品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 组织的记忆 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | GS8342T36BGD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaCIO DDR-II | DDR | Industrial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Bulk | GS8342T36BGD | SigmaDDR-II B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 1 | 735 mA | Pipelined | 1 M x 36 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672T19BGE-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | - 40 C | 1.7 V | SMD/SMT | Parallel | Compliant | 375 MHz | + 85 C | 1.9 V | Bulk | 100 °C | -40 °C | 1.8 V | 72 Mbit | 2 | 1.04 A | 4 M x 18 | 22 b | 72 Mb | 72 | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321E18AD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 200 MHz | + 70 C | 3.6 V | 0 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 6.5 ns | 85 °C | 无 | GS8321E18AD-200 | 200 MHz | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.31 | BGA | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 0 to 85 °C | Bulk | GS8321E18AD | e0 | 无 | 3A991.B.2.B | DCD Pipeline/Flow Through | 锡铅 | 85 °C | 0 °C | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | OTHER | 36 Mbit | 2 | SYNCHRONOUS | 185 mA, 220 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 21 Bit | SRAM | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | 无 | |||||||||||||||||
![]() | GS8182S09BD-167 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR | Compliant | 有 | 167 MHz | + 70 C | 1.9 V | 0 C | 18 | Tray | GS8182S09BD | SigmaSIO DDR-II | 70 °C | 0 °C | Memory & Data Storage | 1.8 V | 18 Mbit | 2 | 315 mA | 2 M x 9 | 20 b | SRAM | 18 Mb | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88036CGT-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | TQFP-100 | YES | 100 | 100-TQFP (20x14) | 100 | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 300 MHz | + 85 C | 3.6 V | - 40 C | GSI Technology Inc. | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Tray | GS88036 | 活跃 | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | QFP100,.63X.87 | -40 °C | 未说明 | 5 ns | 85 °C | 有 | GS88036CGT-300I | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 1.66 | QFP | Industrial grade | 200@Flow-Through/300@Pipelined MHz | -40 to 85 °C | Tray | GS88036CGT | e3 | 有 | 3A991.B.2.B | Pipeline/Flow Through | 纯哑光锡 | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | SRAM - Synchronous, Standard | 2.3V ~ 2.7V, 3V ~ 3.6V | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 9 Mbit | 4 | SYNCHRONOUS | 300 MHz | 185 mA, 245 mA | 5 ns | SRAM | Parallel | Flow-Through/Pipelined | 256 k x 36 | 3-STATE | 1.6 mm | 36 | - | 18 Bit | SRAM | 9 Mbit | 0.045 A | 9437184 bit | Industrial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 256K x 36 | 20 mm | 14 mm | ||||||
![]() | GS8182D18BGD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | BGA-165 | YES | 165 | 165-FPBGA (15x13) | 165 | Details | DDR | Tray | GSI Technology Inc. | GS8182D18 | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 1000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8182D18BGD-300I | 1048576 words | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.65 | BGA | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | -40°C ~ 85°C (TA) | Tray | GS8182D18BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad-II | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | SRAM - Quad Port, Synchronous | 1.7V ~ 1.9V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 18 Mbit | SYNCHRONOUS | 300 MHz | 495 mA | SRAM | Parallel | 1 M x 18 | 1.4 mm | 18 | - | SRAM | 18874368 bit | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 1M x 18 | 15 mm | 13 mm | ||||||||||||||||||||||||||||
![]() | GS832018AGT-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-LQFP | 100 | 100-TQFP (20x14) | GSI Technology Inc. | 181.8@Flow-Through/250@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | Tray | GS832018 | 活跃 | Volatile | 250 MHz | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | Industrial grade | -40 to 100 °C | - | SRAM - Synchronous, Standard | 2.3V ~ 2.7V, 3V ~ 3.6V | 36Mbit | 2 | 250 MHz | 235 mA, 275 mA | 5.5 ns | SRAM | Parallel | Flow-Through/Pipelined | 2 M x 18 | - | 21 Bit | 36 Mbit | Industrial | 2M x 18 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816136DD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | 未说明 | 5.5 ns | 70 °C | 无 | GS816136DD-250 | 524288 words | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.26 | BGA | Compliant | 有 | 250 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | LBGA, | Bulk | GS816136DD | 3A991.B.2.B | Pipeline/Flow Through | 70 °C | 0 °C | FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | COMMERCIAL | 18 Mbit | 4 | SYNCHRONOUS | 230 mA, 250 mA | 5.5 ns | 512 k x 36 | 1.4 mm | 36 | 19 b | SRAM | 18 Mb | 18874368 bit | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||||||||||||||||||||||||||||||
