品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8160E36DGT-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | TQFP-100 | YES | 100 | 100 | 2.3, 3 V | Synchronous | 512 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 400 MHz | + 85 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 512000 | PLASTIC/EPOXY | 未说明 | 4 ns | 70 °C | 有 | GS8160E36DGT-400 | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.38 | QFP | Commercial grade | 250@Flow-Through/400@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 0 to 85 °C | Tray | GS8160E36DGT | 3A991.B.2.B | Pipeline/Flow Through | FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | COMMERCIAL | 18 Mbit | 4 | SYNCHRONOUS | 280 mA, 365 mA | 4 ns | Flow-Through/Pipelined | 512 k x 36 | 1.6 mm | 36 | 19 Bit | SRAM | 18 Mbit | 18874368 bit | Commercial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | |||||||||||||||
![]() | GS8662T19BD-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaDDR-II+ | N | DDR | Commercial grade | 350 MHz | FBGA | DDR | 1.8000 V | Synchronous | 4 MWords | 18 Bit | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | 0 to 85 °C | Tray | GS8662T19BD | SigmaDDR-II+ B2 | Memory & Data Storage | 72 Mbit | 1 | 590 mA | Pipelined | 4 M x 18 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T18BD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 300 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 300 MHz | FBGA | DDR | -40 to 100 °C | GS8662T18BD | 72 Mbit | 1 | 505 mA | Pipelined | 4 M x 18 | 22 Bit | 72 Mbit | Industrial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT19GE-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | Commercial grade | 333 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302TT19GE | SigmaDDR-II+ B2 | Memory & Data Storage | 144 Mbit | 1 | 755 mA | Pipelined | 8 M x 18 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z18AGD-333IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 表面贴装 | 333 MHz | + 85 C | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 5 ns | 85 °C | 有 | GS8322Z18AGD-333IV | 333 MHz | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.09 | BGA | Industrial grade | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | -40 to 100 °C | 3A991.B.2.B | ALSO OPERATED WITH 2.5V SUPPLY; PIPELINE/FLOW THROUGH ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.8/2.5 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 265 mA, 350 mA | 5 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 36 Mbit | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | ZBT SRAM | 1.7 V | 2 V | 1.7 V | 15 mm | 13 mm | |||||||||||||||||||
![]() | GS81302TT11GE-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | Commercial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302TT11GE | SigmaDDR-II+ | Memory & Data Storage | 144 Mbit | 1 | 800 mA | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321E32AD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 250@Flow-Through/400@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 32 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 400 MHz | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | SMD/SMT | -40 to 100 °C | Tray | GS8321E32AD | DCD Pipeline/Flow Through | Memory & Data Storage | 36 Mbit | 4 | 305 mA, 415 mA | 4 ns | Flow-Through/Pipelined | 1 M x 32 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS74117AGX-10E | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-48 | 48 | 表面贴装 | 3.6 V | 135 | 3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | Details | FBGA | 3.3000 V | 3 V | Asynchronous | 256 kWords | 16 Bit | 3.6 V | -40 to 125 °C | GS74117AGX | Asynchronous | Memory & Data Storage | 4 Mbit | 1 | 105 mA | 10 ns | 256 k x 16 | 18 Bit | SRAM | 4 Mbit | 扩展工业 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342TT11BD-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8342TT11BD-500I | 500 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | BGA | Industrial grade | 500 MHz | FBGA | -40 to 100 °C | Tray | GS8342TT11BD | e0 | 3A991.B.2.B | SigmaQuad-II+ | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 1 | SYNCHRONOUS | 740 mA | Pipelined | 4 M x 9 | 3-STATE | 1.4 mm | 9 | 21 Bit | SRAM | 36 Mbit | 37748736 bit | Industrial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||
![]() | GS8342S09BD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR | Industrial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS8342S09BD | SigmaSIO DDR-II | Memory & Data Storage | 36 Mbit | 2 | 715 mA | Pipelined | 4 M x 9 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816136DD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 222.2@Flow-Through/333@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | -40 to 85 °C | Tray | GS816136DD | Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 4 | 280 mA, 335 mA | 4.5 ns | Flow-Through/Pipelined | 512 k x 36 | 19 Bit | SRAM | 18 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302S36E-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR-II | Industrial grade | 300 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS81302S36E | SigmaSIO DDR-II | Memory & Data Storage | 144 Mbit | 2 | 925 mA | Pipelined | 4 M x 36 | 21 Bit | SRAM | 144 Mb | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88118CGT-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 85 C | 2.7 V | - 40 C | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, | FLATPACK | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 6.5 ns | 85 °C | 有 | GS88118CGT-200IV | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.28 | QFP | Industrial grade | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | -40 to 85 °C | Tray | GS88118CGT | 3A991.B.2.B | 同步突发 | ALSO OPERATES AT 2.5V | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | INDUSTRIAL | 9 Mbit | 1 | SYNCHRONOUS | 125 mA, 160 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 18 | 1.6 mm | 8 | SRAM | 9 Mbit | 4194304 bit | Industrial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 20 mm | 14 mm | |||||||||||||||
