品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8182T09BD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 70 °C | 0 °C | 1.8 V | 1 | 20 b | 18 Mb | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z36AD-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 36 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 375 MHz | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 4.2 ns | 70 °C | 无 | GS8322Z36AD-375 | 375 MHz | 2.5 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.12 | BGA | Commercial grade | 238@Flow-Through/375@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 0 to 85 °C | Bulk | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 85 °C | 0 °C | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | COMMERCIAL | 36 Mbit | 4 | SYNCHRONOUS | 270 mA, 380 mA | 4.2 ns | Flow-Through/Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 20 Bit | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | 2.7 V | 2.3 V | 15 mm | 13 mm | 无 | ||||||||||||||
![]() | GS8662DT07BGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | 1.7 V | Industrial grade | 333 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Bulk | GS8662DT07BGD | SigmaQuad-II+ B4 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 640 mA | Pipelined | 8 M x 8 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T09BD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 165 | 165 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8182T09BD-250I | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.19 | BGA | Industrial grade | 250 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | LBGA, | GRID ARRAY, LOW PROFILE | 2000000 | -40 to 85 °C | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | PIPELINED ARCHITECTURE, LATE WRITE | 8542.32.00.41 | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | not_compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 1 | SYNCHRONOUS | Pipelined | 2MX9 | 1.4 mm | 9 | 20 Bit | 18 Mbit | 18874368 bit | Industrial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | 15 mm | 13 mm | 无 | ||||||||||||||||||||||||||||||||
![]() | GS81302D19E-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | QDR-II | Commercial grade | 400 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302D19E | SigmaQuad-II+ B4 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 1.055 A | Pipelined | 8 M x 18 | 21 Bit | SRAM | 144 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321E18AD-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.7, 2.3 V | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 70 C | 2.7 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | 未说明 | 6.5 ns | 85 °C | 无 | GS8321E18AD-200V | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.38 | BGA | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 0 to 85 °C | Tray | GS8321E18AD | 3A991.B.2.B | 同步突发 | 85 °C | 0 °C | ALSO OPERATES AT 2.5 V SUPPLY; PIPELINE MODE | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | OTHER | 36 Mbit | 2 | SYNCHRONOUS | 195 mA, 230 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 18 | 1.4 mm | 18 | 21 Bit | SRAM | 36 Mbit | 37748736 bit | Commercial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||||||
![]() | GS8662T09BGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 8 MWords | 9 Bit | 表面贴装 | Compliant | 333 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 333 MHz | FBGA | DDR | 1.8000 V | Synchronous | 0 to 85 °C | GS8662T09BGD | 85 °C | 0 °C | 1.8 V | 72 Mbit | 1 | 535 mA | Pipelined | 8 M x 9 | 22 Bit | 72 Mbit | Commercial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881E32CGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 222.2@Flow-Through/333@Pipelined MHz | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 32 Bit | 2.7, 3.6 V | Compliant | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | 0 to 70 °C | Tray | GS881E32CGD | DCD Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 9 Mbit | 4 | 180 mA, 240 mA | 4.5@Flow-Through/2.5 | 256 k x 32 | 18 b | SRAM | 8 Mb | 8 | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D37BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Industrial grade | 400 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8342D37BGD | SigmaQuad-II+ B4 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 915 mA | Pipelined | 1 M x 36 | 18 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8128436GB-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 200 MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 4 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 70 C | 3.6 V | 0 C | 10 | 2.3 V | 0 to 70 °C | Tray | GS8128436GB | SCD/DCD Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 144 Mbit | 4 | 350 mA, 440 mA | 7.5 ns | Flow-Through/Pipelined | 4 M x 36 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T09BGD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 300 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | Commercial grade | 0 to 85 °C | 85 °C | 0 °C | 1.8 V | 1 | Pipelined | 22 Bit | 72 Mb | Commercial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T09BGD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 300 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 300 MHz | -40 to 100 °C | GS8662T09BGD | 100 °C | -40 °C | 1.8 V | 72 Mbit | 1 | 505 mA | Pipelined | 8 M x 9 | 22 Bit | 72 Mbit | Industrial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z72GC-133 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | 0 C | 3.6 V | + 70 C | 133 MHz | 有 | Commercial grade | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | SDR | Details | NBT SRAM | GSI技术 | GSI技术 | Parallel | SMD/SMT | 2.3 V | 14 | 0 to 70 °C | Tray | GS8322Z72GC | NBT Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 36 Mbit | 8 | 210 mA, 235 mA | 8.5 ns | Flow-Through/Pipelined | 512 k x 72 | 19 b | SRAM | 36 