品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8342TT06BGD-550I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Industrial grade | 550 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 550 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Bulk | GS8342TT06BGD | SigmaQuad-II+ | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 1 | 810 mA | Pipelined | 4 M x 8 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662S09BGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR | Compliant | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Tray | GS8662S09BGD | SigmaSIO DDR-II | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 640 mA | 8 M x 9 | 22 b | SRAM | 72 Mb | 72 | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D38BGD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | BGA | 5.48 | GSI TECHNOLOGY | 活跃 | RECTANGULAR | LBGA | 1.8 V | GS8662D38BGD-450I | 有 | 85 °C | 0.45 ns | 未说明 | -40 °C | PLASTIC/EPOXY | 2000000 | Industrial grade | 450 MHz | FBGA | -40 to 100 °C | Tray | GS8662D38BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad-II+ | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 72 Mbit | 2 | SYNCHRONOUS | 1.065 A | Pipelined | 2 M x 36 | 1.4 mm | 36 | 19 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | QDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||
![]() | GS8662D37BD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | SigmaQuad-II+ | DDR | Industrial grade | 450 MHz | FBGA | QDR | 1.8000 V | Synchronous | 2 MWords | 36 Bit | 表面贴装 | Compliant | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | -40 to 100 °C | Bulk | GS8662D37BD | SigmaQuad-II+ B4 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 1.065 A | Pipelined | 2 M x 36 | 19 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8320Z18AGT-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | Compliant | 250 MHz | + 85 C | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | -40 to 100 °C | Bulk | 100 °C | -40 °C | 36 Mbit | 2 | 245 mA, 285 mA | 5.5 ns | Flow-Through/Pipelined | 2 M x 18 | 21 Bit | 36 Mbit | Industrial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D11BGD-550I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Industrial grade | 550 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 550 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Bulk | GS8342D11BGD | SigmaQuad-II+ | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 950 mA | Pipelined | 4 M x 9 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662Q37BGD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | Commercial grade | 200 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 200 MHz | + 70 C | 1.9 V | 0 C | 15 | 0 to 85 °C | Tray | GS8662Q37BGD | SigmaQuad-II+ B2 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 740 mA | Pipelined | 2 M x 36 | 20 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88237CGB-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 250 MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 表面贴装 | 2, 2.7 V | 36 Bit | 256 kWords | Compliant | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | 42 | -40 to 85 °C | Tray | GS88237CGB | SCD/DCD Pipeline | 85 °C | -40 °C | Memory & Data Storage | 9 Mbit | 2 | 215 mA | Pipelined | 256 k x 36 | 18 Bit | SRAM | 9 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832136AD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 36 Bit | 2.7, 3.6 V | Compliant | 有 | 333 MHz | + 85 C | 3.6 V | GSI技术 | SyncBurst | SDR | - 40 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 4.5 ns | 85 °C | 无 | GS832136AD-333I | 333 MHz | 1048576 words | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.16 | BGA | 222.2@Flow-Through/333@Pipelined MHz | FBGA | 2.5, 3.3 V | 2.3, 3 V | Synchronous | -40 to 100 °C | Bulk | GS832136AD | 3A991.B.2.B | Pipeline/Flow Through | 100 °C | -40 °C | PIPELINE OR FLOW THROUGH ARCHITECTUREL; ALSO OPERATES AT 3.3 V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 36 Mbit | 4 | SYNCHRONOUS | 280 mA, 365 mA | 4.5@Flow-Through/2.5 | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 20 b | SRAM | 36 Mb | 0.04 A | 36 | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||||
![]() | GS8182R08BD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 70 °C | 0 °C | 1.8 V | 1 | 19 b | 18 Mb | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832272C-225IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 142.8@Flow-Through/225@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 72 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 225 MHz | + 85 C | 2.7 V | - 40 C | 14 | -40 to 85 °C | Tray | GS832272C | 同步突发 | 85 °C | -40 °C | Memory & Data Storage | 36 Mbit | 8 | 265 mA, 370 mA | 7 ns | Flow-Through/Pipelined | 512 k x 72 | 19 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z18AGB-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 200 MHz | + 85 C | 2.7 V | - 40 C | 14 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | BGA, BGA119,7X17,50 | 网格排列 | 2000000 | PLASTIC/EPOXY | BGA119,7X17,50 | -40 °C | 未说明 | 6.5 ns | 85 °C | 有 | GS8322Z18AGB-200IV | 200 MHz | 1.8 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.13 | BGA | Industrial grade | FBGA | SDR | -40 to 100 °C | Bulk | GS8322Z18AGB | 3A991.B.2.B | NBT | 100 °C | -40 °C | ALSO OPERATED WITH 2.5V SUPPLY; PIPELINE/FLOW THROUGH ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | 1.8/2.5 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 215 mA, 250 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.99 mm | 18 | 21 b | SRAM | 36 Mbit | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | ZBT SRAM | 1.7 V | 2 V | 1.7 V | SRAM | 22 mm | 14 mm | 无 | ||||||||
