品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 建筑学 | 数据总线宽度 | 组织结构 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 记忆密度 | 最高频率 | 筛选水平 | 并行/串行 | 内存IC类型 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 访问模式 | 产品类别 | 组织的记忆 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS832118AD-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 238@Flow-Through/375@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 375 MHz | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | Commercial grade | 0 to 85 °C | Bulk | 85 °C | 0 °C | 36 Mbit | 2 | 250 mA, 350 mA | 4.2 ns | Flow-Through/Pipelined | 2 M x 18 | 21 Bit | 36 Mbit | Commercial | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS4288S18GL-25I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 144 | Compliant | 95 °C | -40 °C | 1.8 V | 18 b | 23 b | 288 Mb | 288 | 400 MHz | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS4288S18GL-25 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 144 | 16000000 | PLASTIC/EPOXY | 未说明 | 有 | GS4288S18GL-25 | 16777216 words | 1.8 V | TBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.61 | BGA | Compliant | TBGA, | GRID ARRAY, THIN PROFILE | 3A991.B.2.B | 95 °C | 0 °C | 自动刷新 | 8542.32.00.28 | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B144 | 1 | SYNCHRONOUS | 18 b | 16MX18 | 1.2 mm | 18 | 23 b | 288 Mb | 301989888 bit | 400 MHz | DDR DRAM | 1.9 V | 1.7 V | 多库页面突发 | 11 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8320E18AGT-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | - 40 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 238@Flow-Through/375.9@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 375 MHz | + 85 C | 3.6 V | -40 to 100 °C | Bulk | GS8320E18AGT | Pipeline/Flow Through | 100 °C | -40 °C | Memory & Data Storage | 36 Mbit | 2 | 270 mA, 370 mA | 4.2 ns | Flow-Through/Pipelined | 2 M x 18 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D10GE-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 450 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | -40 to 100 °C | Bulk | 100 °C | -40 °C | 1.8 V | 144 Mbit | 2 | 1.185 A | Pipelined | 16 M x 9 | 22 Bit | 144 Mbit | Industrial | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662DT19BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 400 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | Compliant | 400 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | -40 to 100 °C | Bulk | 100 °C | -40 °C | 1.8 V | 72 Mbit | 2 | 745 mA | Pipelined | 4 M x 18 | 20 Bit | 72 Mbit | Industrial | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662QT19BD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 250 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | LBGA, | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8662QT19BD-250I | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.2 | BGA | Industrial grade | 250 MHz | FBGA | -40 to 100 °C | Bulk | GS8662QT19BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II+ B2 | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 72 Mbit | 2 | SYNCHRONOUS | 730 mA | Pipelined | 4 M x 18 | 1.4 mm | 18 | 21 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | QDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||||||||
![]() | GS88218CB-300M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | 18 Bit | 2.7, 3.6 V | Compliant | 300 MHz | + 125 C | 3.6 V | - 55 C | 2.3 V | SMD/SMT | Parallel | 200@Flow-Through/300@Pipelined MHz | FBGA | 2.5, 3.3 V | 2.3, 3 V | Synchronous | -55 to 125 °C | Bulk | 125 °C | -55 °C | 9 Mbit | 2 | 205 mA, 260 mA | 5@Flow-Through/2.5@P | 512 k x 18 | 19 Bit | 9 Mb | 9 | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662QT19BD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 表面贴装 | Compliant | Commercial grade | 333 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 0 to 85 °C | Bulk | 85 °C | 0 °C | 1.8 V | 2 | Pipelined | 21 Bit | 72 Mbit | Commercial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88118CGD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | Parallel | SMD/SMT | 2.3 V | 36 | - 40 C | 3.6 V | + 85 C | 300 MHz | Industrial grade | 200@Flow-Through/300@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | SDR | SyncBurst | GSI技术 | -40 to 85 °C | Tray | GS88118CGD | Pipeline/Flow Through | 85 °C | -40 °C | Memory & Data Storage | 9 Mbit | 1 | 170 mA, 225 mA | 5 ns | Flow-Through/Pipelined | 512 k x 18 | 19 Bit | SRAM | 9 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS4288S09L-24I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 144 | 32000000 | PLASTIC/EPOXY | 未说明 | 无 | GS4288S09L-24I | 33554432 words | 1.8 V | TBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.7 | BGA | Compliant | TBGA, | GRID ARRAY, THIN PROFILE | 3A991.B.2.B | 95 °C | -40 °C | 自动刷新 | 8542.32.00.28 | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B144 | 1 | SYNCHRONOUS | 9 b | 32MX9 | 1.2 mm | 9 | 24 b | 288 Mb | 301989888 bit | 400 MHz | DDR DRAM | 1.9 V | 1.7 V | 多库页面突发 | 11 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS4288S09L-24 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 144 | Compliant | 95 °C | 0 °C | 1.8 V | 9 b | 24 b | 288 Mb | 400 MHz | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS4288S09GL-33 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 144 | Compliant | 95 °C | 0 °C | 1.8 V | 9 b | 24 b | 288 Mb | 300 MHz | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302Q18GE-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | BGA-165 | YES | 165 | 165-FPBGA (15x17) | 165 | Synchronous | 8 MWords | 18 Bit | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | GSI Technology Inc. | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | QDR-II | Tray | GS81302Q18 | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 8000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS81302Q18GE-300I | 1.8 V | LBGA | RECTANGULAR | 不推荐 | GSI TECHNOLOGY | 5.06 | BGA | Industrial grade | 300 MHz | QDR | 1.8000 V | -40 to 100 °C | Tray | GS81302Q18GE | e1 | 有 | 3A991.B.2.B | SigmaQuad-II | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | SRAM - Quad Port, Synchronous | 1.7V ~ 1.9V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 144 Mbit | 2 | SYNCHRONOUS | 300 MHz | 1.26 A | SRAM | Parallel | Pipelined | 8 M x 18 | 1.5 mm | 18 | - | 22 Bit | SRAM | 144 Mbit | 150994944 bit | Industrial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 8M x 18 | 17 mm | 15 mm | ||||||||||||
![]() | GS81302DT10GE-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | Industrial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 450 MHz | + 85 C | 1.9 V | -40 to 100 °C | Tray | GS81302DT10GE | SigmaQuad-II+ B4 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 1.185 A | Pipelined | 16 M x 9 | 22 Bit | SRAM | 144 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302S18GE-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR-II | Industrial grade | 表面贴装 | 1.9 V | 18 Bit | 8 MWords | Synchronous | 1.7 V | 1.8000 V | DDR | FBGA | 350 MHz | Compliant | 有 | 350 MHz | + 85 C | 1.9 V | -40 to 100 °C | Bulk | GS81302S18GE | SigmaSIO DDR-II | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 950 mA | Pipelined | 8 M x 18 | 22 Bit | SRAM | 144 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662DT20BD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Industrial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Tray | GS8662DT20BD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 2 | 830 mA | Pipelined | 4 M x 18 | 20 Bit | SRAM | 72 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342Q19BGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Industrial grade | 333 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | -40 to 100 °C | Tray | GS8342Q19BGD | SigmaQuad-II+ B2 | Memory & Data Storage | 36 Mbit | 2 | 895 mA | Pipelined | 2 M x 18 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T10BD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 350 