品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8672T37BE-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR-II | Compliant | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | Tray | GS8672T37BE | SigmaDDR-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 1.2 A | 2 M x 36 | 21 b | SRAM | 72 Mb | 72 | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D09BD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | Compliant | Industrial grade | 333 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8342D09BD | SigmaQuad-II | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 615 mA | Pipelined | 4 M x 9 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672Q36BE-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | 165 | QDR-II | Compliant | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 0.45 ns | 85 °C | 无 | GS8672Q36BE-200I | 200 MHz | 2097152 words | 1.8 V | LBGA | RECTANGULAR | Obsolete | GSI TECHNOLOGY | 5.49 | BGA | 有 | 200 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Tray | GS8672Q36BE | 3A991.B.2.B | SigmaQuad-II | 100 °C | -40 °C | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 72 Mbit | 2 | SYNCHRONOUS | 1.12 A | 2 M x 36 | 3-STATE | 1.5 mm | 36 | 20 b | SRAM | 72 Mb | 72 | PARALLEL | SEPARATE | 标准SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 17 mm | 15 mm | 无 | ||||||||||||||||||||||||
![]() | GS8342QT19BGD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 250 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 有 | GS8342QT19BGD-250 | 250 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.22 | BGA | Commercial grade | 250 MHz | 0 to 85 °C | Tray | GS8342QT19BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad-II+ B2 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 36 Mbit | 2 | SYNCHRONOUS | 665 mA | Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 20 Bit | SRAM | 36 Mb | 37748736 bit | Commercial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||
![]() | GS8342D10BD-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 9 Bit | 1.9 V | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 无 | GS8342D10BD-350 | 350 MHz | 4194304 words | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.22 | BGA | 350 MHz | FBGA | 1.8000 V | 1.7 V | Synchronous | 0 to 85 °C | Tray | GS8342D10BD | 3A991.B.2.B | SigmaQuad-II+ B4 | 85 °C | 0 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 36 Mbit | 2 | SYNCHRONOUS | 665 mA | 0.45 | 4 M x 9 | 3-STATE | 1.4 mm | 9 | 20 b | SRAM | 36 Mb | 0.22 A | 36 | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||
![]() | GS816118DGD-333IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 2, 2.7 V | 表面贴装 | Compliant | 333 MHz | + 100 C | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | LBGA, | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 5 ns | 85 °C | 有 | GS816118DGD-333IV | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.26 | BGA | Industrial grade | 200@Flow-Through/333@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 18 Bit | -40 to 100 °C | Bulk | 3A991.B.2.B | 100 °C | -40 °C | ALSO OPERATES AT 2.5V | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | INDUSTRIAL | 18 Mbit | 2 | SYNCHRONOUS | 240 mA, 300 mA | 5 ns | Flow-Through/Pipelined | 1 M x 18 | 1.4 mm | 18 | 20 Bit | 18 Mbit | 18874368 bit | Industrial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | 15 mm | 13 mm | 无 | |||||||||||||||||||||||||
![]() | GS8672Q18BGE-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | 165 | SigmaQuad-II | Details | QDR-II | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8672Q18BGE-300I | 300 MHz | 4194304 words | 1.8 V | LBGA | RECTANGULAR | Obsolete | GSI TECHNOLOGY | 5.43 | BGA | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | Tray | GS8672Q18BGE | 3A991.B.2.B | SigmaQuad-II | 100 °C | -40 °C | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 72 Mbit | 2 | SYNCHRONOUS | 1.12 A | 4 M x 18 | 3-STATE | 1.5 mm | 18 | 21 b | SRAM | 72 Mb | 75497472 bit | PARALLEL | SEPARATE | 标准SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 17 mm | 15 mm | 无 | ||||||||||||||||||||||
![]() | GS832118AD-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 150 MHz | + 70 C | 3.6 V | 0 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 7.5 ns | 85 °C | 无 | GS832118AD-150 | 150 MHz | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.16 | BGA | Commercial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 0 to 85 °C | Tray | GS832118AD | 3A991.B.2.B | Pipeline/Flow Through | 85 °C | 0 °C | PIPELINE OR FLOW THROUGH ARCHITECTUREL; ALSO OPERATES AT 3.3 V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | OTHER | 36 Mbit | 2 | SYNCHRONOUS | 175 mA, 190 mA | 7.5 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 21 Bit | SRAM | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||
