品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 组织的记忆 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8182S18BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1 MWords | 18 Bit | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | Details | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | BGA | 5.19 | GSI TECHNOLOGY | 活跃 | RECTANGULAR | LBGA | 1.8 V | GS8182S18BGD-400I | 有 | 85 °C | 0.45 ns | 未说明 | -40 °C | PLASTIC/EPOXY | 1000000 | Industrial grade | 400 MHz | FBGA | DDR | 1.8000 V | Synchronous | -40 to 85 °C | Tray | GS8182S18BGD | e1 | 有 | 3A991.B.2.B | SigmaSIO DDR-II | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 18 Mbit | 2 | SYNCHRONOUS | 730 mA | Pipelined | 1 M x 18 | 1.4 mm | 18 | 19 Bit | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||||||||||||||||||||
![]() | GS816132DGD-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | GSI技术 | Parallel | SMD/SMT | 2.3 V | Commercial grade | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 32 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 375 MHz | + 70 C | 3.6 V | 0 C | 36 | SDR | Details | SyncBurst | 0 to 70 °C | Tray | GS816132DGD | Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 4 | 270 mA, 350 mA | 4.2 ns | Flow-Through/Pipelined | 512 k x 32 | SRAM | 18 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832136AGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | BGA-165 | YES | 165 | 165-FPBGA (13x15) | 165 | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 85 C | 3.6 V | - 40 C | GSI Technology Inc. | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Tray | GS832136 | 活跃 | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 4.5 ns | 85 °C | 有 | GS832136AGD-333I | 333 MHz | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.16 | BGA | Industrial grade | 222.2@Flow-Through/333@Pipelined MHz | -40 to 100 °C | Tray | GS832136AGD | 3A991.B.2.B | Pipeline/Flow Through | PIPELINE OR FLOW THROUGH ARCHITECTUREL; ALSO OPERATES AT 3.3 V SUPPLY | 8542.32.00.41 | Memory & Data Storage | SRAM - Synchronous, Standard | 2.3V ~ 2.7V, 3V ~ 3.6V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 36 Mbit | 4 | SYNCHRONOUS | 333 MHz | 280 mA, 365 mA | 4.5 ns | SRAM | Parallel | Flow-Through/Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | - | 20 Bit | SRAM | 36 Mbit | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 1M x 36 | 15 mm | 13 mm | |||||||||
![]() | GS8182D09BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8182D09BGD-400I | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.33 | BGA | Industrial grade | 400 MHz | FBGA | DDR | -40 to 85 °C | Tray | GS8182D09BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad-II | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 18 Mbit | 2 | SYNCHRONOUS | 730 mA | Pipelined | 2 M x 9 | 1.4 mm | 9 | 19 Bit | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||||||||||||||||||
![]() | GS816272CC-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Commercial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 250 MHz | + 70 C | 3.6 V | 0 C | 21 | 0 to 70 °C | Tray | GS816272CC | Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 18 Mbit | 8 | 265 mA, 310 mA | 5.5 ns | Flow-Through/Pipelined | 256 k x 72 | 18 Bit | SRAM | 18 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D07BD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 450 MHz | FBGA | 1.8000 V | 1.7 V | Synchronous | 8 Bit | 1.9 V | Compliant | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | -40 to 85 °C | Tray | GS8342D07BD | SigmaQuad-II+ B4 | 85 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 795 mA | 0.45 | 4 M x 8 | 20 b | SRAM | 36 Mb | 36 | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T37BD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Industrial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 表面贴装 | 1.9 V | 36 Bit | 2 MWords | Compliant | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Bulk | GS8662T37BD | SigmaDDR-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 910 mA | Pipelined | 2 M x 36 | 20 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342DT20BGD-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | BGA-165 | YES | 165 | 165-FPBGA (15x13) | 165 | 500 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | + 85 C | 1.9 V | - 40 C | GSI Technology Inc. | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Tray | GS8342D | 活跃 | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8342DT20BGD-500I | 500 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | BGA | Industrial grade | -40 to 100 °C | Tray | GS8342DT20BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad-II+ | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | Memory & Data Storage | SRAM - Quad Port, Synchronous | 1.8 V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 500 MHz | 865 mA | SRAM | Parallel | Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | - | 19 Bit | SRAM | 36 Mb | 37748736 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 2M x 18 | 15 mm | 13 mm | 无 | ||||||
