品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8662DT11BGD-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 表面贴装 | 500 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 500 MHz | FBGA | QDR | 1.8000 V | Synchronous | 8 MWords | 9 Bit | 0 to 85 °C | GS8662DT11BGD | 72 Mbit | 2 | 890 mA | Pipelined | 8 M x 9 | 21 Bit | 72 Mb | Commercial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662Q36BGD-357 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | Synchronous | 2 MWords | 36 Bit | 表面贴装 | 有 | 357 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 有 | GS8662Q36BGD-357 | 357 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.34 | BGA | Commercial grade | 357 MHz | FBGA | QDR | 1.8000 V | 0 to 85 °C | Tray | GS8662Q36BGD | 3A991.B.2.B | SigmaQuad-II | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 72 Mbit | 2 | SYNCHRONOUS | 1.195 A | Pipelined | 2 M x 36 | 3-STATE | 1.4 mm | 36 | 20 Bit | SRAM | 72 Mbit | 75497472 bit | Commercial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||||
![]() | GS882Z36CB-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | GSI技术 | GSI技术 | NBT SRAM | N | SDR | Commercial grade | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 70 C | 2.7 V | 0 C | 42 | 1.7 V | SMD/SMT | Parallel | 0 to 70 °C | Tray | GS882Z36CB | NBT | Memory & Data Storage | 9 Mbit | 4 | 140 mA, 180 mA | 5.5 ns | Flow-Through/Pipelined | 256 k x 36 | 18 Bit | SRAM | 9 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT37E-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR-II | Industrial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | -40 to 100 °C | Tray | GS81302TT37E | SigmaDDR-II+ B2 | Memory & Data Storage | 144 Mbit | 1 | 1.2 A | Pipelined | 4 M x 36 | 21 Bit | SRAM | 144 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8642Z72C-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-209 | YES | 209 | 209 | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 200 MHz | + 85 C | 3.6 V | - 40 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | BGA | 4.79 | GSI TECHNOLOGY | 活跃 | RECTANGULAR | LBGA | 2.5 V | 200 MHz | GS8642Z72C-200I | 无 | 85 °C | 7.5 ns | 未说明 | -40 °C | BGA209,11X19,40 | PLASTIC/EPOXY | 1000000 | 3 | GRID ARRAY, LOW PROFILE | LBGA, BGA209,11X19,40 | Industrial grade | 133.3@Flow-Through/200@Pipelined MHz | -40 to 85 °C | Tray | GS8642Z72C | 无 | 3A991.B.2.B | NBT Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B209 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 72 Mbit | 8 | SYNCHRONOUS | 295 mA, 405 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 72 | 3-STATE | 1.7 mm | 72 | 20 Bit | SRAM | 72 Mbit | 0.12 A | 75497472 bit | Industrial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | |||||
![]() | GS81302T11E-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaDDR-II+ | N | DDR-II | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | Synchronous | 16 MWords | 9 Bit | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | 0 to 85 °C | Tray | GS81302T11E | SigmaDDR-II+ | Memory & Data Storage | 144 Mbit | 1 | 895 mA | Pipelined | 16 M x 9 | SRAM | 144 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT19E-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | 165 | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | LBGA, | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS81302DT19E-350I | 1.8 V | LBGA | RECTANGULAR | 不推荐 | GSI TECHNOLOGY | 5.33 | BGA | Industrial grade | 350 MHz | FBGA | QDR | 1.8000 V | -40 to 100 °C | Tray | GS81302DT19E | 无 | 3A991.B.2.B | SigmaQuad-II+ B4 | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 144 Mbit | 2 | SYNCHRONOUS | 950 mA | Pipelined | 8 M x 18 | 1.5 mm | 18 | 21 Bit | SRAM | 144 Mbit | 150994944 bit | Industrial | PARALLEL | QDR SRAM | 1.9 V | 1.7 V | SRAM | 17 mm | 15 mm | ||||||||||||||