![]() | GS8342D09BD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | Synchronous | 4 MWords | 9 Bit | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | Compliant | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 0.45 ns | 85 °C | 无 | GS8342D09BD-350I | 350 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.35 | BGA | Industrial grade | 350 MHz | FBGA | QDR | 1.8000 V | -40 to 100 °C | Tray | GS8342D09BD | 3A991.B.2.B | SigmaQuad-II | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 675 mA | Pipelined | 4 M x 9 | 3-STATE | 1.4 mm | 9 | 20 Bit | SRAM | 36 Mbit | 0.23 A | 37748736 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||||||||
![]() | GS8162Z18DD-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 70 C | 2.7 V | 0 C | 18 | 1.7 V | 0 to 85 °C | Tray | GS8162Z18DD | NBT Pipeline/Flow Through | 85 °C | 0 °C | Memory & Data Storage | 18 Mbit | 2 | 190 mA, 195 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 18 | 20 Bit | SRAM | 18 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342TT11BD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Compliant | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8342TT11BD-350I | 350 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | BGA | Industrial grade | 350 MHz | -40 to 100 °C | Tray | GS8342TT11BD | e0 | 3A991.B.2.B | SigmaQuad-II+ | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 1 | SYNCHRONOUS | 575 mA | Pipelined | 4 M x 9 | 3-STATE | 1.4 mm | 9 | 21 Bit | SRAM | 36 Mbit | 37748736 bit | Industrial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||
![]() | GS832236AB-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | Synchronous | 36 Bit | 2.7, 3.6 V | 有 | 200 MHz | + 70 C | 3.6 V | 0 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | BGA, BGA119,7X17,50 | 网格排列 | 1000000 | PLASTIC/EPOXY | BGA119,7X17,50 | 未说明 | 6.5 ns | 70 °C | 无 | GS832236AB-200 | 200 MHz | 1048576 words | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.12 | BGA | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | 2.5, 3.3 V | 2.3, 3 V | 0 to 85 °C | Tray | GS832236AB | e0 | 无 | 3A991.B.2.B | Pipeline/Flow Through | Tin/Lead (Sn/Pb) | 85 °C | 0 °C | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | 2.5/3.3 V | COMMERCIAL | 36 Mbit | 4 | SYNCHRONOUS | 205 mA, 240 mA | 6.5@Flow-Through/3@P | 1 M x 36 | 3-STATE | 1.99 mm | 36 | 20 b | SRAM | 36 Mb | 0.03 A | 36 | Commercial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | 无 | ||||||||
![]() | GS8342D08BD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | N | DDR | Commercial grade | 333 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8342D08BD | SigmaQuad-II | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 605 mA | Pipelined | 4 M x 8 | 20 Bit | SRAM | 36 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182Q36BD-133I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | Compliant | LBGA, | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.5 ns | 85 °C | 无 | GS8182Q36BD-133I | 524288 words | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.19 | BGA | 有 | 133 MHz | + 85 C | 1.9 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | Tray | GS8182Q36BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | not_compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 18 Mbit | 2 | SYNCHRONOUS | 425 mA | 512 k x 36 | 1.4 mm | 36 | 18 b | SRAM | 18 Mb | 18874368 bit | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||||||||||||||
![]() | GS8182Q08BGD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | 18 | 0 C | 1.9 V | + 70 C | 300 MHz | 有 | Commercial grade | 300 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 8 Bit | 1.9 V | 表面贴装 | DDR | Details | SigmaQuad-II | GSI技术 | GSI技术 | Parallel | SMD/SMT | 0 to 70 °C | Tray | GS8182Q08BGD | SigmaQuad-II | 70 °C | 0 °C | Memory & Data Storage | 1.8 V | 18 Mbit | 2 | 800 mA | Pipelined | 2 M x 8 | 20 Bit | SRAM | 18 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342Q07BGD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 250 MHz | 1.8000 V | 1.7 V | Synchronous | 8 Bit | 1.9 V | 有 | 250 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | -40 to 100 °C | Tray | GS8342Q07BGD | SigmaQuad-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 675 mA | 0.45 | 4 M x 8 | 21 b | SRAM | 36 Mb | 36 | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182D36BD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | GSI技术 | GSI技术 | SigmaQuad-II | DDR | Compliant | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | Tray | GS8182D36BD | SigmaQuad-II | 70 °C | 0 °C | Memory & Data Storage | 1.8 V | 18 Mbit | 2 | 595 mA | 512 k x 36 | 17 b | SRAM | 18 Mb | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342DT37BGD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8342DT37BGD-300I | 300 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.35 | BGA | Industrial grade | -40 to 100 °C | Tray | GS8342DT37BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad-II+ B4 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 100 °C | -40 °C | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 685 mA | Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 18 Bit | SRAM | 36 Mbit | 37748736 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||
