品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS81302T20E-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaDDR-II+ | N | DDR-II | Commercial grade | 350 MHz | FBGA | DDR | 1.8000 V | Synchronous | 8 MWords | 18 Bit | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | 0 to 85 °C | Tray | GS81302T20E | SigmaDDR-II+ | Memory & Data Storage | 144 Mbit | 1 | 800 mA | Pipelined | 8 M x 18 | SRAM | 144 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816236DGD-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 375 MHz | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | Industrial grade | 238@Flow-Through/375@Pipelined MHz | FBGA | SDR | -40 to 100 °C | 18 Mbit | 4 | 290 mA, 370 mA | 4.2 ns | Flow-Through/Pipelined | 512 k x 36 | 19 Bit | 18 Mbit | Industrial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662DT10BD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | N | DDR | 400 MHz | FBGA | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | 0 to 85 °C | Tray | GS8662DT10BD | SigmaQuad-II+ B4 | Memory & Data Storage | 72 Mbit | 735 mA | 0.45 | 8 M x 9 | SRAM | 72 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS840H36AGT-180 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 100 | 100 | FLATPACK, LOW PROFILE | 3 | 128000 | PLASTIC/EPOXY | QFP100,.63X.87 | 未说明 | 8 ns | 70 °C | 有 | GS840H36AGT-180 | 180 MHz | 131072 words | 3.3 V | LQFP | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.34 | QFP | LQFP, QFP100,.63X.87 | e3 | 有 | 3A991.B.2.B | 纯哑光锡 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 2.5/3.3,3.3 V | COMMERCIAL | SYNCHRONOUS | 0.335 mA | 128KX36 | 3-STATE | 1.6 mm | 36 | 0.02 A | 4718592 bit | PARALLEL | COMMON | 缓存SRAM | 3.14 V | 3.6 V | 3 V | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | GS8161E36DGD-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 375 MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 375 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | 0 to 85 °C | Tray | GS8161E36DGD | DCD Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 4 | 270 mA, 350 mA | 4.2 ns | Flow-Through/Pipelined | 512 k x 36 | 19 Bit | SRAM | 18 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342T37BGD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | DDR | Industrial grade | 350 MHz | FBGA | 1.8000 V | 1.7 V | Synchronous | 36 Bit | 1.9 V | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | -40 to 100 °C | Tray | GS8342T37BGD | SigmaDDR-II+ B2 | Memory & Data Storage | 36 Mbit | 735 mA | 0.45 | 1 M x 36 | 19 Bit | SRAM | 36 | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816218DGB-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | 250@Flow-Through/400@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 表面贴装 | 2.7, 3.6 V | 18 Bit | 1 MWords | 有 | 400 MHz | + 85 C | 3.6 V | - 40 C | 21 | 2.3 V | -40 to 100 °C | Tray | GS816218DGB | Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 2 | 275 mA, 355 mA | 4 ns | Flow-Through/Pipelined | 1 M x 18 | 20 Bit | SRAM | 18 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z72C-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | Commercial grade | 133.3@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 72 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 70 C | 2.7 V | 0 C | 14 | 1.7 V | 0 to 70 °C | Tray | GS8322Z72C | NBT | Memory & Data Storage | 36 Mbit | 8 | 235 mA, 320 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 72 | 19 Bit | SRAM | 36 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816273CGC-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | 250 MHz | BGA | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 72 Bit | 2, 2.7 V | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | 21 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | -40 to 85 °C | Tray | GS816273CGC | Pipeline | Memory & Data Storage | 18 Mbit | 360 mA | 3 | 256 k x 72 | SRAM | 18 | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832218AGD-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 150 MHz | + 85 C | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 133@Flow-Through/150@Pipelined MHz | FBGA | SDR | -40 to 100 °C | 36 Mbit | 2 | 205 mA, 220 mA | 7.5 ns | Flow-Through/Pipelined | 2 M x 18 | 21 Bit | 36 Mbit | Industrial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832218AGD-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 70 C | 2.7 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 6.5 ns | 70 °C | 有 | GS832218AGD-200V | 200 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.11 | BGA | Commercial grade | FBGA | SDR | 0 to 85 °C | Tray | GS832218AGD | e1 | 有 | 3A991.B.2.B | Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 2.5V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.8/2.5 V | COMMERCIAL | 36 Mbit | 2 | SYNCHRONOUS | 195 mA, 230 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | SRAM | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | 缓存SRAM | 1.7 V | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||
![]() | GS84018AB-166IT | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 119 | 119 | BGA, BGA119,7X17,50 | 网格排列 | 3 | 256000 | PLASTIC/EPOXY | BGA119,7X17,50 | -40 °C | 未说明 | 8.5 ns | 85 °C | 无 | GS84018AB-166IT | 166 MHz | 262144 words | 3.3 V | BGA | RECTANGULAR | GSI技术 | BGA | 5.72 | GSI TECHNOLOGY | Obsolete | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | 2.5/3.3,3.3 V | INDUSTRIAL | SYNCHRONOUS | 0.32 mA | 256KX18 | 3-STATE | 2.19 mm | 18 | 0.03 A | 4718592 bit | PARALLEL | COMMON | 缓存SRAM | 3.14 V | 3.6 V | 3 V | 22 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||