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182R18BD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 18 Bit | 1.9 V | 表面贴装 | Compliant | Commercial grade | 0 to 70 °C | 70 °C | 0 °C | 1.8 V | 1 | Pipelined | 20 Bit | 18 Mbit | Commercial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321E32AGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 32 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 4.5 ns | 85 °C | 有 | GS8321E32AGD-333 | 333 MHz | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.31 | BGA | Commercial grade | 222@Flow-Through/333@Pipelined MHz | 0 to 85 °C | Tray | GS8321E32AGD | e1 | 有 | 3A991.B.2.B | DCD Pipeline/Flow Through | 锡银铜 | 85 °C | 0 °C | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | OTHER | 36 Mbit | 4 | SYNCHRONOUS | 260 mA, 345 mA | 4.5 ns | Flow-Through/Pipelined | 1 M x 32 | 3-STATE | 1.4 mm | 32 | 20 Bit | SRAM | 36 Mbit | 0.03 A | 33554432 bit | Commercial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | 无 | |||||
![]() | GS88118CD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Commercial grade | 222.2@Flow-Through/333@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 36 | 0 to 70 °C | Tray | GS88118CD | Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 9 Mbit | 1 | 165 mA, 220 mA | 4.5 ns | Flow-Through/Pipelined | 512 k x 18 | 19 Bit | SRAM | 9 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z36AD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 2.3, 3 V | Synchronous | 表面贴装 | 2.7, 3.6 V | 36 Bit | 1 MWords | Compliant | 400 MHz | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | Commercial grade | FBGA | SDR | 2.5, 3.3 V | 0 to 85 °C | Bulk | 85 °C | 0 °C | 36 Mbit | 4 | 285 mA, 395 mA | 4 ns | Flow-Through/Pipelined | 1 M x 36 | 20 b | 36 Mbit | Commercial | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS880Z18CGT-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Industrial grade | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 85 C | 2.7 V | - 40 C | 66 | 1.7 V | SMD/SMT | Parallel | -40 to 85 °C | Tray | GS880Z18CGT | NBT | 85 °C | -40 °C | Memory & Data Storage | 9 Mbit | 1 | 125 mA, 160 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 18 | 18 b | SRAM | 9 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342T38BGD-550I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | Industrial grade | 550 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 550 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8342T38BGD | SigmaQuad-II+ | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 1 | 1.05 A | Pipelined | 1 M x 36 | 19 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881E32CGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 2.7, 3.6 V | 32 Bit | 256 kWords | Synchronous | 2.3, 3 V | 2.5, 3.3 V | SDR | FBGA | 有 | 333 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | -40 °C | 未说明 | 4.5 ns | 85 °C | 有 | GS881E32CGD-333I | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.16 | BGA | Industrial grade | 222.2@Flow-Through/333@Pipelined MHz | 表面贴装 | -40 to 85 °C | Tray | GS881E32CGD | e1 | 有 | 3A991.B.2.B | DCD Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 9 Mbit | 4 | SYNCHRONOUS | 200 mA, 260 mA | 4.5 ns | Flow-Through/Pipelined | 256 k x 32 | 1.4 mm | 32 | 18 Bit | SRAM | 8 Mbit | 8388608 bit | Industrial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||
![]() | GS8320Z18AGT-333IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | Compliant | 333 MHz | + 85 C | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 200@Flow-Through/333@Pipelined MHz | -40 to 100 °C | Bulk | 100 °C | -40 °C | 36 Mbit | 2 | 265 mA, 350 mA | 5 ns | Flow-Through/Pipelined | 2 M x 18 | 21 Bit | 36 Mbit | Industrial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT07GE-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | QDR-II | Commercial grade | 400 MHz | FBGA | 1.8000 V | 1.7 V | Synchronous | 8 Bit | 1.9 V | Compliant | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | 0 to 85 °C | Tray | GS81302DT07GE | SigmaQuad-II+ B4 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 1.055 A | 0.45 | 16 M x 8 | 22 b | SRAM | 144 Mb | 144 | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832136AD-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | Compliant | 200 MHz | + 85 C | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | LBGA, | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 未说明 | 6.5 ns | 无 | GS832136AD-200IV | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.16 | BGA | Industrial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | -40 to 100 °C | Bulk | 3A991.B.2.B | 100 °C | -40 °C | PIPELINE OR FLOW THROUGH ARCHITECTURE; ALSO OPERATES AT 2.5 SUPPLY | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 36 Mbit | 4 | SYNCHRONOUS | 235 mA, 270 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 36 | 1.4 mm | 36 | 20 Bit | 36 Mbit | 37748736 bit | Industrial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | 15 mm | 13 mm | 无 | |||||||||||||||||||||||||||
![]() | GS8662R08BD-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaCIO DDR-II | DDR | Commercial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 15 | 0 to 85 °C | Bulk | GS8662R08BD | SigmaDDR-II B4 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 590 mA | Pipelined | 8 M x 8 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8162Z18DD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Commercial grade | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 400 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | 0 to 85 °C | Bulk | GS8162Z18DD | NBT Pipeline/Flow Through | 85 °C | 0 °C | Memory & Data Storage | 18 Mbit | 2 | 255 mA, 335 mA | 4 ns | Flow-Through/Pipelined | 1 M x 18 | 20 b | SRAM | 18 Mbit | Commercial | SRAM | 无 |
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