品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 数据率 | 内存接口 | 建筑学 | 数据总线宽度 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 访问模式 | 产品类别 | 组织的记忆 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8182D36BGD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 512 kWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 18 | 0 to 70 °C | Tray | GS8182D36BGD | SigmaQuad-II | 70 °C | 0 °C | Memory & Data Storage | 1.8 V | 18 Mbit | 2 | 905 mA | Pipelined | 512 k x 36 | 17 Bit | SRAM | 18 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662S08BGD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR | Compliant | 有 | 250 MHz | + 85 C | 1.9 V | - 40 C | 15 | Tray | GS8662S08BGD | SigmaSIO DDR-II | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 510 mA | 8 M x 8 | 22 b | SRAM | 72 Mb | 72 | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8162Z36DB-333V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | 200@Flow-Through/333@Pipelined MHz | FBGA | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2, 2.7 V | 36 Bit | Compliant | 有 | 333 MHz | + 70 C | 2.7 V | 0 C | 21 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | 0 to 85 °C | Bulk | GS8162Z36DB | NBT Pipeline/Flow Through | 85 °C | 0 °C | Memory & Data Storage | 18 Mbit | 4 | 240 mA, 310 mA | 5@Flow-Through/3@Pip | 512 k x 36 | 19 Bit | SRAM | 18 Mb | 18 | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS880F18CGT-6.5V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | 2, 2.7 V | Compliant | 有 | + 70 C | 2.7 V | 0 C | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | QFP100,.63X.87 | 未说明 | 6.5 ns | 70 °C | 有 | GS880F18CGT-6.5V | 153 MHz | 524288 words | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | QFP | 153.8 MHz | TQFP | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 18 Bit | 0 to 70 °C | Tray | GS880F18CGT | e3 | 有 | 3A991.B.2.B | 流过 | 纯哑光锡 | 70 °C | 0 °C | FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 2.3 V TO 2.7 V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 1.8/2.5 V | COMMERCIAL | 9 Mbit | 2 | SYNCHRONOUS | 115 mA | 6.5 | 512 k x 18 | 3-STATE | 1.6 mm | 18 | 18 b | SRAM | 9 Mb | 0.025 A | 9 | PARALLEL | COMMON | 缓存SRAM | 1.7 V | 2 V | 1.7 V | SRAM | 20 mm | 14 mm | 无 | |||||||||||||||||||||||||
![]() | GS4288S18GL-18 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 144 | 未说明 | 有 | GS4288S18GL-18 | 16777216 words | 1.8 V | TBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.59 | BGA | Compliant | TBGA, | GRID ARRAY, THIN PROFILE | 16000000 | PLASTIC/EPOXY | 3A991.B.2.B | 95 °C | 0 °C | 自动刷新 | 8542.32.00.28 | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B144 | 1 | SYNCHRONOUS | 18 b | 16MX18 | 1.2 mm | 18 | 23 b | 288 Mb | 301989888 bit | 533 MHz | DDR DRAM | 1.9 V | 1.7 V | 多库页面突发 | 11 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS4288S18GL-18I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 144 | 未说明 | 有 | GS4288S18GL-18I | 16777216 words | 1.8 V | TBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.61 | BGA | Compliant | TBGA, | GRID ARRAY, THIN PROFILE | 16000000 | PLASTIC/EPOXY | 3A991.B.2.B | 95 °C | -40 °C | 自动刷新 | 8542.32.00.28 | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B144 | 1 | SYNCHRONOUS | 18 b | 16MX18 | 1.2 mm | 18 | 23 b | 288 Mb | 301989888 bit | 533 MHz | DDR DRAM | 1.9 V | 1.7 V | 多库页面突发 | 11 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS4288S09L-25I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 144 | 未说明 | 无 | GS4288S09L-25I | 33554432 words | 1.8 V | TBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.7 | BGA | Compliant | TBGA, | GRID ARRAY, THIN PROFILE | 32000000 | PLASTIC/EPOXY | 3A991.B.2.B | 95 °C | -40 °C | 自动刷新 | 8542.32.00.28 | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B144 | 1 | SYNCHRONOUS | 9 b | 32MX9 | 1.2 mm | 9 | 24 b | 288 Mb | 301989888 bit | 400 MHz | DDR DRAM | 1.9 V | 1.7 V | 多库页面突发 | 11 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS4288S09L-33I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 144 | 未说明 | 无 | GS4288S09L-33I | 33554432 words | 1.8 V | TBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.7 | BGA | Compliant | TBGA, | GRID ARRAY, THIN