品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8342QT10BGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Industrial grade | 333 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Bulk | GS8342QT10BGD | SigmaQuad-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 895 mA | Pipelined | 4 M x 9 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662TT11BD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Commercial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 0 to 85 °C | Bulk | GS8662TT11BD | SigmaQuad-II+ | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 695 mA | Pipelined | 8 M x 9 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662Q36BGD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | Compliant | 300 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 有 | GS8662Q36BGD-300 | 300 MHz | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.17 | BGA | Commercial grade | 300 MHz | FBGA | QDR | 1.8000 V | Synchronous | 2 MWords | 36 Bit | 表面贴装 | 0 to 85 °C | GS8662Q36BGD | e1 | 有 | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | 流水线结构 | 8542.32.00.41 | SRAMs | CMOS | 1.8 V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 72 Mbit | 2 | SYNCHRONOUS | 1.06 A | Pipelined | 2 M x 36 | 3-STATE | 1.4 mm | 36 | 20 Bit | 72 Mbit | 75497472 bit | Commercial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | 15 mm | 13 mm | 无 | ||||||||||||||||
![]() | GS8320E36AGT-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 100 | 200 MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | Non-Compliant | Commercial grade | 0 to 70 °C | 4 | Flow-Through/Pipelined | 20 Bit | 36 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182R08BGD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 85 °C | -40 °C | 1.8 V | 1 | 19 b | 18 Mb | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662Q08BGD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 250 MHz | FBGA | 1.8000 V | 1.7 V | 8 MWords | 8 Bit | 1.9 V | Compliant | 有 | 250 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | -40 to 100 °C | Tray | GS8662Q08BGD | SigmaQuad-II | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 730 mA | 0.45 | 8 M x 8 | 22 b | SRAM | 72 Mb | 72 | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662Q08BGD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | Commercial grade | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 15 | 0 to 85 °C | Tray | GS8662Q08BGD | SigmaQuad-II | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 850 mA | Pipelined | 8 M x 8 | 22 Bit | SRAM | 72 Mb | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D11BD-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Commercial grade | 500 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 表面贴装 | 1.9 V | 9 Bit | 8 MWords | Compliant | 有 | 500 MHz | + 70 C | 1.9 V | 0 C | 15 | 0 to 85 °C | Bulk | GS8662D11BD | SigmaQuad-II+ | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 890 mA | Pipelined | 8 M x 9 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832272GC-225I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 72 Bit | 2.7, 3.6 V | Compliant | 有 | 225 MHz | + 85 C | 3.6 V | - 40 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | -40 to 85 °C | Tray | GS832272GC | SCD/DCD Pipeline/Flow Through | 85 °C | -40 °C | Memory & Data Storage | 36 Mbit | 8 | 265 mA, 370 mA | 7@Flow-Through/2.7@P | 512 k x 72 | 19 b | SRAM | 36 Mb | 36 | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662Q36BGD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 200 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 有 | GS8662Q36BGD-200 | 200 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.34 | BGA | Commercial grade | 200 MHz | 0 to 85 °C | Tray | GS8662Q36BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad-II | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 72 Mbit | 2 | SYNCHRONOUS | 740 mA | Pipelined | 2 M x 36 | 3-STATE | 1.4 mm | 36 | 20 Bit | SRAM | 72 Mbit | 75497472 bit | Commercial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||
![]() | GS832136AD-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Commercial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 250 MHz | + 70 C | 2.7 V | 0 C | 18 | 0 to 85 °C | Bulk | GS832136AD | 同步突发 | 85 °C | 0 °C | Memory & Data Storage | 36 Mbit | 4 | 240 mA, 295 mA | 5.5 ns | Flow-Through/Pipelined | 1 M x 36 | 20 Bit | SRAM | 36 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662Q37BGD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 200 MHz | FBGA | 1.8000 V | 1.7 V | Synchronous | 36 Bit | 1.9 V | Compliant | 有 | 200 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | -40 to 100 °C | Tray | GS8662Q37BGD | SigmaQuad-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 750 mA | 0.45 | 2 M x 36 | 20 b | SRAM | 72 Mb | 72 | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8644Z36GE-150I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Industrial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 150 MHz | + 85 C | 3.6 V | - 40 C | 15 | -40 to 85 °C | Tray | GS8644Z36GE | NBT | 85 °C | -40 °C | Memory & Data Storage | 72 Mbit | 4 | 270 mA, 330 mA | 8.5 ns | Flow-Through/Pipelined | 2 M x 36 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T09BGD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 400 MHz | + 70 C | Parallel | SMD/SMT | 1.7 V | 0 C | 1.9 V | Commercial grade | 400 MHz | 0 to 85 °C | Bulk | 85 °C | 0 °C | 1.8 V | 72 Mbit | 1 | 625 mA | Pipelined | 8 M x 9 | 22 Bit | 72 Mbit | Commercial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832236AGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 250@Flow-Through/400@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 400 MHz | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | SMD/SMT | Parallel | SDR | SyncBurst | GSI技术 | GSI技术 | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 4 ns | 85 °C | 有 | GS832236AGD-400I | 400 MHz | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.12 | BGA | Industrial grade | -40 to 100 °C | Bulk | GS832236AGD | e1 | 有 | 3A991.B.2.B | Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 36 Mbit | 4 | SYNCHRONOUS | 305 mA, 415 mA | 4 ns | Flow-Through/Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 20 Bit | SRAM | 36 Mbit | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | 无 | |||
