品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 组织的记忆 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8182T08BD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 8 Bit | 表面贴装 | 1.9 V | Industrial grade | -40 to 85 °C | 1 | Pipelined | 20 Bit | 18 Mbit | Industrial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881E36CD-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 256 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 70 C | 2.7 V | 0 C | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 256000 | PLASTIC/EPOXY | 未说明 | 6.5 ns | 70 °C | 无 | GS881E36CD-200V | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.15 | BGA | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 0 to 70 °C | Tray | GS881E36CD | e0 | 无 | 3A991.B.2.B | DCD Pipeline/Flow Through | 锡铅 | PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 2.3 V TO 2.7 V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 9 Mbit | 4 | SYNCHRONOUS | 125 mA, 150 mA | 6.5 ns | Flow-Through/Pipelined | 256 k x 36 | 1.4 mm | 36 | 18 Bit | SRAM | 9 Mbit | 9437184 bit | Commercial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||||||||||||||||||||
![]() | GS882Z36CGD-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Commercial grade | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 70 C | 2.7 V | 0 C | 66 | 1.7 V | SMD/SMT | Parallel | 0 to 70 °C | Tray | GS882Z36CGD | NBT | Memory & Data Storage | 9 Mbit | 4 | 110 mA, 125 mA | 7.5 ns | Flow-Through/Pipelined | 256 k x 36 | SRAM | 9 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D38BD-550 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | DDR | Commercial grade | 550 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 550 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8342D38BD | SigmaQuad-II+ | Memory & Data Storage | 36 Mbit | 2 | 1.225 A | Pipelined | 1 M x 36 | 18 Bit | SRAM | 36 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS864236GB-167 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | BGA, | 网格排列 | 3 | 2000000 | PLASTIC/EPOXY | 未说明 | 8 ns | 70 °C | 有 | GS864236GB-167 | 2.5 V | BGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.18 | BGA | 167 MHz | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | Commercial grade | 125@Flow-Through/167@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 0 to 70 °C | GS864236GB | e1 | 有 | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | CMOS | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | COMMERCIAL | 72 Mbit | 4 | SYNCHRONOUS | 220 mA, 270 mA | 8 ns | Flow-Through/Pipelined | 2MX36 | 1.99 mm | 36 | 21 Bit | 72 Mbit | 75497472 bit | Commercial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||||
![]() | GS8161Z18DD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | NBT SRAM | SDR | Industrial grade | FBGA | SDR | 表面贴装 | 2.7, 3.6 V | 18 Bit | 1 MWords | Synchronous | 2.3, 3 V | 2.5, 3.3 V | 有 | 400 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | -40 to 85 °C | Tray | GS8161Z18DD | NBT | Memory & Data Storage | 18 Mbit | 2 | 275 mA, 355 mA | 4 ns | Flow-Through/Pipelined | 1 M x 18 | SRAM | 18 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881Z36CGD-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 85 C | 2.7 V | - 40 C | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | -40 °C | 未说明 | 6.5 ns | 85 °C | 有 | GS881Z36CGD-200IV | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.14 | BGA | Industrial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | -40 to 85 °C | Tray | GS881Z36CGD | e1 | 有 | 3A991.B.2.B | NBT | Tin/Silver/Copper (Sn/Ag/Cu) | IT ALSO OPERATE WITH 2.5 V, FLOW THROUGH AND PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 9 Mbit | 1 | SYNCHRONOUS | 145 mA, 170 mA | 6.5 ns | Flow-Through/Pipelined | 256 k x 36 | 1.4 mm | 36 | 18 Bit | SRAM | 9 Mbit | 9437184 bit | Industrial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||||||||||||||||||
![]() | GS832236AGD-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | -40 to 100 °C | Tray | GS832236AGD | Pipeline/Flow Through | Memory & Data Storage | 36 Mbit | 4 | 260 mA, 315 mA | 5.5 ns | Flow-Through/Pipelined | 1 M x 36 | SRAM | 36 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT38GE-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 350 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 350 MHz | 0 to 85 °C | 144 Mbit | 1 | 895 mA | Pipelined | 4 M x 36 | 21 Bit | 144 Mbit | Commercial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8160E36DGT-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 表面贴装 | 2.7, 3.6 V | 36 Bit | 512 kWords | Synchronous | 2.3, 3 V | 2.5, 3.3 V | SDR | TQFP | 222.2@Flow-Through/333@Pipelined MHz | 有 | 333 MHz | + 85 C | 3.6 V | 0 C | 36 | 2.3 V | 0 to 85 °C | Tray | GS8160E36DGT | Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 4 | 260 mA, 315 mA | 4.5 ns | Flow-Through/Pipelined | 512 k x 36 | 20 Bit | SRAM | 18 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302S36GE-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaSIO DDR-II | Details | DDR-II | Commercial grade | 300 MHz | FBGA | DDR | 1.8000 V | Synchronous | 4 MWords | 36 Bit | 表面贴装 | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | 0 to 85 °C | Tray | GS81302S36GE | SigmaSIO DDR-II | Memory & Data Storage | 144 Mbit | 2 | 915 mA | Pipelined | 4 M x 36 | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8320E32AGT-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 238@Flow-Through/375.9@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 32 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 375 MHz | + 70 C | 3.6 V | 0 C | 18 | 2.3 V | 0 to 85 °C | Tray | GS8320E32AGT | Pipeline/Flow Through | Memory & Data Storage | 36 Mbit | 4 | 270 mA, 380 mA | 4.2 ns | Flow-Through/Pipelined | 1 M x 32 | 20 Bit | SRAM | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT19GE-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Details | DDR-II | 400 MHz | FBGA | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | 0 to 85 °C | Tray | GS81302TT19GE | SigmaDDR-II+ B2 | Memory & Data Storage | 144 Mbit | 895 mA | 0.45 | 8 M x 18 | SRAM | 144 | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT37GE-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | 165 | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 4000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS81302TT37GE-350I | 1.8 V | LBGA | RECTANGULAR | 不推荐 | GSI TECHNOLOGY | 5.06 | BGA | Industrial grade | 350 MHz | FBGA | DDR | -40 to 100 °C | Tray | GS81302TT37GE | e1 | 有 | 3A991.B.2.B | SigmaDDR-II+ B2 | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED ARCHITECTURE, LATE WRITE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 144 Mbit | 1 | SYNCHRONOUS | 905 mA | Pipelined | 4 M x 36 | 1.5 mm | 36 | 21 Bit | SRAM | 144 Mbit | 150994944 bit | Industrial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 17 mm | 15 mm | |||||||||||||||||||||||||
