品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8662T37BD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 表面贴装 | 1.9 V | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662T37BD | SigmaDDR-II+ B2 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 800 mA | Pipelined | 2 M x 36 | 20 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS882Z18CGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Compliant | 333 MHz | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | Commercial grade | 222.2@Flow-Through/333@Pipelined MHz | FBGA | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 18 Bit | 2.7, 3.6 V | 0 to 70 °C | 70 °C | 0 °C | 9 Mbit | 2 | 165 mA, 220 mA | 4.5@Flow-Through/2.5 | 512 k x 18 | 18 b | 9 Mb | 9 | Commercial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT10GE-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | Commercial grade | 400 MHz | 表面贴装 | 1.9 V | 9 Bit | 16 MWords | Synchronous | 1.7 V | 1.8000 V | DDR | FBGA | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302TT10GE | SigmaDDR-II+ B2 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 1 | 895 mA | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302T09E-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | DDR-II | Compliant | Industrial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | -40 to 100 °C | Tray | GS81302T09E | SigmaDDR-II B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 810 mA | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T18BGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 70 °C | 0 °C | 1.8 V | 1 | 20 b | 18 Mb | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D37BD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Compliant | LBGA, | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8662D37BD-333I | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.45 | BGA | Industrial grade | 333 MHz | FBGA | QDR | -40 to 100 °C | Tray | GS8662D37BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II+ B4 | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | 管道结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 72 Mbit | 2 | SYNCHRONOUS | 820 mA | Pipelined | 2 M x 36 | 1.4 mm | 36 | 19 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||||||||
![]() | GS8342T07BD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | YES | 165 | 165 | 0.45 ns | 70 °C | 无 | GS8342T07BD-450 | 450 MHz | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.22 | BGA | Commercial grade | 450 MHz | FBGA | DDR | 1.8000 V | Synchronous | 4 MWords | 8 Bit | 表面贴装 | Compliant | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0 to 85 °C | Bulk | e0 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 85 °C | 0 °C | 流水线结构 | 8542.32.00.41 | SRAMs | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 1 | SYNCHRONOUS | 0.67 mA | Pipelined | 4MX8 | 3-STATE | 1.4 mm | 8 | 21 Bit | 36 Mbit | 0.23 A | 33554432 bit | Commercial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | 15 mm | 13 mm | 无 | ||||||||||||||||||||||||||
![]() | GS8342D20BD-450M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | Bulk | 1.8 V | 21 b | 36 Mb | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT10E-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | QDR-II | Commercial grade | 333 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302DT10E | SigmaQuad-II+ B4 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 890 mA | Pipelined | 16 M x 9 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS882Z36CB-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | 1.7, 2.3 V | Synchronous | 256 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 70 C | 2.7 V | 0 C | 42 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | BGA, | 网格排列 | 256000 | PLASTIC/EPOXY | 未说明 | 6.5 ns | 70 °C | 无 | GS882Z36CB-200V | 1.8 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.14 | BGA | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 0 to 70 °C | Tray | GS882Z36CB | e0 | 无 | 3A991.B.2.B | NBT | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | COMMERCIAL | 9 Mbit | 4 | SYNCHRONOUS | 125 mA, 150 mA | 6.5 ns | Flow-Through/Pipelined | 256 k x 36 | 1.77 mm | 36 | 18 Bit | SRAM | 9 Mbit | 9437184 bit | Commercial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 22 mm | 14 mm | 无 | ||||||||||||
![]() | GS8182T19BD-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 70 °C | 0 °C | 1.8 V | 1 | 19 b | 18 Mb | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8642Z18B-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 4 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 300 MHz | + 70 C | 3.6 V | 0 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | BGA, BGA119,7X17,50 | 网格排列 | 3 | 4000000 | PLASTIC/EPOXY | BGA119,7X17,50 | 未说明 | 5.5 ns | 70 °C | 无 | GS8642Z18B-300 | 300 MHz | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.17 | BGA | Commercial grade | 181.8@Flow-Through/300@Pipelined MHz | 0 to 70 °C | Tray | GS8642Z18B | e0 | 无 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | 2.5/3.3 V | COMMERCIAL | 72 Mbit | 2 | SYNCHRONOUS | 270 mA, 370 mA | 5.5 ns | Flow-Through/Pipelined | 4 M x 18 | 3-STATE | 1.99 mm | 18 | 22 Bit | SRAM | 72 Mbit | 0.1 A | 75497472 bit | Commercial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | 无 | ||||
![]() | GS8662T11BD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | 无 | BGA | 5.5 | GSI TECHNOLOGY | 活跃 | RECTANGULAR | LBGA | 1.8 V | GS8662T11BD-400 | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 0 to 85 °C | Tray | GS8662T11BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II+ | Tin/Lead (Sn/Pb) | 85 °C | 0 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 72 Mbit | 1 | SYNCHRONOUS | 625 mA | Pipelined | 8 M x 9 | 1.4 mm | 9 | 22 Bit | SRAM | 72 Mbit | 75497472 bit | Commercial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||