![]() | GS816273CGC-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Commercial grade | 250 MHz | FBGA | SDR | 表面贴装 | 2.7, 3.6 V | 72 Bit | 256 kWords | Synchronous | 2.3, 3 V | 2.5, 3.3 V | Compliant | 有 | 250 MHz | + 70 C | 3.6 V | 0 C | 21 | 0 to 70 °C | Tray | GS816273CGC | Pipeline | 70 °C | 0 °C | Memory & Data Storage | 18 Mbit | 8 | 350 mA | 5.5 ns | Pipelined | 256 k x 72 | 18 Bit | SRAM | 18 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D09BGD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaQuad-II | DDR | 1.9 V | 9 Bit | 8 MWords | Synchronous | 1.7 V | 1.8000 V | FBGA | 400 MHz | Compliant | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | 0 to 85 °C | Bulk | GS8662D09BGD | SigmaQuad-II | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 735 mA | 0.45 | 8 M x 9 | 21 b | SRAM | 72 Mb | 72 | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302Q37E-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | Industrial grade | 200 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 200 MHz | + 85 C | 1.9 V | - 40 C | 10 | -40 to 100 °C | Bulk | GS81302Q37E | SigmaQuad-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 940 mA | Pipelined | 4 M x 36 | 21 Bit | SRAM | 144 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T20BD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 0 to 85 °C | Bulk | GS8662T20BD | SigmaQuad-II+ | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 625 mA | Pipelined | 4 M x 18 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342QT07BD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | + 85 C | 300 MHz | 有 | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8342QT07BD-300I | 300 MHz | 4194304 words | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.22 | BGA | Compliant | DDR | SigmaQuad-II+ | GSI技术 | GSI技术 | Parallel | SMD/SMT | 1.7 V | 15 | - 40 C | 1.9 V | Bulk | GS8342QT07BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II+ B2 | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 785 mA | 4 M x 8 | 3-STATE | 1.4 mm | 8 | 21 b | SRAM | 36 Mb | 36 | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||||||||
![]() | GS8162Z18DGB-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-119 | YES | 119 | 119 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 400 MHz | + 85 C | 3.6 V | - 40 C | 21 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | BGA, | 网格排列 | 1000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 4 ns | 85 °C | 有 | GS8162Z18DGB-400I | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.27 | BGA | Industrial grade | 250@Flow-Through/400@Pipelined MHz | FBGA | SDR | -40 to 100 °C | Bulk | GS8162Z18DGB | 3A991.B.2.B | NBT Pipeline/Flow Through | 100 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | INDUSTRIAL | 18 Mbit | 2 | SYNCHRONOUS | 275 mA, 355 mA | 4 ns | Flow-Through/Pipelined | 1 M x 18 | 1.99 mm | 18 | 20 Bit | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | 无 | ||||||||||||||
![]() | GS8322Z72C-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Industrial grade | 133.3@Flow-Through/200@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 200 MHz | + 85 C | 3.6 V | - 40 C | 14 | -40 to 85 °C | Tray | GS8322Z72C | NBT Pipeline/Flow Through | 85 °C | -40 °C | Memory & Data Storage | 36 Mbit | 8 | 245 mA, 340 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 72 | 19 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8644Z36E-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 250 MHz | + 70 C | 2.7 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | 未说明 | 6.5 ns | 70 °C | 有 | GS8644Z36E-250V | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.29 | BGA | Commercial grade | 153.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 0 to 70 °C | Tray | GS8644Z36E | e1 | 有 | 3A991.B.2.B | NBT | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | PIPELINED OR FLOW-THROUGH ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 72 Mbit | 4 | SYNCHRONOUS | 270 mA, 400 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 36 | 1.5 mm | 36 | 21 Bit | SRAM | 72 Mbit | 75497472 bit | Commercial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 17 mm | 15 mm | 无 | |||||||||||
![]() | GS8662TT11BGD-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Commercial grade | 500 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 500 MHz | + 70 C | 1.9 V | 0 C | 15 | 0 to 85 °C | Bulk | GS8662TT11BGD | SigmaQuad-II+ | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 760 mA | Pipelined | 8 M x 9 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302T20E-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR-II | Industrial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 10 | -40 to 100 °C | Bulk | GS81302T20E | SigmaDDR-II+ | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 1 | 810 mA | Pipelined | 8 M x 18 | 22 Bit | SRAM | 144 Mbit | Industrial | SRAM | 无 |
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