PROFILE | 32000000 | PLASTIC/EPOXY | 3A991.B.2.B | 95 °C | -40 °C | 自动刷新 | 8542.32.00.28 | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B144 | 1 | SYNCHRONOUS | 9 b | 32MX9 | 1.2 mm | 9 | 24 b | 288 Mb | 301989888 bit | 300 MHz | DDR DRAM | 1.9 V | 1.7 V | 多库页面突发 | 11 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302S09E-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR-II | Commercial grade | 375 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 375 MHz | + 70 C | 1.9 V | 0 C | 10 | 0 to 85 °C | Bulk | GS81302S09E | SigmaSIO DDR-II | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 995 mA | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342Q37BD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Industrial grade | 333 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Bulk | GS8342Q37BD | SigmaQuad-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 1.02 A | Pipelined | 1 M x 36 | 19 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT10GE-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | Commercial grade | 350 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 10 | 0 to 85 °C | Tray | GS81302DT10GE | SigmaQuad-II+ B4 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 940 mA | Pipelined | 16 M x 9 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT10GE-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | Industrial grade | 400 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 10 | -40 to 100 °C | Tray | GS81302DT10GE | SigmaQuad-II+ B4 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 1.065 A | Pipelined | 16 M x 9 | 22 Bit | SRAM | 144 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662Q19BGD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Industrial grade | 表面贴装 | 1.9 V | 18 Bit | 4 MWords | Synchronous | 1.7 V | 1.8000 V | QDR | FBGA | 250 MHz | Compliant | 有 | 250 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Tray | GS8662Q19BGD | SigmaQuad-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 730 mA | Pipelined | 4 M x 18 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS4288S09GL-25 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 144 | 未说明 | 有 | GS4288S09GL-25 | 33554432 words | 1.8 V | TBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.63 | BGA | Compliant | TBGA, | GRID ARRAY, THIN PROFILE | 32000000 | PLASTIC/EPOXY | 3A991.B.2.B | 95 °C | 0 °C | 自动刷新 | 8542.32.00.28 | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B144 | 1 | SYNCHRONOUS | 9 b | 32MX9 | 1.2 mm | 9 | 24 b | 288 Mb | 301989888 bit | 400 MHz | DDR DRAM | 1.9 V | 1.7 V | 多库页面突发 | 11 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832036AGT-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | Parallel | LQFP, | FLATPACK, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 未说明 | 6.5 ns | 85 °C | 有 | GS832036AGT-200V | 1048576 words | 1.8 V | LQFP | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.35 | QFP | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 36 Bit | 2, 2.7 V | Compliant | 200 MHz | + 70 C | 2.7 V | 0 C | 1.7 V | SMD/SMT | 0 to 85 °C | Bulk | 3A991.B.2.B | 85 °C | 0 °C | ALSO OPERTAES AT 2.5, SYNCHRONOUS BURST | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | OTHER | 36 Mbit | 4 | SYNCHRONOUS | 215 mA, 250 mA | 6.5@Flow-Through/3@P | 1 M x 36 | 1.6 mm | 36 | 20 b | 36 Mb | 36 | Commercial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | 20 mm | 14 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182S18BGD-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR | Industrial grade | 375 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 18 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 375 MHz | + 85 C | 1.9 V | - 40 C | 18 | -40 to 85 °C | Tray | GS8182S18BGD | SigmaSIO DDR-II | 85 °C | -40 °C | Memory & Data Storage | 1.8 V | 18 Mbit | 2 | 690 mA | Pipelined | 1 M x 18 | 19 Bit | SRAM | 18 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8673ED18BGK-675I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | BGA-260 | YES | 260 | 260-BGA (22x14) | 260 | 18 Bit | 1.4 V | 表面贴装 | 有 | 675 MHz | + 100 C | 1.4 V | - 40 C | GSI Technology Inc. | 8 | 1.