品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 数据率 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS81302Q37E-300M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | SigmaQuad-II+ | QDR-II | Military grade | 300 MHz | BGA | QDR | 1.8000 V | Synchronous | 4 MWords | 36 Bit | 表面贴装 | Compliant | 有 | 300 MHz | + 125 C | 1.9 V | - 55 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | Bulk | GS81302Q37E | SigmaQuad-II+ B2 | Memory & Data Storage | 1.8 V | 144 Mbit | Pipelined | 4 M x 36 | 22 Bit | SRAM | 144 Mbit | Military | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302T10GE-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | Industrial grade | 表面贴装 | 1.9 V | 9 Bit | 16 MWords | Synchronous | 1.7 V | 1.8000 V | DDR | FBGA | 350 MHz | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | -40 to 100 °C | Tray | GS81302T10GE | SigmaDDR-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 1 | 810 mA | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302S08GE-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | Details | DDR-II | Industrial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | -40 to 100 °C | Tray | GS81302S08GE | SigmaSIO DDR-II | Memory & Data Storage | 144 Mbit | 2 | 950 mA | Pipelined | 16 M x 8 | 23 Bit | SRAM | 144 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT37GE-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | 165 | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 4000000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | 有 | GS81302TT37GE-350 | 1.8 V | LBGA | RECTANGULAR | 不推荐 | GSI TECHNOLOGY | 5.06 | BGA | Commercial grade | 350 MHz | FBGA | DDR | 0 to 85 °C | Tray | GS81302TT37GE | e1 | 有 | 3A991.B.2.B | SigmaDDR-II+ B2 | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED ARCHITECTURE, LATE WRITE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 144 Mbit | 1 | SYNCHRONOUS | 895 mA | Pipelined | 4 M x 36 | 1.5 mm | 36 | 21 Bit | SRAM | 144 Mbit | 150994944 bit | Commercial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 17 mm | 15 mm | ||||||||||||||||
![]() | GS8662Q09BGD-357I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | 357 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 357 MHz | FBGA | QDR | -40 to 100 °C | GS8662Q09BGD | 72 Mbit | 2 | 995 mA | Pipelined | 8 M x 9 | 22 Bit | 72 Mbit | Industrial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8162Z18DGD-200VT | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | YES | 165 | 165 | 70 °C | 有 | GS8162Z18DGD-200VT | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.27 | BGA | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | LBGA, | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 未说明 | 6.5 ns | 0 to 85 °C | 3A991.B.2.B | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 2 | SYNCHRONOUS | Flow-Through/Pipelined | 1MX18 | 1.4 mm | 18 | 20 Bit | 18 Mbit | 18874368 bit | Commercial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z72C-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | Commercial grade | 117.6@Flow-Through/150@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 72 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 70 C | 2.7 V | 0 C | 14 | 1.7 V | 0 to 70 °C | Tray | GS8322Z72C | NBT | Memory & Data Storage | 36 Mbit | 8 | 210 mA, 260 mA | 8.5 ns | Flow-Through/Pipelined | 512 k x 72 | 19 Bit | SRAM | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D11GE-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 450 MHz | FBGA | 1.8000 V | 1.7 V | Synchronous | 9 Bit | 1.9 V | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | 0 to 85 °C | Tray | GS81302D11GE | SigmaQuad-II+ | Memory & Data Storage | 144 Mbit | 1.175 A | 0.45 | 16 M x 9 | SRAM | 144 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS882Z18CGB-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Industrial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 85 C | 2.7 V | - 40 C | 42 | 1.7 V | -40 to 85 °C | Tray | GS882Z18CGB | NBT | Memory & Data Storage | 9 Mbit | 2 | 125 mA, 160 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 