![]() | GS8672Q37BE-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | GSI技术 | GSI技术 | Parallel | SMD/SMT | 1.7 V | 15 | 0 C | Compliant | 有 | 450 MHz | + 70 C | 1.9 V | QDR-II | SigmaQuad-II+ | Tray | GS8672Q37BE | SigmaQuad-II+ | 70 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 2.05 A | 2 M x 36 | 20 b | SRAM | 72 Mb | 72 | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8160E18DGT-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | 1.7 V | 18 | 0 C | 2.7 V | + 85 C | 200 MHz | 有 | Commercial grade | 200 MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | Compliant | SDR | SyncBurst | GSI技术 | GSI技术 | Parallel | SMD/SMT | 0 to 70 °C | Tray | GS8160E18DGT | DCD Synchronous Burst | Memory & Data Storage | 18 Mbit | 2 | 190 mA, 195 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 18 | 20 Bit | SRAM | 18 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672T19BE-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR-II | Compliant | 有 | 375 MHz | + 85 C | 1.9 V | - 40 C | 15 | Bulk | GS8672T19BE | SigmaDDR-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 1.04 A | 4 M x 18 | 22 b | SRAM | 72 Mb | 72 | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS880F18CGT-6.5 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | QFP100,.63X.87 | 未说明 | 6.5 ns | 70 °C | 有 | GS880F18CGT-6.5 | 153 MHz | 524288 words | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | QFP | Compliant | 有 | + 70 C | 3.6 V | 0 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Tray | GS880F18CGT | e3 | 有 | 3A991.B.2.B | 流过 | 纯哑光锡 | 70 °C | 0 °C | FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 2.5/3.3 V | COMMERCIAL | 9 Mbit | 2 | SYNCHRONOUS | 130 mA | 6.5 ns | 512 k x 18 | 3-STATE | 1.6 mm | 18 | 18 b | SRAM | 9 Mb | 0.025 A | 9437184 bit | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | 无 | |||||||||||||||||||||||||||||
![]() | GS8672T20BE-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR-II | Compliant | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | Bulk | GS8672T20BE | SigmaDDR-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 1.09 A | 4 M x 18 | 21 b | SRAM | 72 Mb | 72 | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161Z18DGD-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 70 C | 0 C | 18 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 7.5 ns | 70 °C | GS8161Z18DGD-150V | LBGA | RECTANGULAR | GSI TECHNOLOGY | FBGA | 1.8, 2.5 V | Synchronous | Compliant | 2.7 V | 1.7 V | NBT SRAM | 未说明 | 有 | 1.8 V | 活跃 | 5.26 | BGA | Commercial grade | 133.3@Flow-Through/150@Pipelined MHz | SDR | 1.7, 2.3 V | 1 MWords | 18 Bit | 0 to 85 °C | Bulk | GS8161Z18DGD | 3A991.B.2.B | NBT | 85 °C | 0 °C | FLOW THROUGH AND PIPELINED ARCHITECTURE, ALSO OPERATES AT 2.5V | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | COMMERCIAL | 18 Mbit | 2 | SYNCHRONOUS | 160 mA, 180 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 18 | 1.4 mm | 18 | 20 Bit | SRAM | 18 Mbit | 18874368 bit | Commercial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||||||||||||||||||||||||
![]() | GS8672Q19BE-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | Compliant | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | Tray | GS8672Q19BE | SigmaQuad-II+ | 70 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 1.49 A | 4 M x 18 | 21 b | SRAM | 72 Mb | 72 | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342T11BGD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Compliant | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | Bulk | GS8342T11BGD | SigmaQuad-II+ | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 1 | 670 mA | 4 M x 9 | 21 b | SRAM | 36 Mb | 36 | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8160E36DGT-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | TQFP-100 | YES | 100 | 100 | LQFP | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.38 | QFP | Compliant | 250 MHz | + 85 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | LQFP, | FLATPACK, LOW PROFILE | 512000 | PLASTIC/EPOXY | 未说明 | 5.5 ns | 70 °C | 有 | GS8160E36DGT-250 | 524288 words | 1.8 V | Bulk | 3A991.B.2.B | 85 °C | 0 °C | ALSO OPERATES AT 2.5V | 8542.32.00.41 | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | COMMERCIAL | 18 Mbit | 4 | SYNCHRONOUS | 230 mA, 250 mA | 5.5 ns | 512 k x 36 | 1.6 mm | 36 | 20 b | 18 Mb | 18874368 bit | PARALLEL | 缓存SRAM | 2 V | 1.7 V | 20 mm | 14 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321Z32AD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 32 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 200 MHz | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | Commercial grade | 0 to 85 °C | Bulk | 85 °C | 0 °C | 36 Mbit | 4 | 205 mA, 240 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 32 | 20 Bit | 36 Mbit | Commercial | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672Q36BE-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | 2000000 | PLASTIC/EPOXY | 0.45 ns | 85 °C | GS8672Q36BE-400 | 2097152 words | 1.8 V | LBGA | RECTANGULAR | Obsolete | GSI TECHNOLOGY | 5.84 | Compliant | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | QDR-II | LBGA, | GRID ARRAY, LOW PROFILE | Tray | GS8672Q36BE | 3A991.B.2.B | SigmaQuad-II | 70 °C | 0 °C | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B165 | OTHER | 72 Mbit | 2 | SYNCHRONOUS | 1.86 A | 2 M x 36 | 1.5 mm | 36 | 20 b | SRAM | 72 Mb | 72 | PARALLEL | 标准SRAM | 1.9 V | 1.7 V | SRAM | 17 mm | 15 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672T36BGE-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | - 40 C | 1.7 V | SMD/SMT | Parallel | Compliant | 200 MHz | + 85 C | 1.9 V | Bulk | GS8672T36BGE | 100 °C | -40 °C | 1.8 V | 72 Mbit | 1 | 920 mA | 2 M x 36 | 21 b | 72 Mb | 72 | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816118DGD-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 表面贴装 | Compliant | 150 MHz | + 100 C | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | LBGA, | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 7.5 ns | 85 °C | 有 | GS816118DGD-150IV | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.26 | BGA | Industrial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 18 Bit | 2, 2.7 V | -40 to 100 °C | Bulk | GS816118DGD | 3A991.B.2.B | 100 °C | -40 °C | ALSO OPERATES AT 2.5V | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | INDUSTRIAL | 18 Mbit | 2 | SYNCHRONOUS | 180 mA, 200 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 18 | 1.4 mm | 18 | 20 Bit | 18 Mbit | 18874368 bit | Industrial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | 15 mm | 13 mm | 无 | |||||||||||||||||||||||||||||||||||
![]() | GS8672Q19BE-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | Compliant | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | Tray | GS8672Q19BE | SigmaQuad-II+ | 85 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 1.51 A | 4 M x 18 | 21 b | SRAM | 72 Mb | 72 | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8160E36DGT-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | 表面贴装 | 2.7, 3.6 V | 36 Bit | 512 kWords | Synchronous | 2.3, 3 V | 2.5, 3.3 V | SDR | TQFP | 250 MHz | Compliant | 250 MHz | + 100 C | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | -40 to 85 °C | GS8160E36DGT | 18 Mbit | 4 | 245 mA, 265 mA | 5.5 ns | Flow-Through/Pipelined | 512 k x 36 | 19 Bit | 18 Mbit | Industrial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8160E32DGT-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | TQFP-100 | YES | 100 | 100 | LQFP, | FLATPACK, LOW PROFILE | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 6.5 ns | 85 °C | 有 | GS8160E32DGT-200I | 524288 words | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.39 | QFP | 有 | 200 MHz | + 100 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Tray | GS8160E32DGT | 3A991.B.2.B | Pipeline/Flow Through | ALSO OPERATES AT 2.5V | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | INDUSTRIAL | 18 Mbit | SYNCHRONOUS | 230 mA | 6.5 ns | 512 k x 32 | 1.6 mm | 32 | SRAM | 16777216 bit | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321Z18AGD-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | 未说明 | 85 °C | 有 | GS8321Z18AGD-150 | 2.5 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.3 | BGA | Commercial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 150 MHz | 0 to 85 °C | GS8321Z18AGD | e1 | 有 | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | OTHER | 36 Mbit | 2 | SYNCHRONOUS | 175 mA, 190 mA | 7.5 ns | Flow-Through/Pipelined | 2 M x 18 | 1.4 mm | 18 | 21 Bit | 36 Mbit | 37748736 bit | Commercial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | 15 mm | 13 mm |
GS8342T36BGD-350I
GSI Technology
分类:Memory
GS8672T19BGE-375I
GSI Technology
分类:Memory
GS8321E18AD-200
GSI Technology
分类:Memory
GS8182S09BD-167
GSI Technology
分类:Memory
GS88036CGT-300I
GSI Technology
分类:Memory
GS8182D18BGD-300I
GSI Technology
分类:Memory
GS832018AGT-250I
GSI Technology
分类:Memory
GS816136DD-250
GSI Technology
分类:Memory
GS8672Q37BE-450
GSI Technology
分类:Memory
GS8160E18DGT-200V
GSI Technology
分类:Memory
GS8672T19BE-375I
GSI Technology
分类:Memory
GS880F18CGT-6.5
GSI Technology
分类:Memory
GS8672T20BE-400I
GSI Technology
分类:Memory
GS8161Z18DGD-150V
GSI Technology
分类:Memory
GS8672Q19BE-450
GSI Technology
分类:Memory
GS8342T11BGD-450
GSI Technology
分类:Memory
GS8160E36DGT-250
GSI Technology
分类:Memory
GS8321Z32AD-200
GSI Technology
分类:Memory
GS8672Q36BE-400
GSI Technology
分类:Memory
GS8672T36BGE-200I
GSI Technology
分类:Memory
GS816118DGD-150IV
GSI Technology
分类:Memory
GS8672Q19BE-450I
GSI Technology
分类:Memory
GS8160E36DGT-250IV
GSI Technology
分类:Memory
GS8160E32DGT-200I
GSI Technology
分类:Memory
GS8321Z18AGD-150
GSI Technology
分类:Memory