![]() | GS81302T10E-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR-II | Industrial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS81302T10E | SigmaDDR-II+ B2 | Memory & Data Storage | 144 Mbit | 1 | 810 mA | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS864418GE-133IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 4 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 133 MHz | + 85 C | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | -40 to 85 °C | 72 Mbit | 2 | 235 mA, 285 mA | 8.5 ns | Flow-Through/Pipelined | 4 M x 18 | 72 Mbit | Industrial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662Q19BGD-357I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | 15 | - 40 C | 1.9 V | + 85 C | 357 MHz | 有 | Industrial grade | 357 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | DDR | Details | SigmaQuad-II+ | GSI技术 | GSI技术 | Parallel | SMD/SMT | -40 to 100 °C | Tray | GS8662Q19BGD | SigmaQuad-II+ B2 | Memory & Data Storage | 72 Mbit | 2 | 995 mA | Pipelined | 4 M x 18 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T38BD-450M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | - 55 C | 1.7 V | SMD/SMT | SigmaCIO DDR-II | DDR-II | Military grade | 450 MHz | DDR | 450 MHz | 15 | Parallel | GSI技术 | GSI技术 | FBGA | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | + 125 C | 1.9 V | -55 to 125 °C | Tray | GS8662T38BD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 1 | Pipelined | 2 M x 36 | 20 Bit | SRAM | 72 Mbit | Military | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D08E-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | N | QDR-II | Commercial grade | 375 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 375 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302D08E | SigmaQuad-II | Memory & Data Storage | 144 Mbit | 2 | 995 mA | Pipelined | 16 M x 8 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302Q19E-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | 165 | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 250 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | LBGA, | GRID ARRAY, LOW PROFILE | BGA | 5.33 | GSI TECHNOLOGY | 不推荐 | RECTANGULAR | LBGA | 1.8 V | GS81302Q19E-250I | 无 | 85 °C | 0.45 ns | 未说明 | -40 °C | PLASTIC/EPOXY | 8000000 | Industrial grade | 250 MHz | FBGA | QDR | 1.8000 V | -40 to 100 °C | Tray | GS81302Q19E | 无 | 3A991.B.2.B | SigmaQuad-II+ B2 | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 144 Mbit | 2 | SYNCHRONOUS | 1.07 A | Pipelined | 8 M x 18 | 1.5 mm | 18 | 22 Bit | SRAM | 144 Mbit | 150994944 bit | Industrial | PARALLEL | QDR SRAM | 1.9 V | 1.7 V | SRAM | 17 mm | 15 mm | ||||||||||||||
![]() | GS8673EQ18BGK-625I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-260 | YES | 260 | 260 | 4 MWords | 18 Bit | 1.4 V | 表面贴装 | 有 | 625 MHz | + 100 C | 1.4 V | - 40 C | 8 | 1.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-IIIe | Details | QDR-III | HBGA, | GRID ARRAY, HEAT SINK/SLUG | 4000000 | PLASTIC/EPOXY | 未说明 | 0.4 ns | 有 | GS8673EQ18BGK-625I | 1.35 V | HBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.72 | Industrial grade | 625/400 MHz | BGA | QDR | 1.3500 V | 1.3 V | Synchronous | -40 to 85 °C | Tray | GS8673EQ18BGK | 3A991.B.2.B | SigmaQuad-IIIe B2 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B260 | 72 Mbit | SYNCHRONOUS | 2.11 A | Pipelined | 4 M x 18 | 2.3 mm | 18 | 21 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | DDR SRAM | 1.4 V | 1.3 V | SRAM | 22 mm | 14 mm | |||||||||||||||||||||
![]() | GS81302DT38E-450M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | Military grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 125 C | 1.9 V | - 55 C | 10 | 1.7 V | SMD/SMT | -55 to 125 °C | Tray | GS81302DT38E | SigmaQuad-II+ | Memory & Data Storage | 144 Mbit | 2 | Pipelined | 4 M x 36 | 20 Bit | SRAM | 144 Mbit | Military | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT11E-450M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | DDR-II | Military grade | 450 MHz | FBGA | DDR | 1.8000 V | Synchronous | 16 MWords | 9 Bit | 表面贴装 | 有 | 450 MHz | + 125 C | 1.9 V | - 55 