18 | 18 Bit | SRAM | 9 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D07E-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 350 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | Industrial grade | -40 to 100 °C | 2 | Pipelined | 22 Bit | 144 Mbit | Industrial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8644Z18E-133 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | Commercial grade | 117.6@Flow-Through/133@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 4 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 133 MHz | + 70 C | 3.6 V | 0 C | 15 | 2.3 V | 0 to 70 °C | Tray | GS8644Z18E | NBT | Memory & Data Storage | 72 Mbit | 2 | 210 mA, 250 mA | 8.5 ns | Flow-Through/Pipelined | 4 M x 18 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302S18GE-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 333 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 333 MHz | FBGA | DDR | -40 to 100 °C | GS81302S18GE | 144 Mbit | 2 | 900 mA | Pipelined | 8 M x 18 | 22 Bit | 144 Mbit | Industrial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT10E-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | 165 | 9 Bit | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | LBGA, | GRID ARRAY, LOW PROFILE | 16000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS81302DT10E-350I | 1.8 V | LBGA | RECTANGULAR | 不推荐 | GSI TECHNOLOGY | 5.06 | BGA | Industrial grade | 350 MHz | FBGA | QDR | 1.8000 V | Synchronous | 16 MWords | -40 to 100 °C | Tray | GS81302DT10E | 无 | 3A991.B.2.B | SigmaQuad-II+ B4 | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 144 Mbit | 2 | SYNCHRONOUS | 950 mA | Pipelined | 16 M x 9 | 1.5 mm | 9 | 22 Bit | SRAM | 144 Mbit | 150994944 bit | Industrial | PARALLEL | QDR SRAM | 1.9 V | 1.7 V | SRAM | 17 mm | 15 mm | |||||||||||||||||||||
![]() | GS8673ET18BGK-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-260 | YES | 260 | 260 | Synchronous | 4 MWords | 18 Bit | 1.4 V | 表面贴装 | 有 | 500 MHz | + 85 C | 1.4 V | 0 C | 8 | 1.25 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-IIIe | Details | DDR-III | HBGA, | GRID ARRAY, HEAT SINK/SLUG | 4000000 | PLASTIC/EPOXY | 未说明 | 0.4 ns | 85 °C | 有 | GS8673ET18BGK-500 | 1.3 V | HBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.72 | Commercial grade | 500 MHz | BGA | DDR | 1.3500 V | 1.25 V | 0 to 70 °C | Tray | GS8673ET18BGK | 3A991.B.2.B | SigmaDDR-IIIe B2 | IT ALSO OPERATES AT 1.35 V TYPICAL VOLTAGE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B260 | OTHER | 72 Mbit | 2 | SYNCHRONOUS | 1.38 A | Pipelined | 4 M x 18 | 2.3 mm | 18 | 21 Bit | SRAM | 72 Mbit | 75497472 bit | Commercial | PARALLEL | DDR SRAM | 1.4 V | 1.25 V | SRAM | 22 mm | 14 mm | ||||||||||||||||||||||
![]() | GS8673ED18BGK-550I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-260 | 260 | SigmaQuad-IIIe | Details | DDR | Industrial grade | 550/375 MHz | BGA | QDR | 1.3500 V | Synchronous | 4 MWords | 18 Bit | 表面贴装 | 有 | 550 MHz | + 100 C | 1.4 V | - 40 C | 8 | 1.25 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | -40 to 85 °C | Tray | GS8673ED18BGK | SigmaQuad-IIIe B4 | Memory & Data Storage | 72 Mbit | 1.93 A | 1.1 Gb/s | Pipelined | 4 M x 18 | 20 Bit | SRAM | 72 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT07GE-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | Industrial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | -40 to 100 °C | Tray | GS81302TT07GE | SigmaDDR-II+ B2 | Memory & Data Storage | 144 Mbit | 1 | 810 mA | Pipelined | 16 M x 8 | 23 Bit | SRAM | 144 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8128436B-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | - 40 C | 3.6 V | + 85 C | 200 MHz | 有 | Industrial grade | 200 MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 4 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | SDR | SyncBurst | GSI技术 | GSI技术 | Parallel | SMD/SMT | 2.3 V | 10 | -40 to 85 °C | Tray | GS8128436B | SCD/DCD Pipeline/Flow Through | Memory & Data Storage | 144 Mbit | 4 | 385 mA, 475 mA | 7.5 ns | Flow-Through/Pipelined | 4 M x 36 | 22 Bit | SRAM | 144 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81284Z36B-200IVT | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | YES | 119 | 119 | 未说明 | 7.5 ns | 85 °C | 无 | GS81284Z36B-200IVT | 1.8 V | BGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.35 | BGA | Industrial grade | 200 MHz | BGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 4 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | BGA, | 网格排列 | 4000000 | PLASTIC/EPOXY | -40 °C | -40 to 85 °C | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | PIPELINE AND FLOW THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 2.3V TO 2.7V SUPPLY | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | INDUSTRIAL | 4 | SYNCHRONOUS | Flow-Through/Pipelined | 4MX36 | 1.99 mm | 36 | 20 Bit | 144 Mbit | 150994944 bit | Industrial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT07E-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR-II | Commercial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 70 °C | Tray | GS81302TT07E | SigmaDDR-II+ B2 | Memory & Data Storage | 144 Mbit | 1 | 1 A | Pipelined | 16 M x 8 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS840H18AB-100I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 119 | 119 | GSI TECHNOLOGY | 5.21 | BGA | Compliant | BGA, BGA119,7X17,50 | 网格排列 | 3 | 256000 | PLASTIC/EPOXY | BGA119,7X17,50 | -40 °C | 未说明 | 12 ns | 85 °C | 无 | GS840H18AB-100I | 100 MHz | 262144 words | 3.3 V | BGA | RECTANGULAR | GSI技术 | 活跃 | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | 3.3 V | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | 2.5/3.3,3.3 V | INDUSTRIAL | 2 | SYNCHRONOUS | 0.2 mA | 256KX18 | 3-STATE | 2.19 mm | 18 | 18 b | 4.5 Mb | 0.03 A | 4.5 | PARALLEL | COMMON | 缓存SRAM | 3.14 V | 3.6 V | 3 V | 22 mm | 14 mm | 无 | |||||||||||||||||||||||||||||||||||||
![]() | GS8662TT38BD-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaDDR-II+ | N | DDR | Commercial grade | 350 MHz | FBGA | DDR | 1.8000 V | Synchronous | 2 MWords | 36 Bit | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | 0 to 85 °C | Tray | GS8662TT38BD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 1 | 755 mA | Pipelined | 2 M x 36 | 20 Bit | SRAM | 72 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302S18GE-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | Details | DDR-II | Commercial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302S18GE | SigmaSIO DDR-II | Memory & Data Storage | 144 Mbit | 2 | 940 mA | Pipelined | 8 M x 18 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS882Z36CD-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.7, 2.3 V | Synchronous | 256 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 256000 | PLASTIC/EPOXY | -40 °C | 未说明 | 5.5 ns | 85 °C | 无 | GS882Z36CD-250IV | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.14 | BGA | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | -40 to 85 °C | Tray | GS882Z36CD | e0 | 无 | 3A991.B.2.B | NBT | Tin/Lead (Sn/Pb) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | not_compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 9 Mbit | 4 | SYNCHRONOUS | 160 mA, 200 mA | 5.5 ns | Flow-Through/Pipelined | 256 k x 36 | 1.4 mm | 36 | 18 Bit | SRAM | 9 Mbit | 9437184 bit | Industrial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||||||||||
![]() | GS81302S36E-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR-II | Industrial grade | 375 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 375 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS81302S36E | SigmaSIO DDR-II | Memory & Data Storage | 144 Mbit | 2 | 1.115 A | Pipelined | 4 M x 36 | 21 Bit | SRAM | 144 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D37GE-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | Industrial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | -40 to 100 °C | Tray | GS81302D37GE | SigmaQuad-II+ B4 | Memory & Data Storage | 144 Mbit | 2 | 1.41 A | Pipelined | 4 M x 36 | 20 Bit | SRAM | 144 Mbit | Industrial | SRAM |
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