![]() | GS81302T07E-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 350 MHz | 1.8000 V | Synchronous | 8 Bit | Compliant | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR-II | Industrial grade | -40 to 100 °C | Bulk | GS81302T07E | SigmaDDR-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 1 | 810 mA | 0.45 | 16 M x 8 | 23 b | SRAM | 144 Mb | 144 | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302S09E-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR-II | Industrial grade | 333 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS81302S09E | SigmaSIO DDR-II | Memory & Data Storage | 144 Mbit | 2 | 900 mA | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT37E-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | QDR-II | SigmaQuad-II+ | Industrial grade | 400 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS81302DT37E | SigmaQuad-II+ B4 | Memory & Data Storage | 114 Mbit | 2 | 1.18 A | Pipelined | 4 M x 36 | 20 Bit | SRAM | 144 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88032CGT-200T | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 100 | 100 | FLATPACK, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | QFP100,.63X.87 | 未说明 | 6.5 ns | 70 °C | 有 | GS88032CGT-200T | 262144 words | 2.5 V | LQFP | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.61 | QFP | LQFP, QFP100,.63X.87 | e3 | 有 | 3A991.B.2.B | 纯哑光锡 | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | SRAMs | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 2.5/3.3 V | COMMERCIAL | SYNCHRONOUS | 0.17 mA | 256KX32 | 3-STATE | 1.6 mm | 32 | 0.025 A | 8388608 bit | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302T11E-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR-II | Commercial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302T11E | SigmaDDR-II+ | Memory & Data Storage | 144 Mbit | 1 | 800 mA | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88032CGT-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | 150 MHz | + 70 C | 2.7 V | 0 C | 1.7 V | SMD/SMT | Parallel | LQFP, | FLATPACK, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | 未说明 | 7.5 ns | 70 °C | 有 | GS88032CGT-150V | 1.8 V | LQFP | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.5 | QFP | Commercial grade | 150 MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 32 Bit | 2, 2.7 V | 表面贴装 | 0 to 70 °C | GS88032CGT | e3 | 有 | 3A991.B.2.B | Matte Tin (Sn) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | COMMERCIAL | 9 Mbit | 4 | SYNCHRONOUS | 110 mA, 125 mA | 7.5 ns | Flow-Through/Pipelined | 256 k x 32 | 1.6 mm | 32 | 18 Bit | 9 Mbit | 8388608 bit | Commercial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||
![]() | GS8662D06BD-450M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 有 | 450 MHz | + 125 C | 1.9 V | - 55 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | -55 °C | 未说明 | 0.45 ns | 125 °C | 无 | GS8662D06BD-450M | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.81 | Military grade | 450 MHz | FBGA | QDR | 1.8000 V | Synchronous | 8 MWords | 8 Bit | 表面贴装 | Tray | GS8662D06BD | 3A991.B.2.B | SigmaQuad-II+ | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | MILITARY | 72 Mbit | SYNCHRONOUS | Pipelined | 8 M x 8 | 1.4 mm | 8 | 23 Bit | SRAM | 72 Mbit | 67108864 bit | Military | PARALLEL | QDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT20E-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | DDR-II | Industrial grade | 1.9 V | 18 Bit | 8 MWords | Synchronous | 1.7 V | 1.8000 V | FBGA | 450 MHz | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | -40 to 100 °C | Tray | GS81302TT20E | SigmaDDR-II+ | Memory & Data Storage | 144 Mbit | 1.01 A | 0.45 | 8 M x 18 | SRAM | 144 | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8673ET36BGK-550I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-260 | YES | 260 | 260 | 36 Bit | 1.4 V | 表面贴装 | 有 | 550 MHz | + 100 C | 1.4 V | - 40 C | 8 | 1.25 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-IIIe | Details | DDR | HBGA, | GRID ARRAY, HEAT SINK/SLUG | 2000000 | PLASTIC/EPOXY | 未说明 | 0.4 ns | 有 | GS8673ET36BGK-550I | 1.3 V | HBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.74 | Industrial grade | 550/375 MHz | BGA | DDR | 1.3500 V | 1.25 V | Synchronous | 2 MWords | -40 to 85 °C | Tray | GS8673ET36BGK | 3A991.B.2.B | SigmaDDR-IIIe B2 | IT ALSO OPERATES AT 1.35 V TYPICAL VOLTAGE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B260 | 72 Mbit | SYNCHRONOUS | 2.03 A | Pipelined | 2 M x 36 | 2.3 mm | 36 | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | DDR SRAM | 1.4 V | 1.25 V | SRAM | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||||