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | -55 to 125 °C | Tray | GS81302TT11E | SigmaDDR-II+ | Memory & Data Storage | 144 Mbit | 1 | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Military | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D18GE-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | QDR-II | Commercial grade | 350 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302D18GE | SigmaQuad-II | Memory & Data Storage | 144 Mbit | 2 | 940 mA | Pipelined | 8 M x 18 | 21 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT10GE-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 350 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 350 MHz | FBGA | DDR | -40 to 100 °C | 144 Mbit | 1 | 810 mA | Pipelined | 16 M x 9 | 23 Bit | 144 Mb | Industrial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T36BD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 165 | 165 | 无 | GS8182T36BD-250 | 524288 words | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.14 | BGA | LBGA, | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | PIPELINED ARCHITECTURE, LATE WRITE | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | not_compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | SYNCHRONOUS | 512KX36 | 1.4 mm | 36 | 18874368 bit | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T36BD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662DT20BGD-550 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Commercial grade | 550 MHz | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 550 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | 0 to 85 °C | Tray | GS8662DT20BGD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 2 | 980 mA | Pipelined | 4 M x 18 | 20 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302T10GE-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | Details | DDR-II | Industrial grade | 300 MHz | DDR | 1.8000 V | Synchronous | 16 MWords | 9 Bit | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | -40 to 100 °C | Tray | GS81302T10GE | SigmaDDR-II+ B2 | Memory & Data Storage | 144 Mbit | 1 | 700 mA | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662S09BD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | N | DDR | Commercial grade | 333 MHz | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | 0 to 85 °C | Tray | GS8662S09BD | SigmaSIO DDR-II | Memory & Data Storage | 72 Mbit | 2 | 630 mA | Pipelined | 8 M x 9 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302Q18E-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | 300 MHz | GS81302Q18E | 144 Mbit | 1.25 A | 8 M x 18 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS842Z18CGB-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | 有 | 200 MHz | + 85 C | 3.6 V | - 40 C | 84 | 2.3 V | SMD/SMT | Parallel | Tray | GS842Z18CGB | NBT Pipeline/Flow Through | Memory & Data Storage | 4 Mbit | 150 mA, 175 mA | 6.5 ns | 256 k x 18 | SRAM | SRAM |
GS8662DT11BGD-500
GSI Technology
分类:Memory
GS8662Q36BGD-357
GSI Technology
分类:Memory
GS882Z36CB-250V
GSI Technology
分类:Memory
GS81302TT37E-450I
GSI Technology
分类:Memory
GS8642Z72C-200I
GSI Technology
分类:Memory
GS81302T11E-400
GSI Technology
分类:Memory
GS81302DT19E-350I
GSI Technology
分类:Memory
GS81302T10E-350I
GSI Technology
分类:Memory
GS864418GE-133IV
GSI Technology
分类:Memory
GS8662Q19BGD-357I
GSI Technology
分类:Memory
GS8662T38BD-450M
GSI Technology
分类:Memory
GS81302D08E-375
GSI Technology
分类:Memory
GS81302Q19E-250I
GSI Technology
分类:Memory
GS8673EQ18BGK-625I
GSI Technology
分类:Memory
GS81302DT38E-450M
GSI Technology
分类:Memory
GS81302TT11E-450M
GSI Technology
分类:Memory
GS81302D18GE-350
GSI Technology
分类:Memory
GS81302TT10GE-350I
GSI Technology
分类:Memory
GS8182T36BD-250
GSI Technology
分类:Memory
GS8182T36BD-300I
GSI Technology
分类:Memory
GS8662DT20BGD-550
GSI Technology
分类:Memory
GS81302T10GE-300I
GSI Technology
分类:Memory
GS8662S09BD-333
GSI Technology
分类:Memory
GS81302Q18E-300
GSI Technology
分类:Memory
GS842Z18CGB-200I
GSI Technology
分类:Memory