![]() | GS81302DT19E-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | QDR-II | Commercial grade | 400 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302DT19E | SigmaQuad-II+ B4 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 1.055 A | Pipelined | 8 M x 18 | 21 Bit | SRAM | 144 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662TT38BGD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | Industrial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8662TT38BGD | SigmaQuad-II+ | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 765 mA | Pipelined | 2 M x 36 | 20 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182R08BD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 70 °C | 0 °C | 1.8 V | 1 | 19 b | 18 Mb | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881Z18CGT-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | 2.7, 3.6 V | 表面贴装 | Compliant | 333 MHz | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | LQFP, | FLATPACK, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | 未说明 | 4.5 ns | 70 °C | 有 | 5.51 | QFP | GS881Z18CGT-333 | 2.5 V | LQFP | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | Commercial grade | 222.2@Flow-Through/333@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 18 Bit | 0 to 70 °C | GS881Z18CGT | e3 | 有 | 3A991.B.2.B | Matte Tin (Sn) | 70 °C | 0 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | COMMERCIAL | 9 Mbit | 1 | SYNCHRONOUS | 165 mA, 220 mA | 4.5 ns | Flow-Through/Pipelined | 512 k x 18 | 1.6 mm | 18 | 18 Bit | 9 Mbit | 9437184 bit | Commercial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | 20 mm | 14 mm | 无 | |||||||||||||||||||||
![]() | GS8182D09BD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.7 V | Synchronous | 2 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | Compliant | LBGA, | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | 无 | GS8182D09BD-400 | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.33 | BGA | Commercial grade | 400 MHz | FBGA | QDR | 1.8000 V | 0 to 70 °C | Tray | GS8182D09BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 18 Mbit | 2 | SYNCHRONOUS | 720 mA | Pipelined | 2 M x 9 | 1.4 mm | 9 | 19 Bit | SRAM | 18 Mbit | 18874368 bit | Commercial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||
![]() | GS81302Q18E-300M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaQuad-II | QDR-II | Compliant | Military grade | 表面贴装 | 18 Bit | 8 MWords | Synchronous | 1.8000 V | QDR | BGA | 300 MHz | 有 | 300 MHz | + 125 C | 1.9 V | - 55 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | Tray | GS81302Q18E | SigmaQuad-II | Memory & Data Storage | 1.8 V | 144 Mbit | Pipelined | 8 M x 18 | 23 Bit | SRAM | 144 Mbit | Military | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816218DB-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | GSI技术 | GSI技术 | SyncBurst | SDR | Compliant | Industrial grade | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | 21 | 1.7 V | SMD/SMT | Parallel | -40 to 100 °C | Tray | GS816218DB | Pipeline/Flow Through | 100 °C | -40 °C | Memory & Data Storage | 18 Mbit | 2 | 225 mA, 245 mA | 5.5 ns | Flow-Through/Pipelined | 1 M x 18 | 20 b | SRAM | 18 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D20BD-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 18 Bit | 1.9 V | 表面贴装 | Compliant | 500 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 0.45 ns | 85 °C | 无 | GS8342D20BD-500I | 500 MHz | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.35 | BGA | Industrial grade | 500 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | -40 to 100 °C | Bulk | GS8342D20BD | 3A991.B.2.B | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | SRAMs | CMOS | 1.8 V | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 865 mA | Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 19 Bit | 36 Mbit | 0.26 A | 75497472 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | 15 mm | 13 mm | 无 | |||||||||||||||||
![]() | GS8662D11BD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 350 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 350 MHz | -40 to 100 °C | Bulk | GS8662D11BD | 100 °C | -40 °C | 1.8 V | 72 Mbit | 2 | 705 mA | Pipelined | 8 M x 9 | 21 Bit | 72 Mbit | Industrial | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342TT11BGD-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 4 MWords | 9 Bit | 表面贴装 | Compliant | 500 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 500 MHz | FBGA | DDR | 1.8000 V | Synchronous | -40 to 100 °C | Bulk | 100 °C | -40 °C | 1.8 V | 36 Mbit | 1 | 740 mA | Pipelined | 4 M x 9 | 21 Bit | 36 Mbit | Industrial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D38BD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Compliant | Industrial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8662D38BD | SigmaQuad-II+ | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 1.065 A | Pipelined | 2 M x 36 | 19 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88236CB-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 85 C | 3.6 V | - 40 C | 42 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Compliant | BGA, | 网格排列 | 256000 | PLASTIC/EPOXY | -40 °C | 未说明 | 4.5 ns | 85 °C | 无 | GS88236CB-333I | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.13 | BGA | Industrial grade | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | -40 to 85 °C | Tray | GS88236CB | e0 | 无 | 3A991.B.2.B | Pipeline/Flow Through | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | INDUSTRIAL | 9 Mbit | 4 | SYNCHRONOUS | 200 mA, 260 mA | 4.5 ns | Flow-Through/Pipelined | 256 k x 36 | 1.77 mm | 36 | 18 b | SRAM | 9 Mbit | 9437184 bit | Industrial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | 无 |
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