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 350 MHz | FBGA | 1.8000 V | -40 to 100 °C | GS8662T10BD | 72 Mbit | 600 mA | 0.45 | 8 M x 9 | 72 | Industrial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662QT37BD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 333 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 333 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 0 to 85 °C | GS8662QT37BD | 72 Mbit | 2 | 1.1 A | Pipelined | 2 M x 36 | 20 Bit | 72 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8673EQ36BGK-550 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-260 | YES | 260 | 260 | BGA | 1.3500 V | 1.25 V | Synchronous | 2 MWords | 36 Bit | 1.4 V | 表面贴装 | 有 | 550 MHz | + 85 C | 1.4 V | 0 C | 8 | 1.25 V | SMD/SMT | Parallel | GSI技术 | SigmaQuad-IIIe | Details | QDR-III | HBGA, | GRID ARRAY, HEAT SINK/SLUG | 2000000 | PLASTIC/EPOXY | 未说明 | 85 °C | 有 | GS8673EQ36BGK-550 | 1.3 V | HBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.73 | Commercial grade | QDR | GSI技术 | 0.4 ns | 550/375 MHz | 0 to 70 °C | Tray | GS8673EQ36BGK | 3A991.B.2.B | SigmaQuad-IIIe B2 | IT ALSO OPERATES AT 1.35 V TYPICAL VOLTAGE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B260 | OTHER | 72 Mbit | SYNCHRONOUS | 2.67 A | Pipelined | 2 M x 36 | 2.3 mm | 36 | 20 Bit | SRAM | 72 Mbit | 75497472 bit | Commercial | PARALLEL | DDR SRAM | 1.4 V | 1.25 V | SRAM | 22 mm | 14 mm | |||||||||||||||||||||||||||||
![]() | GS864418E-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | Commercial grade | 153.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 4 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 70 C | 2.7 V | 0 C | 0 to 70 °C | Tray | GS864418E | 同步突发 | Memory & Data Storage | 72 Mbit | 2 | 250 mA, 360 mA | 6.5 ns | Flow-Through/Pipelined | 4 M x 18 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D10E-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | QDR-II | Commercial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 0 to 85 °C | Tray | GS81302D10E | SigmaQuad-II+ B4 | Memory & Data Storage | 144 Mbit | 2 | 1.175 A | Pipelined | 16 M x 9 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8673EQ18BK-714 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-260 | 260 | 714 MHz | BGA | QDR | Synchronous | 4 MWords | 18 Bit | 表面贴装 | 有 | 714 MHz | + 85 C | 0 C | 8 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-IIIe | N | QDR-III | Commercial grade | 0 to 70 °C | Tray | GS8673EQ18BK | SigmaQuad-IIIe B2 | Memory & Data Storage | 72 Mbit | 1 | Pipelined | 4 M x 18 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8673ED36BGK-550 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-260 | 260 | 表面贴装 | 1.4 V | 36 Bit | 2 MWords | Synchronous | 1.25 V | 1.3500 V | QDR | BGA | 550/375 MHz | 550 MHz | + 85 C | 1.4 V | 0 C | 1.25 V | SMD/SMT | Parallel | Commercial grade | 0 to 70 °C | GS8673ED36BGK | 72 Mbit | 2.67 A | Pipelined | 2 M x 36 | 19 Bit | 72 Mbit | Commercial |
GS832118AD-375
GSI Technology
分类:Memory
GS4288S18GL-25I
GSI Technology
分类:Memory
GS4288S18GL-25
GSI Technology
分类:Memory
GS8320E18AGT-375I
GSI Technology
分类:Memory
GS81302D10GE-450I
GSI Technology
分类:Memory
GS8662DT19BGD-400I
GSI Technology
分类:Memory
GS8662QT19BD-250I
GSI Technology
分类:Memory
GS88218CB-300M
GSI Technology
分类:Memory
GS8662QT19BD-333
GSI Technology
分类:Memory
GS88118CGD-300I
GSI Technology
分类:Memory
GS4288S09L-24I
GSI Technology
分类:Memory
GS4288S09L-24
GSI Technology
分类:Memory
GS4288S09GL-33
GSI Technology
分类:Memory
GS81302Q18GE-300I
GSI Technology
分类:Memory
GS81302DT10GE-450I
GSI Technology
分类:Memory
GS81302S18GE-350I
GSI Technology
分类:Memory
GS8662DT20BD-450I
GSI Technology
分类:Memory
GS8342Q19BGD-333I
GSI Technology
分类:Memory
GS8662T10BD-350I
GSI Technology
分类:Memory
GS8662QT37BD-333
GSI Technology
分类:Memory
GS8673EQ36BGK-550
GSI Technology
分类:Memory
GS864418E-250V
GSI Technology
分类:Memory
GS81302D10E-450
GSI Technology
分类:Memory
GS8673EQ18BK-714
GSI Technology
分类:Memory
GS8673ED36BGK-550
GSI Technology
分类:Memory
