品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8342D19BGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Industrial grade | 333 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8342D19BGD | SigmaQuad-II+ B4 | Memory & Data Storage | 36 Mbit | 2 | 615 mA | Pipelined | 2 M x 18 | 19 Bit | SRAM | 36 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342Q19BD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 200 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | Commercial grade | 0 to 85 °C | 2 | Pipelined | 20 Bit | 36 Mbit | Commercial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS880E32CGT-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | 表面贴装 | 2.7, 3.6 V | 32 Bit | 256 kWords | Synchronous | 2.3, 3 V | 2.5, 3.3 V | SDR | TQFP | 有 | 300 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | QFP100,.63X.87 | -40 °C | 未说明 | 5 ns | 85 °C | 有 | GS880E32CGT-300I | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.61 | QFP | Industrial grade | 200@Flow-Through/300@Pipelined MHz | -40 to 85 °C | Tray | GS880E32CGT | e3 | 有 | 3A991.B.2.B | DCD | 纯哑光锡 | PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 9 Mbit | 2 | SYNCHRONOUS | 185 mA, 245 mA | 5 ns | Flow-Through/Pipelined | 256 k x 32 | 3-STATE | 1.6 mm | 32 | 18 Bit | SRAM | 8 Mbit | 0.045 A | 8388608 bit | Industrial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | |||
![]() | GS8161Z36DD-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 200 MHz | + 85 C | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | -40 to 100 °C | 18 Mbit | 4 | 225 mA, 230 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 36 | 19 Bit | 18 Mbit | Industrial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342T36BGD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaCIO DDR-II | Details | DDR | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8342T36BGD | SigmaDDR-II B2 | Memory & Data Storage | 36 Mbit | 1 | 770 mA | Pipelined | 1 M x 36 | 20 Bit | SRAM | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816236DD-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 150 MHz | + 70 C | 2.7 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 0 to 85 °C | 18 Mbit | 4 | 175 mA, 190 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 36 | 19 Bit | 18 Mbit | Commercial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS882Z36CD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | Commercial grade | 200@Flow-Through/300@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 300 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | 0 to 70 °C | Tray | GS882Z36CD | NBT Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 4 | 165 mA, 225 mA | 5 ns | Flow-Through/Pipelined | 256 k x 36 | 18 Bit | SRAM | 9 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342Q10BD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 250 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 250 MHz | FBGA | QDR | 0 to 85 °C | 36 Mbit | 2 | 665 mA | Pipelined | 4 M x 9 | 21 Bit | 36 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881Z32CGT-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 32 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 300 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | -40 °C | 未说明 | 5 ns | 85 °C | 有 | GS881Z32CGT-300I | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.53 | QFP | Industrial grade | 200@Flow-Through/300@Pipelined MHz | TQFP | -40 to 85 °C | Tray | GS881Z32CGT | e3 | 有 | 3A991.B.2.B | NBT Pipeline/Flow Through | Matte Tin (Sn) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | INDUSTRIAL | 9 Mbit | 1 | SYNCHRONOUS | 185 mA, 245 mA | 5 ns | Flow-Through/Pipelined | 256 k x 32 | 1.6 mm | 32 | 18 Bit | SRAM | 8 Mbit | 8388608 bit | Industrial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | |||||||||
![]() | GS8161Z32DD-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | + 85 C | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | LBGA, | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 5.5 ns | 85 °C | 无 | GS8161Z32DD-250IV | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.3 | BGA | Industrial grade | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 32 Bit | 2, 2.7 V | 表面贴装 | 250 MHz | -40 to 100 °C | 3A991.B.2.B | FLOW THROUGH AND PIPELINED ARCHITECTURE, ALSO OPERATES AT 2.5V | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | INDUSTRIAL | 18 Mbit | 4 | SYNCHRONOUS | 245 mA, 265 mA | 5.5 ns | Flow-Through/Pipelined | 512 k x 32 | 1.4 mm | 32 | 18 Mbit | 33554432 bit | Industrial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | 15 mm | 13 mm | ||||||||||||||||||||||||||||
![]() | GS8342TT20BGD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8342TT20BGD | SigmaQuad-II+ | Memory & Data Storage | 36 Mbit | 1 | 600 mA | Pipelined | 2 M x 18 | 20 Bit | SRAM | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D20BGD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 有 | GS8342D20BGD-400 | 400 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.2 | BGA | Commercial grade | 400 MHz | FBGA | 0 to 85 °C | Tray | GS8342D20BGD | 3A991.B.2.B | SigmaQuad-II+ | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 36 Mbit | 2 | SYNCHRONOUS | 705 mA | Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 19 Bit | SRAM | 36 Mbit | 0.225 A | 75497472 bit | Commercial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||
![]() | GS8321E36AD-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | Parallel | SMD/SMT | 2.3 V | 0 C | 3.6 V | + 70 C | 150 MHz | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 7.5 ns | 85 °C | 无 | GS8321E36AD-150 | 150 MHz | 2.5 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.31 | BGA | Commercial grade | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 0 to 85 °C | e0 | 无 | 3A991.B.2.B | 锡铅 | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | SRAMs | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | OTHER | 36 Mbit | 4 | SYNCHRONOUS | 190 mA, 200 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | 15 mm | 13 mm | ||||||||||||||||||
