品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8342D38BD-550I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Compliant | Industrial grade | 550 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 550 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8342D38BD | SigmaQuad-II+ | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 1.235 A | Pipelined | 1 M x 36 | 18 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T09BGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 70 °C | 0 °C | 1.8 V | 1 | 20 b | 18 Mb | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88037CGT-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 300 MHz | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | Industrial grade | 300 MHz | -40 to 85 °C | 85 °C | -40 °C | 9 Mbit | 1 | 245 mA | Pipelined | 256 k x 36 | 18 b | 9 Mbit | Industrial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182R18BD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 70 °C | 0 °C | 1.8 V | 1 | 20 b | 18 Mb | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88036CGT-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | 0 to 70 °C | Tray | GS88036CGT | Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 9 Mbit | 4 | 180 mA, 240 mA | 4.5 ns | Flow-Through/Pipelined | 256 k x 36 | 18 b | SRAM | 9 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T20BGD-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 4 MWords | 18 Bit | 表面贴装 | Compliant | 500 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 500 MHz | FBGA | DDR | 1.8000 V | Synchronous | 0 to 85 °C | GS8662T20BGD | 85 °C | 0 °C | 1.8 V | 72 Mbit | 1 | 760 mA | Pipelined | 4 M x 18 | 21 Bit | 72 Mbit | Commercial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS864418GE-133V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 117.6@Flow-Through/133@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 4 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 133 MHz | + 70 C | 2.7 V | 0 C | 15 | 1.7 V | 0 to 70 °C | Tray | GS864418GE | 同步突发 | 70 °C | 0 °C | Memory & Data Storage | 72 Mbit | 2 | 210 mA, 250 mA | 8.5 ns | Flow-Through/Pipelined | 4 M x 18 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D38BGD-550I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Industrial grade | 550 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 表面贴装 | 1.9 V | 36 Bit | 1 MWords | 有 | 550 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 85 °C | Tray | GS8342D38BGD | SigmaQuad-II+ | 85 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 1.235 A | Pipelined | 1 M x 36 | 18 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS864272C-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | GSI技术 | GSI技术 | SyncBurst | SDR | Compliant | Industrial grade | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 14 | 2.3 V | SMD/SMT | Parallel | -40 to 85 °C | Tray | GS864272C | SCD/DCD Pipeline/Flow Through | 85 °C | -40 °C | Memory & Data Storage | 72 Mbit | 8 | 340 mA, 480 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 72 | 20 b | SRAM | 72 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182R09BD-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaDDR-II | DDR | Compliant | Industrial grade | 375 MHz | FBGA | DDR | 1.8000 V | Synchronous | 2 MWords | 9 Bit | 表面贴装 | 有 | 375 MHz | + 85 C | 1.9 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | -40 to 85 °C | Tray | GS8182R09BD | SigmaDDR-II B4 | 85 °C | -40 °C | Memory & Data Storage | 1.8 V | 18 Mbit | 1 | 580 mA | Pipelined | 2 M x 9 | 19 Bit | SRAM | 18 Mb | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88218CD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | 181.5@Flow-Through/250@Pipelined MHz | FBGA | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 18 Bit | 2.7, 3.6 V | Compliant | 250 MHz | -40 to 85 °C | 85 °C | -40 °C | 9 Mbit | 2 | 165 mA, 200 mA | 5.5@Flow-Through/2.5 | 512 k x 18 | 19 Bit | 9 Mb | 9 | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321E32AD-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | Commercial grade | 133@Flow-Through/150@Pipelined MHz | 表面贴装 | 2, 2.7 V | 32 Bit | 1 MWords | Synchronous | 1.7, 2.3 V | 1.8, 2.5 V | SDR | FBGA | 有 | 150 MHz | + 70 C | 2.7 V | 0 C | 18 | 1.7 V | 0 to 85 °C | Tray | GS8321E32AD | 同步突发 | 85 °C | 0 °C | Memory & Data Storage | 36 Mbit | 4 | 200 mA, 210 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 32 | 20 Bit | SRAM | 36 Mb | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662DT11BD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 400 MHz | FBGA | 1.8000 V | 1.7 V | 8 MWords | 9 Bit | 1.9 V | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Compliant | -40 to 100 °C | Tray | GS8662DT11BD | SigmaQuad-II+ | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 745 mA | 0.45 | 8 M x 9 | 21 b | SRAM | 72 Mb | 72 | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832132AD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | GSI技术 | SyncBurst | SDR | Compliant | Industrial grade | 表面贴装 | 2.7, 3.6 V | 32 Bit | 1 MWords | Synchronous | 2.3, 3 V | 2.5, 3.3 V | SDR | FBGA | 有 | 400 MHz | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | SMD/SMT | Parallel | -40 to 100 °C | Tray | GS832132AD | Pipeline/Flow Through | 100 °C | -40 °C | Memory & Data Storage | 36 Mbit | 4 | 305 mA, 415 mA | 4 ns | Flow-Through/Pipelined | 1 M x 32 | 20 b | SRAM | 36 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8320E18AGT-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 表面贴装 | 2, 2.7 V | 18 Bit | 2 MWords | Synchronous | 1.7, 2.3 V | 1.8, 2.5 V | SDR | TQFP | 200@Flow-Through/333@Pipelined MHz | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 18 | 2.3 V | 0 to 85 °C | Tray | GS8320E18AGT | Pipeline/Flow Through | 85 °C | 0 °C | Memory & Data Storage | 36 Mbit | 2 | 235 mA, 320 mA | 4.5 ns | Flow-Through/Pipelined | 2 M x 18 | 21 Bit | SRAM | 36 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342DT11BD-550 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 550 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 85 °C | 无 | GS8342DT11BD-550 | 550 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.35 | BGA | Commercial grade | 550 MHz | FBGA | 0 to 85 °C | Tray | GS8342DT11BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II+ | Tin/Lead (Sn/Pb) | 85 °C | 0 °C | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | OTHER | 36 Mbit | 2 | SYNCHRONOUS | 940 mA | Pipelined | 4 M x 9 | 3-STATE | 1.4 mm | 9 | 20 Bit | SRAM | 36 Mbit | 37748736 bit | Commercial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||||