![]() | GS816272CGC-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 222.2@Flow-Through/333@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 21 | 2.3 V | 0 to 70 °C | Tray | GS816272CGC | Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 8 | 320 mA, 390 mA | 4.5 ns | Flow-Through/Pipelined | 256 k x 72 | 18 Bit | SRAM | 18 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161E18DGT-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 375 MHz | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | Industrial grade | 375 MHz | -40 to 70 °C | 18 Mbit | 2 | 270 mA, 340 mA | 4.2 ns | Flow-Through/Pipelined | 1 M x 18 | 20 Bit | 18 Mbit | Industrial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS864418E-225 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | Commercial grade | 153.8@Flow-Through/225@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 4 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 225 MHz | + 70 C | 3.6 V | 0 C | 15 | 2.3 V | 0 to 70 °C | Tray | GS864418E | 同步突发 | Memory & Data Storage | 72 Mbit | 2 | 250 mA, 335 mA | 6.5 ns | Flow-Through/Pipelined | 4 M x 18 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816273CGC-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | 250 MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 21 | 2.3 V | -40 to 85 °C | Tray | GS816273CGC | Pipeline | Memory & Data Storage | 18 Mbit | 8 | 360 mA | 5.5 ns | Pipelined | 256 k x 72 | 18 Bit | SRAM | 18 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS864436GE-166IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 166 MHz | + 85 C | 2.7 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 7 ns | 85 °C | 有 | GS864436GE-166IV | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.14 | BGA | Industrial grade | 125@Flow-Through/166@Pipelined MHz | FBGA | SDR | -40 to 85 °C | Tray | GS864436GE | e1 | 有 | 3A991.B.2.B | 同步突发 | Tin/Silver/Copper (Sn/Ag/Cu) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 72 Mbit | 4 | SYNCHRONOUS | 285 mA, 345 mA | 8 ns | Flow-Through/Pipelined | 2 M x 36 | 1.4 mm | 36 | 21 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 17 mm | 15 mm | ||||||||||||||||||||||||
![]() | GS816272CC-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-209 | YES | 209 | 209 | Synchronous | 256 kWords | 72 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 70 C | 2.7 V | 0 C | 21 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 256000 | PLASTIC/EPOXY | 未说明 | 5.5 ns | 70 °C | 无 | GS816272CC-250V | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.16 | BGA | Commercial grade | 181.8@Flow-Through/250@Pipelined MHz | BGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | 0 to 70 °C | Tray | GS816272CC | 无 | 3A991.B.2.B | SCD/DCD | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B209 | 不合格 | COMMERCIAL | 18 Mbit | 8 | SYNCHRONOUS | 265 mA, 350 mA | 5.5 ns | Flow-Through/Pipelined | 256 k x 72 | 1.7 mm | 72 | 18 Bit | SRAM | 18 Mbit | 18874368 bit | Commercial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 22 mm | 14 mm | ||||||||||||||||||||||||||||
![]() | GS88218CD-300M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 300 MHz | + 125 C | 3.6 V | - 55 C | 2.3 V | SMD/SMT | Parallel | Military grade | 200@Flow-Through/300@Pipelined MHz | -55 to 125 °C | GS88218CD | 9 Mbit | 2 | 205 mA, 260 mA | 5 ns | Flow-Through/Pipelined | 512 k x 18 | 19 Bit | 9 Mbit | Military | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302T08E-350M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | DDR-II | Military grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 125 C | 1.9 V | - 55 C | 10 | 1.7 V | SMD/SMT | -55 to 125 °C | Tray | GS81302T08E | SigmaDDR-II B2 | Memory & Data Storage | 144 Mbit | 2 | Pipelined | 16 M x 8 | 23 Bit | SRAM | 144 Mbit | Military | SRAM |
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