![]() | GS81302T10E-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaDDR-II+ | N | DDR-II | Commercial grade | 300 MHz | FBGA | DDR | 1.8000 V | Synchronous | 16 MWords | 9 Bit | 表面贴装 | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | 0 to 85 °C | Tray | GS81302T10E | SigmaDDR-II+ B2 | Memory & Data Storage | 144 Mbit | 1 | 690 mA | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662TT19BD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | Industrial grade | -40 to 100 °C | 1 | Pipelined | 21 Bit | 72 Mbit | Industrial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662DT06BGD-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | 350 MHz | FBGA | 1.8000 V | 1.7 V | 8 MWords | 8 Bit | 1.9 V | 350 MHz | + 70 C | 1.9 V | 0 C | 0 to 85 °C | GS8662DT06BGD | 72 Mbit | 695 mA | 0.45 | 8 M x 8 | 72 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662TT37BD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR | Commercial grade | 333 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662TT37BD | SigmaDDR-II+ B2 | Memory & Data Storage | 72 Mbit | 1 | 685 mA | Pipelined | 2 M x 36 | 20 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T06BD-450M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaCIO DDR-II | DDR | Military grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 125 C | 1.9 V | - 55 C | 15 | 1.7 V | SMD/SMT | -55 to 125 °C | Tray | GS8662T06BD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 1 | Pipelined | 8 M x 8 | 22 Bit | SRAM | 72 Mbit | Military | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161E32DD-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Commercial grade | 238@Flow-Through/375@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 32 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 375 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | 0 to 70 °C | Tray | GS8161E32DD | DCD Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 4 | 270 mA, 350 mA | 4.2 ns | Flow-Through/Pipelined | 512 k x 32 | 19 Bit | SRAM | 18 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182R18BD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 165 | 165 | 无 | GS8182R18BD-250 | 1048576 words | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.19 | BGA | LBGA, | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | not_compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | SYNCHRONOUS | 1MX18 | 1.4 mm | 18 | 18874368 bit | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D08BD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 8 Bit | 1.9 V | 表面贴装 | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8662D08BD-250I | 250 MHz | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.36 | BGA | 250 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 250 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | -40 to 100 °C | GS8662D08BD | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 72 Mbit | 2 | SYNCHRONOUS | 0.51 mA | Pipelined | 8MX8 | 3-STATE | 1.4 mm | 8 | 21 Bit | 72 Mbit | 67108864 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | 15 mm | 13 mm | |||||||||||||||
![]() | GS8662TT37BD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR | Commercial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662TT37BD | SigmaDDR-II+ B2 | Memory & Data Storage | 72 Mbit | 1 | 900 mA | Pipelined | 2 M x 36 | 20 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161E32DD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 32 Bit | 2.7, 3.6 V | 表面贴装 | 333 MHz | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | Industrial grade | 222.2@Flow-Through/333@Pipelined MHz | FBGA | SDR | -40 to 85 °C | 18 Mbit | 4 | 280 mA, 335 mA | 4.5 ns | Flow-Through/Pipelined | 512 k x 32 | 19 Bit | 18 Mbit | Industrial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662QT37BGD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Commercial grade | 200 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 200 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662QT37BGD | SigmaQuad-II+ B2 | Memory & Data Storage | 72 Mbit | 2 | 740 mA | Pipelined | 2 M x 36 | 20 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881E32CGT-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 333 MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 32 Bit | 2, 2.7 V | 表面贴装 | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | 0 to 70 °C | Tray | GS881E32CGT | DCD Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 4 | 180 mA, 240 mA | 4.5 ns | Flow-Through/Pipelined | 256 k x 32 | 18 Bit | SRAM | 9 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88136CGD-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 181.8@Flow-Through/250@Pipelined MHz | FBGA | 1.8, 2.5 V | 2, 2.7 V | 36 Bit | Synchronous | 1.7, 2.3 V | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | -40 to 85 °C | Tray | GS88136CGD | 同步突发 | Memory & Data Storage | 9 Mbit | 160 mA, 200 mA | 5.5@Flow-Through/3@P | 256 k x 36 | SRAM | 9 | SRAM |
GS81302T20E-350
GSI Technology
分类:Memory
GS816236DGD-375I
GSI Technology
分类:Memory
GS8662DT10BD-400
GSI Technology
分类:Memory
GS840H36AGT-180
GSI Technology
分类:Memory
GS8161E36DGD-375
GSI Technology
分类:Memory
GS8342T37BGD-350I
GSI Technology
分类:Memory
GS816218DGB-400I
GSI Technology
分类:Memory
GS8322Z72C-200V
GSI Technology
分类:Memory
GS816273CGC-250IV
GSI Technology
分类:Memory
GS832218AGD-150IV
GSI Technology
分类:Memory
GS832218AGD-200V
GSI Technology
分类:Memory
GS84018AB-166IT
GSI Technology
分类:Memory
GS81302T10E-300
GSI Technology
分类:Memory
GS8662TT19BD-350I
GSI Technology
分类:Memory
GS8662DT06BGD-350
GSI Technology
分类:Memory
GS8662TT37BD-333
GSI Technology
分类:Memory
GS8662T06BD-450M
GSI Technology
分类:Memory
GS8161E32DD-375
GSI Technology
分类:Memory
GS8182R18BD-250
GSI Technology
分类:Memory
GS8662D08BD-250I
GSI Technology
分类:Memory
GS8662TT37BD-450
GSI Technology
分类:Memory
GS8161E32DD-333I
GSI Technology
分类:Memory
GS8662QT37BGD-200
GSI Technology
分类:Memory
GS881E32CGT-333
GSI Technology
分类:Memory
GS88136CGD-250IV
GSI Technology
分类:Memory