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-IIIe | Details | DDR | Tray | GS8673ED | 活跃 | HBGA, | GRID ARRAY, HEAT SINK/SLUG | 4000000 | PLASTIC/EPOXY | 未说明 | 有 | GS8673ED18BGK-675I | 1.35 V | HBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.73 | Industrial grade | 675/450 MHz | BGA | QDR | 1.3500 V | 1.3 V | Synchronous | 4 MWords | -40 to 85 °C | Tray | GS8673ED18BGK | 3A991.B.2.B | SigmaQuad-IIIe B4 | 8542.32.00.41 | Memory & Data Storage | SRAM - Quad Port, Synchronous | 1.3V ~ 1.4V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B260 | 72 Mbit | SYNCHRONOUS | 675 MHz | 2.26 A | SRAM | 1.35 Gb/s | Parallel | Pipelined | 4 M x 18 | 2.3 mm | 18 | - | 20 Bit | SRAM | 72 Mb | 75497472 bit | Industrial | PARALLEL | DDR SRAM | 1.4 V | 1.3 V | SRAM | 4M x 18 | 22 mm | 14 mm | ||||||||||||||||||||||||||||
![]() | GS81302T36GE-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-165 | 165 | 165-FPBGA (15x17) | GSI Technology Inc. | 1.7 V | GSI技术 | SigmaDDR-II | DDR-II | GSI技术 | Parallel | SMD/SMT | Tray | GS81302T36 | 活跃 | Industrial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 10 | -40 to 100 °C | Bulk | GS81302T36GE | SigmaDDR-II B2 | 100 °C | -40 °C | Memory & Data Storage | SRAM - Quad Port, Synchronous, DDR II | 1.8 V | 144 Mbit | 2 | 350 MHz | 905 mA | SRAM | Parallel | Pipelined | 4 M x 36 | - | 22 Bit | SRAM | 144 Mbit | Industrial | SRAM | 4M x 36 | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z36B-166I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 85 °C | -40 °C | 4 | 20 b | 36 Mb | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8160E32BGT-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 100 | FLATPACK, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | 未说明 | 6.5 ns | 70 °C | 有 | GS8160E32BGT-200 | 524288 words | 2.5 V | LQFP | RECTANGULAR | GSI技术 | Obsolete | GSI TECHNOLOGY | 5.72 | QFP | LQFP, | e3 | 有 | 3A991.B.2.B | 纯哑光锡 | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | COMMERCIAL | SYNCHRONOUS | 512KX32 | 1.6 mm | 32 | 16777216 bit | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8170LW72AC-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks, 2 Days | YES | 209 | 209 | Compliant | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | -40 °C | 未说明 | 1.8 ns | 85 °C | 无 | GS8170LW72AC-300I | 262144 words | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 不推荐 | GSI TECHNOLOGY | 5.21 | BGA | 无 | 3A991.B.2.B | 85 °C | -40 °C | 流水线结构 | 8542.32.00.41 | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B209 | 不合格 | INDUSTRIAL | 8 | SYNCHRONOUS | 256KX72 | 1.7 mm | 72 | 18 b | 18 Mb | 18874368 bit | PARALLEL | 标准SRAM | 1.95 V | 1.7 V | 22 mm | 14 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816118BD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 85 °C | -40 °C | 2 | 20 b | 18 Mb | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z36B-166 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 70 °C | 0 °C | 4 | 20 b | 36 Mb | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z36E-166I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 165 | 165 | GS8322Z36E-166I | 1048576 words | 2.5 V | LBGA | RECTANGULAR | GSI技术 | 不推荐 | GSI TECHNOLOGY | 5.48 | BGA | 无 | 85 °C | 8 ns | 未说明 | -40 °C | PLASTIC/EPOXY | 1000000 | 3 | GRID ARRAY, LOW PROFILE | LBGA, | 无 | 3A991.B.2.B | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | unknown | R-PBGA-B165 | 不合格 | INDUSTRIAL | SYNCHRONOUS | 1MX36 | 1.4 mm | 36 | 37748736 bit | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | 17 mm | 15 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161Z36BD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 165 | 165 | 13 X 15 MM, 1 MM PITCH, FBGA-165 | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | 未说明 | 6.5 ns | 70 °C | 无 | GS8161Z36BD-200 | 524288 words | 2.5 V | LBGA | RECTANGULAR | GSI技术 | Obsolete | GSI TECHNOLOGY | 5.68 | BGA | Compliant | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | not_compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 4 | SYNCHRONOUS | 512KX36 | 1.4 mm | 36 | 19 b | 18 Mb | 18874368 bit | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | 15 mm | 13 mm | 无 |
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