![]() | GS8662Q37BD-357I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | Industrial grade | 357 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 357 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Bulk | GS8662Q37BD | SigmaQuad-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 1.205 A | Pipelined | 2 M x 36 | 20 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662Q08BGD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 250 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 250 MHz | 0 to 85 °C | GS8662Q08BGD | 85 °C | 0 °C | 1.8 V | 72 Mbit | 2 | 720 mA | Pipelined | 8 M x 8 | 22 Bit | 72 Mbit | Commercial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662S18BD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR | Industrial grade | 250 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 250 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Tray | GS8662S18BD | SigmaSIO DDR-II | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 510 mA | Pipelined | 4 M x 18 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342DT10BD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8342DT10BD-350I | 350 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.22 | BGA | Industrial grade | 350 MHz | -40 to 100 °C | Bulk | GS8342DT10BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II+ B4 | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 675 mA | Pipelined | 4 M x 9 | 3-STATE | 1.4 mm | 9 | 20 Bit | SRAM | 36 Mb | 37748736 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||||
![]() | GS88118CGD-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | Compliant | 250 MHz | + 70 C | 2.7 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | FBGA | SDR | 1.8, 2.5 V | 0 to 70 °C | 70 °C | 0 °C | 9 Mbit | 1 | 125 mA, 165 mA | 5.5 ns | Flow-Through/Pipelined | 512 k x 18 | 18 b | 9 Mbit | Commercial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342TT37BGD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | SigmaDDR-II+ | DDR | Commercial grade | 450 MHz | FBGA | DDR | 1.8000 V | Synchronous | 1 MWords | 36 Bit | 表面贴装 | Compliant | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | 0 to 85 °C | Bulk | GS8342TT37BGD | SigmaDDR-II+ B2 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 1 | 860 mA | Pipelined | 1 M x 36 | 19 Bit | SRAM | 36 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8673ED19BK-625M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-260 | Compliant | 有 | 625 MHz | + 125 C | - 55 C | 8 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-IIIe | DDR | Tray | GS8673ED19BK | SigmaQuad-IIIe | 125 °C | -55 °C | Memory & Data Storage | 1.35 V | 72 Mbit | 4 M x 18 | SRAM | 72 Mb | 72 | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS882Z18CGB-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Commercial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 250 MHz | + 70 C | 2.7 V | 0 C | 42 | 0 to 70 °C | Tray | GS882Z18CGB | NBT | 70 °C | 0 °C | Memory & Data Storage | 9 Mbit | 2 | 125 mA, 165 mA | 5.5 ns | Flow-Through/Pipelined | 512 k x 18 | 18 Bit | SRAM | 9 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS864236GB-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks, 2 Days | BGA-119 | YES | 119 | 119 | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 200 MHz | + 70 C | 2.7 V | 0 C | 14 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | BGA, | 网格排列 | 3 | 2000000 | PLASTIC/EPOXY | 未说明 | 7.5 ns | 70 °C | 有 | GS864236GB-200V | 1.8 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.16 | BGA | Commercial grade | 133.3@Flow-Through/200@Pipelined MHz | FBGA | SDR | 0 to 70 °C | Tray | GS864236GB | e1 | 有 | 3A991.B.2.B | SCD/DCD Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | COMMERCIAL | 72 Mbit | 4 | SYNCHRONOUS | 230 mA, 310 mA | 7.5 ns | Flow-Through/Pipelined | 2 M x 36 | 1.99 mm | 36 | 21 Bit | SRAM | 72 Mbit | 75497472 bit | Commercial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 22 mm | 14 mm | 无 | |||||||||||
![]() | GS8673ED36BK-625M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-260 | 260 | 1.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-IIIe | DDR | Military grade | 625/400 MHz | BGA | QDR | 1.3500 V | 1.3 V | Synchronous | 2 MWords | 36 Bit | 1.4 V | 表面贴装 | Compliant | 有 | 625 MHz | + 125 C | 1.4 V | - 55 C | 8 | -55 to 125 °C | Tray | GS8673ED36BK | SigmaQuad-IIIe B4 | 125 °C | -55 °C | Memory & Data Storage | 1.35 V | 72 Mbit | 2.97 A | Pipelined | 2 M x 36 | 19 Bit | SRAM | 72 Mbit | Military | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662Q37BGD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | Industrial grade | 250 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 250 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Tray | GS8662Q37BGD | SigmaQuad-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 905 mA | Pipelined | 2 M x 36 | 20 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T08BGD-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 375 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | Industrial grade | -40 to 85 °C | 85 °C | -40 °C | 1.8 V | 1 | Pipelined | 20 Bit | 18 Mbit | Industrial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662TT06BGD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 450 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 450 MHz | -40 to 100 °C | Bulk | 100 °C | -40 °C | 1.8 V | 72 Mbit | 1 | 705 mA | Pipelined | 8 M x 8 | 22 Bit | 72 Mbit | Industrial | 无 |
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