![]() | GS8342TT37BD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR | Commercial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8342TT37BD | SigmaDDR-II+ B2 | Memory & Data Storage | 36 Mbit | 1 | 860 mA | Pipelined | 1 M x 36 | 19 Bit | SRAM | 36 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662R18BD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | N | DDR | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662R18BD | SigmaDDR-II B4 | Memory & Data Storage | 72 Mbit | 1 | 625 mA | Pipelined | 4 M x 18 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z72GC-166IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | 125@Flow-Through/166@Pipelined MHz | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 72 Bit | 2, 2.7 V | 有 | 166 MHz | + 85 C | 2.7 V | - 40 C | 14 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Industrial grade | -40 to 85 °C | Tray | GS8322Z72GC | NBT | Memory & Data Storage | 36 Mbit | 235 mA, 300 mA | 8@Flow-Through/3.5@P | 512 k x 72 | 19 Bit | SRAM | 36 | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8644Z36GE-225I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 2.7, 3.6 V | 有 | 225 MHz | + 85 C | 3.6 V | - 40 C | 15 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | BGA, BGA165,11X15,40 | 网格排列 | 3 | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 6.5 ns | 85 °C | 有 | GS8644Z36GE-225I | 225 MHz | 2097152 words | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.15 | BGA | 153.8@Flow-Through/225@Pipelined MHz | FBGA | 2.5, 3.3 V | 2.3, 3 V | 36 Bit | -40 to 85 °C | Tray | GS8644Z36GE | e1 | 有 | 3A991.B.2.B | NBT | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 3.3V SUPPLY; PIPELINED OR FLOW-THROUGH ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 72 Mbit | SYNCHRONOUS | 295 mA, 405 mA | 6.5@Flow-Through/2.7 | 2 M x 36 | 3-STATE | 1.5 mm | 36 | SRAM | 0.16 A | 72 | PARALLEL | COMMON | ZBT SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 17 mm | 15 mm | ||||||||||||||||||||||||||
![]() | GS8662DT10BGD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Commercial grade | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662DT10BGD | SigmaQuad-II+ B4 | Memory & Data Storage | 72 Mbit | 2 | 580 mA | Pipelined | 8 M x 9 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT38GE-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 450 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 450 MHz | 0 to 85 °C | 144 Mbit | 1 | 1.19 A | Pipelined | 4 M x 36 | 21 Bit | 144 Mbit | Commercial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8644Z36E-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 153.8@Flow-Through/200@Pipelined MHz | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 36 Bit | 2.7, 3.6 V | 有 | 200 MHz | + 70 C | 3.6 V | 0 C | 15 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | Commercial grade | 0 to 70 °C | Tray | GS8644Z36E | NBT | Memory & Data Storage | 72 Mbit | 270 mA, 345 mA | 6.5@Flow-Through/3@P | 2 M x 36 | SRAM | 72 | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662DT38BGD-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Commercial grade | 500 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662DT38BGD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 2 | 1.16 A | Pipelined | 2 M x 36 | 19 Bit | SRAM | 72 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662TT38BGD-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | BGA-165 | YES | 165 | 165-FPBGA (15x13) | 165 | 500 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | + 85 C | 1.9 V | - 40 C | GSI Technology Inc. | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | 活跃 | GS8662TT | Tray | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8662TT38BGD-500I | 500 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.19 | BGA | Industrial grade | -40 to 100 °C | Tray | GS8662TT38BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad-II+ | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | SRAM - Quad Port, Synchronous | 1.7V ~ 1.9V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 72 Mbit | 1 | SYNCHRONOUS | 500 MHz | 995 mA | SRAM | Parallel | Pipelined | 2 M x 36 | 3-STATE | 1.4 mm | 36 | - | 20 Bit | SRAM | 72 Mbit | 0.285 A | 75497472 bit | Industrial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 2M x 36 | 15 mm | 13 mm | ||||||
![]() | GS8342D11BGD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 9 Bit | 1.9 V | 表面贴装 | Compliant | 450 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8342D11BGD-450I | 450 MHz | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.21 | BGA | Industrial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | -40 to 100 °C | Bulk | 3A991.B.2.B | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | SRAMs | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 795 mA | Pipelined | 4 M x 9 | 3-STATE | 1.4 mm | 9 | 20 Bit | 36 Mbit | 0.25 A | 37748736 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | 15 mm | 13 mm | 无 | |||||||||||||||||||||||||||
![]() | GS8662T10BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | Industrial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8662T10BGD | SigmaDDR-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 635 mA | Pipelined | 8 M x 9 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 |
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