品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS81302D37E-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | QDR-II | Commercial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302D37E | SigmaQuad-II+ B4 | Memory & Data Storage | 144 Mbit | 2 | 1.4 A | Pipelined | 4 M x 36 | 20 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT10GE-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | Industrial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | -40 to 100 °C | Tray | GS81302TT10GE | SigmaDDR-II+ B2 | Memory & Data Storage | 144 Mbit | 1 | 905 mA | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321E18AD-333IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 200@Flow-Through/333@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 333 MHz | + 85 C | 2.7 V | - 40 C | 18 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS8321E18AD | 同步突发 | Memory & Data Storage | 36 Mbit | 2 | 265 mA, 350 mA | 5 ns | Flow-Through/Pipelined | 2 M x 18 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT11GE-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 16 MWords | Synchronous | 1.7 V | 1.8000 V | DDR | FBGA | 500 MHz | 500 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 表面贴装 | 1.9 V | 9 Bit | -40 to 100 °C | GS81302TT11GE | 144 Mbit | 1 | 1.08 A | Pipelined | 16 M x 9 | 23 Bit | 144 Mbit | Industrial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832218AGD-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | 18 | - 40 C | 2.7 V | + 85 C | 200 MHz | 有 | Industrial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | SDR | Details | SyncBurst | GSI技术 | GSI技术 | Parallel | SMD/SMT | -40 to 100 °C | Tray | GS832218AGD | Pipeline/Flow Through | Memory & Data Storage | 36 Mbit | 2 | 215 mA, 250 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 18 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z36AGD-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | Synchronous | 36 Bit | 2.7, 3.6 V | 有 | 375 MHz | + 85 C | 3.6 V | - 40 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 4.2 ns | 85 °C | 有 | GS8322Z36AGD-375I | 375 MHz | 1048576 words | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.12 | BGA | Industrial grade | 238@Flow-Through/375@Pipelined MHz | 2.5, 3.3 V | 2.3, 3 V | -40 to 100 °C | Tray | GS8322Z36AGD | e1 | 有 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 36 Mbit | SYNCHRONOUS | 290 mA, 400 mA | 4.2@Flow-Through/2.5 | 1 M x 36 | 3-STATE | 1.4 mm | 36 | SRAM | 0.04 A | 36 | Industrial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | |||||||||
![]() | GS8640FZ36GT-7.5V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | 2, 2.7 V | 有 | + 70 C | 2.7 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | 未说明 | 7.5 ns | 70 °C | 有 | GS8640FZ36GT-7.5V | 2097152 words | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.5 | QFP | Commercial grade | 133.3 MHz | TQFP | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 36 Bit | 0 to 70 °C | Tray | GS8640FZ36GT | e3 | 有 | 3A991.B.2.B | NBT | Matte Tin (Sn) | FLOW-THROUGH ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | COMMERCIAL | 72 Mbit | SYNCHRONOUS | 230 mA | 7.5 | 2 M x 36 | 1.6 mm | 36 | SRAM | 72 | Commercial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 20 mm | 14 mm | |||||||||||||||||
![]() | GS74117AX-12E | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-48 | 48 | GSI技术 | GSI技术 | N | FBGA | 3.3000 V | Asynchronous | 256 kWords | 16 Bit | 表面贴装 | 3.6 V | 135 | 3 V | SMD/SMT | Parallel | -40 to 125 °C | GS74117AX | Asynchronous | Memory & Data Storage | 4 Mbit | 1 | 90 mA | 12 ns | 256 k x 16 | 18 Bit | SRAM | 4 Mbit | 扩展工业 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662DT10BGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | 333 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 333 MHz | FBGA | QDR | 0 to 85 °C | GS8662DT10BGD | 72 Mbit | 2 | 630 mA | Pipelined | 8 M x 9 | 21 Bit | 72 Mbit | Commercial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832132AD-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 150 MHz | + 70 C | 2.7 V | 0 C | 1.7 V | SMD/SMT | Parallel | LBGA, | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 未说明 | 7.5 ns | 85 °C | 无 | GS832132AD-150V | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.3 | BGA | Commercial grade | 133@Flow-Through/150@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 32 Bit | 2, 2.7 V | 表面贴装 | 0 to 85 °C | GS832132AD | 3A991.B.2.B | PIPELINE OR FLOW THROUGH ARCHITECTURE; ALSO OPERATES AT 2.5 SUPPLY | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | OTHER | 36 Mbit | 4 | SYNCHRONOUS | 200 mA, 210 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 32 | 1.4 mm | 32 | 20 Bit | 36 Mbit | 33554432 bit | Commercial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | 15 mm | 13 mm | |||||||||||||||||||||||||
![]() | GS8321Z36AD-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | FBGA | 153.8@Flow-Through/200@Pipelined MHz | 200 MHz | + 70 C | 2.7 V | 0 C | 1.7 V | SMD/SMT | Parallel | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 6.5 ns | 70 °C | 无 | GS8321Z36AD-200V | 200 MHz | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.16 | BGA | Commercial grade | 表面贴装 | 2, 2.7 V | 36 Bit | 1 MWords | Synchronous | 1.7, 2.3 V | 1.8, 2.5 V | SDR | 0 to 85 °C | GS8321Z36AD | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 2.5V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.8/2.5 V | COMMERCIAL | 36 Mbit | 4 | SYNCHRONOUS | 215 mA, 250 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 20 Bit | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | ZBT SRAM | 1.7 V | 2 V | 1.7 V | 15 mm | 13 mm | ||||||||||||||
