品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS881Z32CD-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | 1.7 V | 66 | 0 C | 2.7 V | + 70 C | 200 MHz | 有 | Commercial grade | 表面贴装 | 2, 2.7 V | 32 Bit | 256 kWords | Synchronous | 1.7, 2.3 V | 1.8, 2.5 V | SDR | FBGA | 153.8@Flow-Through/200@Pipelined MHz | SDR | N | NBT SRAM | GSI技术 | GSI技术 | Parallel | 0 to 70 °C | Tray | GS881Z32CD | NBT | Memory & Data Storage | 9 Mbit | 1 | 125 mA, 150 mA | 6.5 ns | Flow-Through/Pipelined | 256 k x 32 | 18 Bit | SRAM | 8 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D06E-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 500 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | Industrial grade | -40 to 100 °C | 2 | Pipelined | 22 Bit | 144 Mbit | Industrial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881E32CGT-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | 333 MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 32 Bit | 2, 2.7 V | 表面贴装 | 有 | 333 MHz | + 85 C | 3.6 V | - 40 C | 36 | -40 to 85 °C | Tray | GS881E32CGT | DCD Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 4 | 200 mA, 260 mA | 4.5 ns | Flow-Through/Pipelined | 256 k x 32 | 18 Bit | SRAM | 9 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342DT06BD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8000 V | Synchronous | 8 Bit | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | 有 | 450 MHz | FBGA | -40 to 100 °C | Tray | GS8342DT06BD | SigmaQuad-II+ | Memory & Data Storage | 36 Mbit | 795 mA | 0.45 | 4 M x 8 | SRAM | 36 | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816273CGC-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 300 MHz | BGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 300 MHz | + 70 C | 3.6 V | 0 C | 21 | 0 to 70 °C | Tray | GS816273CGC | Pipeline | Memory & Data Storage | 18 Mbit | 8 | 415 mA | Pipelined | 256 k x 72 | 18 Bit | SRAM | 18 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832118AD-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 165 | 165 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 4.5 ns | 85 °C | 无 | GS832118AD-375I | 375 MHz | 2.5 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.16 | BGA | Industrial grade | 238@Flow-Through/375@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | -40 to 100 °C | 3A991.B.2.B | PIPELINE OR FLOW THROUGH ARCHITECTUREL; ALSO OPERATES AT 3.3 V SUPPLY | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 2 | SYNCHRONOUS | 0.31 mA | Flow-Through/Pipelined | 1MX18 | 3-STATE | 1.4 mm | 18 | 21 Bit | 36 Mbit | 0.04 A | 18874368 bit | Industrial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||
![]() | GS8662Q19BGD-357 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 357 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 357 MHz | FBGA | 0 to 85 °C | GS8662Q19BGD | 72 Mbit | 2 | 985 mA | Pipelined | 4 M x 18 | 21 Bit | 72 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342TT11BGD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | Industrial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Tray | GS8342TT11BGD | SigmaQuad-II+ | Memory & Data Storage | 36 Mbit | 1 | 680 mA | Pipelined | 4 M x 9 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881Z32CD-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 32 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | 66 | 1.7 V | -40 to 85 °C | Tray | GS881Z32CD | NBT | Memory & Data Storage | 9 Mbit | 1 | 160 mA, 200 mA | 5.5 ns | Flow-Through/Pipelined | 256 k x 32 | 18 Bit | SRAM | 8 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342T07BD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8342T07BD-400I | 400 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.22 | BGA | Industrial grade | 400 MHz | -40 to 100 °C | Tray | GS8342T07BD | e0 | 3A991.B.2.B | SigmaDDR-II+ B2 | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 1 | SYNCHRONOUS | 610 mA | Pipelined | 4 M x 8 | 3-STATE | 1.4 mm | 8 | 21 Bit | SRAM | 36 Mbit | 0.225 A | 33554432 bit | Industrial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||
![]() | GS8182R36BGD-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 512 kWords | 36 Bit | 表面贴装 | Commercial grade | 375 MHz | FBGA | DDR | 1.8000 V | Synchronous | 0 to 70 °C | 1 | Pipelined | 19 Bit | 18 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662Q37BD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 200 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 200 MHz | FBGA | -40 to 100 °C | 72 Mbit | 2 | 750 mA | Pipelined | 2 M x 36 | 20 Bit | 72 Mbit | Industrial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8644Z36E-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Industrial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 85 C | 2.7 V | - 40 C | 15 | -40 to 85 °C | Tray | GS8644Z36E | NBT | Memory & Data Storage | 72 Mbit | 4 | 295 mA, 380 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 36 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302S18E-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 250 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 250 MHz | FBGA | 0 to 85 °C | GS81302S18E | 144 Mbit | 2 | 700 mA | Pipelined | 8 M x 18 | 22 Bit | 144 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T09BGD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaCIO DDR-II | Details | DDR | Industrial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Tray | GS8662T09BGD | SigmaDDR-II B2 | Memory & Data Storage | 72 Mbit | 1 | 600 mA | Pipelined | 8 M x 9 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881Z18CD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | Industrial grade | 222.2@Flow-Through/333@Pipelined MHz | FBGA | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 18 Bit | 2.7, 3.6 V | 333 MHz | -40 to 85 °C | GS881Z18CD | 9 Mbit | 185 mA, 240 mA | 4.5@Flow-Through/2.5 | 512 k x 18 | 9 | Industrial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT10GE-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | Commercial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 10 | 0 to 85 °C | Tray | GS81302DT10GE | SigmaQuad-II+ B4 | Memory & Data Storage | 144 Mbit | 2 | 1.175 A | Pipelined | 16 M x 9 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT19E-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | QDR-II | Commercial grade | 350 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 10 | 0 to 85 °C | Tray | GS81302DT19E | SigmaQuad-II+ B4 | Memory & Data Storage | 144 Mbit | 2 | 940 mA | Pipelined | 8 M x 18 | 21 Bit | SRAM | 144 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321E36AGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 222@Flow-Through/333@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 18 | 0 to 85 °C | Tray | GS8321E36AGD | DCD Pipeline/Flow Through | Memory & Data Storage | 36 Mbit | 4 | 260 mA, 345 mA | 4.5 ns | Flow-Through/Pipelined | 1 M x 36 | 20 Bit | SRAM | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342DT06BGD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Industrial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Tray | GS8342DT06BGD | SigmaQuad-II+ | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 795 mA | Pipelined | 4 M x 8 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816273CC-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-209 | YES | 209 | 209 | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 85 C | 3.6 V | - 40 C | 21 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Compliant | LBGA, | GRID ARRAY, LOW PROFILE | 256000 | PLASTIC/EPOXY | -40 °C | 未说明 | 2.3 ns | 85 °C | 无 | GS816273CC-333I | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.49 | BGA | Industrial grade | 333 MHz | BGA | -40 to 85 °C | Tray | GS816273CC | 无 | 3A991.B.2.B | Pipeline | 85 °C | -40 °C | PIPELINED ARCHITECTURE; ALSO OPERATES WITH 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B209 | 不合格 | INDUSTRIAL | 18 Mbit | 8 | SYNCHRONOUS | 470 mA | Pipelined | 256 k x 72 | 1.7 mm | 72 | 18 Bit | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | 无 | |||||||||||||
![]() | GS881E18CD-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 表面贴装 | 2, 2.7 V | 18 Bit | 512 kWords | Synchronous | 1.7, 2.3 V | 1.8, 2.5 V | Compliant | Commercial grade | 0 to 70 °C | 70 °C | 0 °C | 2 | Flow-Through/Pipelined | 18 Bit | 9 Mbit | Commercial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z18AD-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 70 C | 2.7 V | 0 C | 14 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 6.5 ns | 70 °C | 无 | GS8322Z18AD-200V | 200 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.13 | BGA | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | 0 to 85 °C | Tray | GS8322Z18AD | 3A991.B.2.B | NBT | 85 °C | 0 °C | ALSO OPERATED WITH 2.5V SUPPLY; PIPELINE/FLOW THROUGH ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.8/2.5 V | COMMERCIAL | 36 Mbit | 2 | SYNCHRONOUS | 195 mA, 230 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 21 Bit | SRAM | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | ZBT SRAM | 1.7 V | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||||||
![]() | GS8342TT38BD-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 无 | GS8342TT38BD-500 | 500 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.35 | BGA | Commercial grade | 500 MHz | 0 to 85 °C | Tray | GS8342TT38BD | e0 | 3A991.B.2.B | SigmaQuad-II+ | Tin/Lead (Sn/Pb) | 85 °C | 0 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 36 Mbit | 1 | SYNCHRONOUS | 945 mA | Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 19 Bit | SRAM | 36 Mbit | 37748736 bit | Commercial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||
![]() | GS88118CGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 222.2@Flow-Through/333@Pipelined MHz | 表面贴装 | 2.7, 3.6 V | 18 Bit | 512 kWords | Synchronous | 2.3, 3 V | 2.5, 3.3 V | SDR | FBGA | Compliant | 333 MHz | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | Industrial grade | -40 to 85 °C | 85 °C | -40 °C | 9 Mbit | 1 | 185 mA, 240 mA | 4.5 ns | Flow-Through/Pipelined | 512 k x 18 | 19 Bit | 9 Mbit | Industrial | 无 |
GS881Z32CD-200V
GSI Technology
分类:Memory
GS81302D06E-500I
GSI Technology
分类:Memory
GS881E32CGT-333I
GSI Technology
分类:Memory
GS8342DT06BD-450I
GSI Technology
分类:Memory
GS816273CGC-300
GSI Technology
分类:Memory
GS832118AD-375I
GSI Technology
分类:Memory
GS8662Q19BGD-357
GSI Technology
分类:Memory
GS8342TT11BGD-450I
GSI Technology
分类:Memory
GS881Z32CD-250IV
GSI Technology
分类:Memory
GS8342T07BD-400I
GSI Technology
分类:Memory
GS8182R36BGD-375
GSI Technology
分类:Memory
GS8662Q37BD-200I
GSI Technology
分类:Memory
GS8644Z36E-200IV
GSI Technology
分类:Memory
GS81302S18E-250
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