![]() | GS8342S08BGD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 250 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO-II | Details | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 有 | GS8342S08BGD-250 | 250 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | BGA | Commercial grade | 250 MHz | FBGA | 0 to 85 °C | Tray | GS8342S08BGD | 3A991.B.2.B | SigmaSIO DDR-II | 85 °C | 0 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 36 Mbit | 2 | SYNCHRONOUS | 460 mA | Pipelined | 4 M x 8 | 3-STATE | 1.4 mm | 8 | 21 Bit | SRAM | 36 Mbit | 0.185 A | 33554432 bit | Commercial | PARALLEL | SEPARATE | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||||
![]() | GS8672T38BGE-550I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | 有 | 550 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | Tray | GS8672T38BGE | SigmaDDR-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 1.87 A | 2 M x 36 | 20 b | SRAM | 72 Mb | 72 | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8320Z36AGT-150I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks, 5 Days | TQFP-100 | YES | 100 | 100 | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 150 MHz | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 1000000 | PLASTIC/EPOXY | QFP100,.63X.87 | -40 °C | 未说明 | 7.5 ns | 85 °C | 有 | GS8320Z36AGT-150I | 150 MHz | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 1.69 | QFP | Industrial grade | 133.3@Flow-Through/150@Pipelined MHz | -40 to 100 °C | Tray | GS8320Z36AGT | 3A991.B.2.B | NBT Pipeline/Flow Through | 100 °C | -40 °C | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 36 Mbit | 4 | SYNCHRONOUS | 210 mA, 220 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 36 | 3-STATE | 1.6 mm | 36 | 20 Bit | SRAM | 36 Mbit | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | 无 | ||||||||
![]() | GS8182S36BGD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | Details | DDR | Commercial grade | 300 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 512 kWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 18 | 1.7 V | 0 to 70 °C | Tray | GS8182S36BGD | SigmaSIO DDR-II | 70 °C | 0 °C | Memory & Data Storage | 1.8 V | 18 Mbit | 2 | 595 mA | Pipelined | 512 k x 36 | 18 Bit | SRAM | 18 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321Z18AGD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 200 MHz | + 70 C | 3.6 V | 0 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | 未说明 | 85 °C | 有 | GS8321Z18AGD-200 | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.3 | BGA | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 0 to 85 °C | Tray | GS8321Z18AGD | e1 | 有 | 3A991.B.2.B | NBT | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | OTHER | 36 Mbit | 2 | SYNCHRONOUS | 185 mA, 220 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 18 | 1.4 mm | 18 | 21 Bit | SRAM | 36 Mb | 37748736 bit | Commercial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | 无 | |||||||||||||
![]() | GS8162Z18DGD-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Industrial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 85 C | 2.7 V | - 40 C | 18 | 1.7 V | -40 to 100 °C | Tray | GS8162Z18DGD | NBT Pipeline/Flow Through | 100 °C | -40 °C | Memory & Data Storage | 18 Mbit | 2 | 210 mA, 215 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 18 | 20 Bit | SRAM | 18 Mb | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832236AGB-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 250 MHz | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | BGA, BGA119,7X17,50 | 网格排列 | 3 | 1000000 | PLASTIC/EPOXY | BGA119,7X17,50 | 未说明 | 5.5 ns | 70 °C | 有 | GS832236AGB-250 | 250 MHz | 2.5 V | BGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.12 | BGA | Commercial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 0 to 85 °C | Bulk | e1 | 有 | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | 2.5/3.3 V | COMMERCIAL | 36 Mbit | 4 | SYNCHRONOUS | 230 mA, 285 mA | 5.5 ns | Flow-Through/Pipelined | 1 M x 36 | 3-STATE | 1.99 mm | 36 | 20 Bit | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | 22 mm | 14 mm | 无 |
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