![]() | GS8161Z18DGD-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 375 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 未说明 | 4.2 ns | 70 °C | 有 | GS8161Z18DGD-375 | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.26 | BGA | Commercial grade | 238@Flow-Through/375@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 0 to 70 °C | Tray | GS8161Z18DGD | 3A991.B.2.B | NBT | FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | COMMERCIAL | 18 Mbit | 2 | SYNCHRONOUS | 250 mA, 320 mA | 4.2 ns | Flow-Through/Pipelined | 1 M x 18 | 1.4 mm | 18 | 20 Bit | SRAM | 18 Mbit | 18874368 bit | Commercial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | |||||||||||||||
![]() | GS832272C-225V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-209 | YES | 209 | 209 | 1.7, 2.3 V | Synchronous | 512 kWords | 表面贴装 | 2, 2.7 V | 72 Bit | 有 | 225 MHz | + 70 C | 2.7 V | 0 C | 14 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | 未说明 | 7 ns | 70 °C | 无 | GS832272C-225V | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.14 | BGA | Commercial grade | 142.8@Flow-Through/225@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 0 to 70 °C | Tray | GS832272C | 无 | 3A991.B.2.B | 同步突发 | FLOW-THROUGH OR PIELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B209 | 不合格 | COMMERCIAL | 36 Mbit | 8 | SYNCHRONOUS | 255 mA, 350 mA | 7 ns | Flow-Through/Pipelined | 512 k x 72 | 1.7 mm | 72 | 19 Bit | SRAM | 36 Mbit | 37748736 bit | Commercial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 22 mm | 14 mm | |||||||||||||
![]() | GS8662T09BD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | 300 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 300 MHz | FBGA | DDR | 0 to 85 °C | 72 Mbit | 1 | 495 mA | Pipelined | 8 M x 9 | 22 Bit | 72 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321Z32AD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 未说明 | 85 °C | 无 | GS8321Z32AD-333 | 2.5 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.16 | BGA | 333 MHz | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | Commercial grade | 222.2@Flow-Through/333@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 32 Bit | 2.7, 3.6 V | 表面贴装 | LBGA, | 0 to 85 °C | GS8321Z32AD | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | OTHER | 36 Mbit | 4 | SYNCHRONOUS | 260 mA, 345 mA | 4.5 ns | Flow-Through/Pipelined | 1MX32 | 1.4 mm | 32 | 20 Bit | 36 Mbit | 33554432 bit | Commercial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | 15 mm | 13 mm | ||||||||||||||||||||||||
![]() | GS8321E36AD-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | 18 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS8321E36AD | 同步突发 | Memory & Data Storage | 36 Mbit | 4 | 260 mA, 315 mA | 5.5 ns | Flow-Through/Pipelined | 1 M x 36 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321Z18AD-333IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 333 MHz | + 100 C | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 200@Flow-Through/333@Pipelined MHz | FBGA | SDR | -40 to 100 °C | 36 Mbit | 2 | 265 mA, 350 mA | 5 ns | Flow-Through/Pipelined | 2 M x 18 | 21 Bit | 36 Mbit | Industrial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D19BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Industrial grade | 400 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8342D19BGD | SigmaQuad-II+ B4 | Memory & Data Storage | 36 Mbit | 2 | 715 mA | Pipelined | 2 M x 18 | 19 Bit | SRAM | 36 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342T11BD-550 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 1.9 V | 9 Bit | 4 MWords | Synchronous | 1.7 V | 1.8000 V | DDR | FBGA | 有 | DDR | N | SigmaDDR-II+ | GSI技术 | GSI技术 | Parallel | SMD/SMT | 1.7 V | 15 | 0 C | 1.9 V | + 70 C | 550 MHz | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 无 | GS8342T11BD-550 | 550 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.35 | BGA | Commercial grade | 550 MHz | 表面贴装 | 0 to 85 °C | Tray | GS8342T11BD | e0 | 3A991.B.2.B | SigmaQuad-II+ | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 36 Mbit | 1 | SYNCHRONOUS | 800 mA | Pipelined | 4 M x 9 | 3-STATE | 1.4 mm | 9 | 21 Bit | SRAM | 36 Mbit | 0.255 A | 37748736 bit | Commercial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||
![]() | GS81302T10E-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR-II | Commercial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 70 °C | Tray | GS81302T10E | SigmaDDR-II+ B2 | Memory & Data Storage | 144 Mbit | 1 | 1 A | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D06GE-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 450 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 450 MHz | FBGA | QDR | -40 to 100 °C | GS81302D06GE | 144 Mbit | 2 | 1.185 A | Pipelined | 16 M x 8 | 22 Bit | 144 Mbit | Industrial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302T07GE-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | Industrial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | -40 to 100 °C | Tray | GS81302T07GE | SigmaDDR-II+ B2 | Memory & Data Storage | 144 Mbit | 1 | 1.01 A | Pipelined | 16 M x 8 | 23 Bit | SRAM | 144 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302T37GE-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | Commercial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302T37GE | SigmaDDR-II+ B2 | Memory & Data Storage | 144 Mbit | 1 | 1.19 A | Pipelined | 4 M x 36 | 21 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS82582QT20GE-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | Industrial grade | 500 MHz | BGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | -40 to 85 °C | Tray | GS82582QT20GE | SigmaQuad-II+ B2 | Memory & Data Storage | 288 Mbit | 1 | 1.43 A | Pipelined | 16 M x 18 | 23 Bit | SRAM | 288 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302S36E-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 4 MWords | Synchronous | 1.7 V | 1.8000 V | DDR | FBGA | 333 MHz | 333 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 表面贴装 | 1.9 V | 36 Bit | -40 to 100 °C | 144 Mbit | 2 | 1.01 A | Pipelined | 4 M x 36 | 21 Bit | 144 Mbit | Industrial |
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