![]() | GS8672D37BE-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | 165 | PLASTIC/EPOXY | -40 °C | 0.45 ns | 85 °C | GS8672D37BE-333I | 2097152 words | 1.8 V | LBGA | RECTANGULAR | Obsolete | GSI TECHNOLOGY | 5.84 | BGA | QDR-II | SigmaQuad-II+ | GSI技术 | GSI技术 | Parallel | SMD/SMT | 1.7 V | 15 | - 40 C | 1.9 V | + 85 C | 333 MHz | 有 | LBGA, | GRID ARRAY, LOW PROFILE | 2000000 | Tray | GS8672D37BE | 3A991.B.2.B | SigmaQuad-II+ | 管道结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 72 Mbit | SYNCHRONOUS | 1.62 A | 2 M x 36 | 1.5 mm | 36 | SRAM | 72 | PARALLEL | 标准SRAM | 1.9 V | 1.7 V | SRAM | 17 mm | 15 mm | ||||||||||||||||||||||||||||||||||
![]() | GS8321E32AD-150I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | SyncBurst | SDR | Industrial grade | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 32 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 150 MHz | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | -40 to 100 °C | Tray | GS8321E32AD | DCD Pipeline/Flow Through | Memory & Data Storage | 36 Mbit | 4 | 210 mA, 220 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 32 | SRAM | 36 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342T38BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | Industrial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8342T38BGD | SigmaQuad-II+ | Memory & Data Storage | 36 Mbit | 1 | 780 mA | Pipelined | 1 M x 36 | 19 Bit | SRAM | 36 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8162Z36DGD-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 250 MHz | + 70 C | 2.7 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 0 to 85 °C | GS8162Z36DGD | 18 Mbit | 4 | 225 mA, 245 mA | 5.5 ns | Flow-Through/Pipelined | 512 k x 36 | 19 Bit | 18 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342TT19BD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 表面贴装 | 300 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 300 MHz | FBGA | DDR | 1.8000 V | Synchronous | 2 MWords | 18 Bit | -40 to 100 °C | 36 Mbit | 1 | 460 mA | Pipelined | 2 M x 18 | 20 Bit | 36 Mbit | Industrial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D38BD-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 350 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 350 MHz | FBGA | QDR | 0 to 85 °C | 36 Mbit | 2 | 850 mA | Pipelined | 1 M x 36 | 18 Bit | 36 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342TT37BD-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 36 Bit | 1.9 V | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 无 | GS8342TT37BD-350 | 350 MHz | 1048576 words | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.22 | BGA | 350 MHz | FBGA | 1.8000 V | 1.7 V | Synchronous | 0 to 85 °C | Tray | GS8342TT37BD | e0 | 3A991.B.2.B | SigmaDDR-II+ B2 | Tin/Lead (Sn/Pb) | PIPELINED ARCHITECTURE, LATE WRITE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 36 Mbit | SYNCHRONOUS | 725 mA | 0.45 | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 19 Bit | SRAM | 36 | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||||||
![]() | GS8342T09BGD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaCIO DDR-II | Details | DDR | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8342T09BGD | SigmaDDR-II B2 | Memory & Data Storage | 36 Mbit | 1 | 600 mA | Pipelined | 4 M x 9 | 21 Bit | SRAM | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8320E36AGT-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | -40 to 100 °C | Tray | GS8320E36AGT | Pipeline/Flow Through | Memory & Data Storage | 36 Mbit | 4 | 250 mA, 305 mA | 5.5 ns | Flow-Through/Pipelined | 1 M x 36 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182Q36BD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 512000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | 无 | GS8182Q36BD-250 | 524288 words | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.19 | BGA | 有 | 250 MHz | + 70 C | 1.9 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | LBGA, | GRID ARRAY, LOW PROFILE | Tray | GS8182Q36BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | not_compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 18 Mbit | SYNCHRONOUS | 660 mA | 512 k x 36 | 1.4 mm | 36 | SRAM | 18874368 bit | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||||||||||||||||||||||
![]() | GS880Z36CGT-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | -40 °C | 未说明 | 5.5 ns | 85 °C | 有 | GS880Z36CGT-250I | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.8 | QFP | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | TQFP | -40 to 85 °C | Tray | GS880Z36CGT | e3 | 有 | 3A991.B.2.B | NBT | Matte Tin (Sn) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | INDUSTRIAL | 9 Mbit | 1 | SYNCHRONOUS | 175 mA, 215 mA | 5.5 ns | Flow-Through/Pipelined | 256 k x 36 | 1.6 mm | 36 | 18 Bit | SRAM | 9 Mbit | 9437184 bit | Industrial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | |||||||||
![]() | GS8182Q36BD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.19 | BGA | 250 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | LBGA, | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8182Q36BD-250I | 524288 words | 1.8 V | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | not_compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 18 Mbit | SYNCHRONOUS | 670 mA | 512 k x 36 | 1.4 mm | 36 | 18874368 bit | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | 15 mm | 13 mm |
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