![]() | GS8182R08BGD-167I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 165 | 165 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.5 ns | 85 °C | 有 | GS8182R08BGD-167I | 2097152 words | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.18 | BGA | Compliant | e1 | 有 | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 流水线结构 | 8542.32.00.41 | CMOS | 1.8 V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 1 | SYNCHRONOUS | 2MX8 | 1.4 mm | 8 | 19 b | 18 Mb | 16777216 bit | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | 15 mm | 13 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342QT19BD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | Compliant | 333 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8342QT19BD-333I | 333 MHz | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.22 | BGA | Industrial grade | 333 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | -40 to 100 °C | Bulk | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | SRAMs | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 895 mA | Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 20 Bit | 36 Mbit | 37748736 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | 15 mm | 13 mm | 无 | ||||||||||||||
![]() | GS8662T37BGD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaDDR-II+ | Details | DDR | Industrial grade | 450 MHz | FBGA | DDR | 1.8000 V | Synchronous | 2 MWords | 36 Bit | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | -40 to 100 °C | Tray | GS8662T37BGD | SigmaDDR-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 910 mA | Pipelined | 2 M x 36 | 20 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881Z36CGT-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | 2, 2.7 V | 表面贴装 | Compliant | 200 MHz | + 70 C | 2.7 V | 0 C | 1.7 V | SMD/SMT | Parallel | LQFP, | FLATPACK, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | QFP | 5.28 | GSI TECHNOLOGY | 活跃 | GSI技术 | RECTANGULAR | LQFP | 1.8 V | GS881Z36CGT-200V | 有 | 70 °C | 6.5 ns | 未说明 | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 36 Bit | 0 to 70 °C | e3 | 有 | 3A991.B.2.B | Matte Tin (Sn) | 70 °C | 0 °C | IT ALSO OPERATE WITH 2.5 V, FLOW THROUGH AND PIPELINED ARCHITECTURE | 8542.32.00.41 | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | COMMERCIAL | 9 Mbit | 1 | SYNCHRONOUS | 125 mA, 150 mA | 6.5 ns | Flow-Through/Pipelined | 256 k x 36 | 1.6 mm | 36 | 18 Bit | 9 Mbit | 9437184 bit | Commercial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | 20 mm | 14 mm | 无 | ||||||||||||||||||||||
![]() | GS8644Z18E-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | Commercial grade | 153.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 4 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 250 MHz | + 70 C | 3.6 V | 0 C | 15 | 2.3 V | 0 to 70 °C | Tray | GS8644Z18E | NBT | 70 °C | 0 °C | Memory & Data Storage | 72 Mbit | 2 | 250 mA, 360 mA | 6.5 ns | Flow-Through/Pipelined | 4 M x 18 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T38BGD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662T38BGD | SigmaQuad-II+ | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 800 mA | Pipelined | 2 M x 36 | 20 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D07GE-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaQuad-II+ | Details | QDR-II | Commercial grade | 350 MHz | FBGA | QDR | 1.8000 V | Synchronous | 16 MWords | 8 Bit | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | 0 to 85 °C | Tray | GS81302D07GE | SigmaQuad-II+ B4 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 940 mA | Pipelined | 16 M x 8 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z18AGD-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 85 C | 2.7 V | - 40 C | 14 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | BGA | 0.88 | GSI TECHNOLOGY | 活跃 | RECTANGULAR | LBGA | 1.8 V | 150 MHz | GS8322Z18AGD-150IV | 有 | 85 °C | 7.5 ns | 未说明 | -40 °C | BGA165,11X15,40 | PLASTIC/EPOXY | 2000000 | 3 | GRID ARRAY, LOW PROFILE | LBGA, BGA165,11X15,40 | Industrial grade | -40 to 100 °C | Tray | GS8322Z18AGD | 3A991.B.2.B | NBT | 100 °C | -40 °C | ALSO OPERATED WITH 2.5V SUPPLY; PIPELINE/FLOW THROUGH ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.8/2.5 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 205 mA, 220 mA | 7.5 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 21 Bit | SRAM | 36 Mbit | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | ZBT SRAM | 1.7 V | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||
![]() | GS8662T38BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | DDR-II | Details | SigmaDDR-II+ | GSI技术 | GSI技术 | Industrial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8662T38BGD | SigmaQuad-II+ | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 810 mA | Pipelined | 2 M x 36 | 20 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 |
GS8342D38BD-550I
GSI Technology
分类:Memory
GS8182T09BGD-333
GSI Technology
分类:Memory
GS88037CGT-300I
GSI Technology
分类:Memory
GS8182R18BD-333
GSI Technology
分类:Memory
GS88036CGT-333
GSI Technology
分类:Memory
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