![]() | GS8662T06BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | DDR | Industrial grade | 400 MHz | FBGA | 1.8000 V | 1.7 V | 8 MWords | 8 Bit | 1.9 V | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | -40 to 100 °C | Tray | GS8662T06BGD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 635 mA | 0.45 | 8 M x 8 | SRAM | 72 | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS882Z36CD-300M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Military grade | 200@Flow-Through/300@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 300 MHz | + 125 C | 3.6 V | - 55 C | 36 | 2.3 V | SMD/SMT | -55 to 125 °C | Tray | GS882Z36CD | NBT Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 4 | 220 mA, 280 mA | 5 ns | Flow-Through/Pipelined | 256 k x 36 | 18 Bit | SRAM | 9 Mbit | Military | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881Z18CGD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 300 MHz | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | Industrial grade | 200@Flow-Through/300@Pipelined MHz | FBGA | SDR | -40 to 85 °C | GS881Z18CGD | 9 Mbit | 1 | 170 mA, 225 mA | 5 ns | Flow-Through/Pipelined | 512 k x 18 | 18 Bit | 9 Mbit | Industrial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302R09E-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | DDR-II | Industrial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS81302R09E | SigmaDDR-II B4 | Memory & Data Storage | 144 Mbit | 2 | 810 mA | Pipelined | 16 M x 9 | 22 Bit | SRAM | 144 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342DT37BD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8342DT37BD-450I | 450 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.21 | BGA | Industrial grade | 450 MHz | FBGA | -40 to 100 °C | Tray | GS8342DT37BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II+ B4 | Tin/Lead (Sn/Pb) | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 1.025 A | Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 18 Bit | SRAM | 36 Mbit | 37748736 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||
![]() | GS8342DT37BD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Industrial grade | 400 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS8342DT37BD | SigmaQuad-II+ B4 | Memory & Data Storage | 36 Mbit | 2 | 915 mA | Pipelined | 1 M x 36 | 18 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT20GE-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaDDR-II+ | Details | DDR-II | Commercial grade | 350 MHz | FBGA | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | 0 to 85 °C | Tray | GS81302TT20GE | SigmaDDR-II+ | Memory & Data Storage | 144 Mbit | 800 mA | 0.45 | 8 M x 18 | SRAM | 144 | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88032CGT-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 32 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | QFP100,.63X.87 | 未说明 | 4.5 ns | 70 °C | 有 | GS88032CGT-333 | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.61 | QFP | Commercial grade | 222.2@Flow-Through/333@Pipelined MHz | TQFP | 0 to 70 °C | Tray | GS88032CGT | e3 | 有 | 3A991.B.2.B | Pipeline/Flow Through | 纯哑光锡 | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 2.5/3.3 V | COMMERCIAL | 9 Mbit | 4 | SYNCHRONOUS | 180 mA, 240 mA | 4.5 ns | Flow-Through/Pipelined | 256 k x 32 | 3-STATE | 1.6 mm | 32 | 18 Bit | SRAM | 9 Mbit | 0.025 A | 8388608 bit | Commercial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | ||||
![]() | GS8662D10BD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | 350 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 350 MHz | FBGA | QDR | -40 to 100 °C | 72 Mbit | 2 | 705 mA | Pipelined | 8 M x 9 | 21 Bit | 72 Mbit | Industrial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS864436E-166I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 表面贴装 | 2.7, 3.6 V | 36 Bit | 2 MWords | Synchronous | 2.3, 3 V | 2.5, 3.3 V | SDR | FBGA | 142.8@Flow-Through/166@Pipelined MHz | 有 | 166 MHz | + 85 C | 3.6 V | - 40 C | 15 | 2.3 V | SMD/SMT | -40 to 85 °C | Tray | GS864436E | 同步突发 | Memory & Data Storage | 72 Mbit | 4 | 285 mA, 345 mA | 8 ns | Flow-Through/Pipelined | 2 M x 36 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816218DD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | SyncBurst | SDR | Industrial grade | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | -40 to 100 °C | Tray | GS816218DD | Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 2 | 260 mA, 305 mA | 4.5 ns | Flow-Through/Pipelined | 1 M x 18 | SRAM | 18 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D11BGD-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Industrial grade | 500 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8342D11BGD | SigmaQuad-II+ | Memory & Data Storage | 36 Mbit | 2 | 865 mA | Pipelined | 4 M x 9 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM |
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