm | 无 | ||||||
![]() | GS81302R36GE-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | Details | DDR-II | Commercial grade | 250 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 250 MHz | + 70 C | 1.9 V | 0 C | 0 to 85 °C | Tray | GS81302R36GE | SigmaDDR-II B4 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 670 mA | Pipelined | 4 M x 36 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302R09GE-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | DDR-II | Commercial grade | 250 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 250 MHz | + 70 C | 1.9 V | 0 to 85 °C | Tray | GS81302R09GE | SigmaDDR-II B4 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 595 mA | Pipelined | 16 M x 9 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT06E-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | Industrial grade | 400 MHz | FBGA | QDR | 1.8000 V | Synchronous | 16 MWords | 8 Bit | 表面贴装 | Compliant | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | -40 to 100 °C | Bulk | GS81302DT06E | SigmaQuad-II+ | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 1.065 A | Pipelined | 16 M x 8 | 22 Bit | SRAM | 144 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302T36E-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | YES | 165 | 165 | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | LBGA, | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS81302T36E-250I | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 不推荐 | GSI TECHNOLOGY | 5.33 | BGA | 250 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 250 MHz | FBGA | DDR | 1.8000 V | 1.7 V | -40 to 100 °C | GS81302T36E | 无 | 3A991.B.2.B | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 144 Mbit | 2 | SYNCHRONOUS | 680 mA | Pipelined | 4MX36 | 1.5 mm | 36 | 22 Bit | 144 Mbit | 150994944 bit | Industrial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | 17 mm | 15 mm | 无 | ||||||||||||||||||||
![]() | GS81302DT11E-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | Commercial grade | 400 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 400 MHz | + 70 C | 1.9 V | 0 to 85 °C | Bulk | GS81302DT11E | SigmaQuad-II+ | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 1.055 A | Pipelined | 16 M x 9 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS4288C18L-24I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 144 | Compliant | 95 °C | -40 °C | 1.8 V | 18 b | 23 b | 288 Mb | 400 MHz | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS78132AGB-10I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-119 | YES | 119 | 119 | 32 Bit | 3.6 V | 表面贴装 | + 85 C | 3.6 V | - 40 C | 21 | 3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | Details | SDR | BGA, | 网格排列 | 3 | 256000 | PLASTIC/EPOXY | -40 °C | 未说明 | 10 ns | 85 °C | 有 | GS78132AGB-10I | 3.3 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.23 | BGA | Industrial grade | FBGA | 3.3000 V | 3 V | Asynchronous | 256 kWords | -40 to 85 °C | GS78132AGB | e1 | 有 | 3A991.B.2.B | Asynchronous | 锡银铜 | THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT. | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | INDUSTRIAL | 8 Mbit | 4 | ASYNCHRONOUS | 230 mA | 10 ns | 256 k x 32 | 1.99 mm | 32 | 18 Bit | SRAM | 8 Mbit | 8388608 bit | Industrial | PARALLEL | 标准SRAM | 3.6 V | 3 V | SRAM | 22 mm | 14 mm | ||||||||||||||||
![]() | GS81302D36GE-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | QDR-II | Commercial grade | 333 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 70 C | 1.9 V | 0 C | 0 to 85 °C | Tray | GS81302D36GE | SigmaQuad-II | Memory & Data Storage | 144 Mbit | 2 | 1 A | Pipelined | 4 M x 36 | 20 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS71108AU-7I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | YES | 48 | 48 | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | 128000 | PLASTIC/EPOXY | -40 °C | 未说明 | 7 ns | 85 °C | 无 | GS71108AU-7I | 3.3 V | TFBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.22 | BGA | Industrial grade | FBGA | 3.3000 V | 3 V | Asynchronous | 128 kWords | 8 Bit | 3.6 V | 表面贴装 | 240 | GSI技术 | GSI技术 | TFBGA, | -40 to 85 °C | GS71108AGU | 无 | 3A991.B.2.B | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 0.75 mm | compliant | R-PBGA-B48 | 不合格 | INDUSTRIAL | 1 | ASYNCHRONOUS | 128KX8 | 1.2 mm | 8 | 17 Bit | SRAM | 1 Mbit | 1048576 bit | Industrial | PARALLEL | 标准SRAM | 3.6 V | 3 V | SRAM | 8 mm | 6 mm | ||||||||||||||||||||||||||||||||
![]() | GS81302QT37GE-318I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | Industrial grade | 318 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 318 MHz | + 85 C | 1.9 V | - 40 C | -40 to 100 °C | Tray | GS81302QT37GE | SigmaQuad-II+ B2 | Memory & Data Storage | 144 Mbit | 2 | 1.45 A | Pipelined | 4 M x 36 | 21 Bit | SRAM | 144 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302T08E-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 350 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 350 MHz | 0 to 85 °C | 144 Mbit | 2 | 800 mA | Pipelined | 16 M x 8 | 23 Bit | 144 Mbit | Commercial |
GS73024AGB-8I
GSI Technology
分类:Memory
GS8640Z36GT-250
GSI Technology
分类:Memory
GS72116AGU-7
GSI Technology
分类:Memory
GS4288C18L-33I
GSI Technology
分类:Memory
GS81302R36E-350
GSI Technology
分类:Memory
GS78132AB-8
GSI Technology
分类:Memory
GS81302T09E-333
GSI Technology
分类:Memory
GS81302D18GE-250I
GSI Technology
分类:Memory
GS81302D09GE-300
GSI Technology
分类:Memory
GS81302T08E-300I
GSI Technology
分类:Memory
GS81302Q08GE-250I
GSI Technology
分类:Memory
GS81302QT10E-318
GSI Technology
分类:Memory
GS81302D18GE-375
GSI Technology
分类:Memory
GS81302D36GE-333I
GSI Technology
分类:Memory
GS81302R36GE-250
GSI Technology
分类:Memory
GS81302R09GE-250
GSI Technology
分类:Memory
GS81302DT06E-400I
GSI Technology
分类:Memory
GS81302T36E-250I
GSI Technology
分类:Memory
GS81302DT11E-400
GSI Technology
分类:Memory
GS4288C18L-24I
GSI Technology
分类:Memory
GS78132AGB-10I
GSI Technology
分类:Memory
GS81302D36GE-333
GSI Technology
分类:Memory
GS71108AU-7I
GSI Technology
分类:Memory
GS81302QT37GE-318I
GSI Technology
分类:Memory
GS81302T08E-350
GSI Technology
分类:Memory
