品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS88236CB-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 85 C | 2.7 V | - 40 C | 42 | 1.7 V | SMD/SMT | -40 to 85 °C | Tray | GS88236CB | SCD/DCD Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 4 | 130 mA, 145 mA | 7.5 ns | Flow-Through/Pipelined | 256 k x 36 | 18 Bit | SRAM | 9 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT07GE-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | Commercial grade | 表面贴装 | 1.9 V | 8 Bit | 16 MWords | Synchronous | 1.7 V | 1.8000 V | DDR | FBGA | 400 MHz | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302TT07GE | SigmaDDR-II+ B2 | Memory & Data Storage | 144 Mbit | 1 | 895 mA | Pipelined | 16 M x 8 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662TT11BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaDDR-II+ | Details | DDR | Industrial grade | 400 MHz | FBGA | DDR | 1.8000 V | Synchronous | 8 MWords | 9 Bit | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | -40 to 100 °C | Tray | GS8662TT11BGD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 1 | 635 mA | Pipelined | 8 M x 9 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D06BGD-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8662D06BGD-500I | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.23 | BGA | Industrial grade | 500 MHz | FBGA | QDR | -40 to 100 °C | Tray | GS8662D06BGD | 3A991.B.2.B | SigmaQuad-II+ | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 72 Mbit | 2 | SYNCHRONOUS | 900 mA | Pipelined | 8 M x 8 | 1.4 mm | 8 | 21 Bit | SRAM | 72 Mbit | 67108864 bit | Industrial | PARALLEL | QDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||||||||||||
![]() | GS8162Z72CGC-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | BGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 72 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | 21 | 1.7 V | -40 to 85 °C | Tray | GS8162Z72CGC | NBT | Memory & Data Storage | 18 Mbit | 8 | 275 mA, 360 mA | 5.5 ns | Flow-Through/Pipelined | 256 k x 72 | 18 Bit | SRAM | 18 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS882Z36CGB-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Industrial grade | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 85 C | 3.6 V | - 40 C | 42 | 2.3 V | SMD/SMT | Parallel | -40 to 85 °C | Tray | GS882Z36CGB | NBT Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 4 | 200 mA, 260 mA | 4.5 ns | Flow-Through/Pipelined | 256 k x 36 | SRAM | 9 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832218AGD-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | 18 | - 40 C | 2.7 V | + 85 C | 250 MHz | 有 | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | SDR | Details | SyncBurst | GSI技术 | GSI技术 | Parallel | SMD/SMT | -40 to 100 °C | Tray | GS832218AGD | Pipeline/Flow Through | Memory & Data Storage | 36 Mbit | 2 | 245 mA, 285 mA | 5.5 ns | Flow-Through/Pipelined | 2 M x 18 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302T06GE-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | 165 | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 16000000 | PLASTIC/EPOXY | 未说明 | 0.37 ns | 70 °C | 有 | GS81302T06GE-500 | 1.8 V | LBGA | RECTANGULAR | 不推荐 | GSI TECHNOLOGY | 5.33 | BGA | Commercial grade | 500 MHz | FBGA | DDR | 0 to 85 °C | Tray | GS81302T06GE | e1 | 有 | 3A991.B.2.B | SigmaDDR-II+ | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 144 Mbit | 1 | SYNCHRONOUS | 1.07 A | Pipelined | 16 M x 8 | 1.5 mm | 8 | 23 Bit | SRAM | 144 Mbit | 134217728 bit | Commercial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 17 mm | 15 mm | |||||||||||||||
![]() | GS8662D19BD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | DDR | Commercial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662D19BD | SigmaQuad-II+ B4 | Memory & Data Storage | 72 Mbit | 2 | 820 mA | Pipelined | 4 M x 18 | 20 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS864236GB-167I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | 125@Flow-Through/167@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 36 Bit | 表面贴装 | 2.7, 3.6 V | 有 | 167 MHz | + 85 C | 3.6 V | - 40 C | 14 | 2.3 V | -40 to 85 °C | Tray | GS864236GB | SCD/DCD Pipeline/Flow Through | Memory & Data Storage | 72 Mbit | 4 | 240 mA, 290 mA | 8 ns | Flow-Through/Pipelined | 2 M x 36 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D37BD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 无 | GS8342D37BD-450 | 450 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.22 | BGA | Commercial grade | 450 MHz | FBGA | 0 to 85 °C | Tray | GS8342D37BD | 3A991.B.2.B | SigmaQuad-II+ B4 | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 36 Mbit | 2 | SYNCHRONOUS | 1.015 A | Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 18 Bit | SRAM | 36 Mbit | 0.24 A | 37748736 bit | Commercial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||||||
![]() | GS8662Q19BD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Industrial grade | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS8662Q19BD | SigmaQuad-II+ B2 | Memory & Data Storage | 72 Mbit | 2 | 860 mA | Pipelined | 4 M x 18 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662R08BD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | N | DDR | Commercial grade | 333 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662R08BD | SigmaDDR-II B4 | Memory & Data Storage | 72 Mbit | 1 | 535 mA | Pipelined | 8 M x 8 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z36AGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 250@Flow-Through/400@Pipelined MHz | 表面贴装 | 2.7, 3.6 V | 36 Bit | 1 MWords | Synchronous | 2.3, 3 V | 2.5, 3.3 V | SDR | FBGA | 有 | 400 MHz | + 85 C | 3.6 V | - 40 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 4 ns | 85 °C | 有 | GS8322Z36AGD-400I | 400 MHz | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.26 | BGA | Industrial grade | -40 to 100 °C | Tray | GS8322Z36AGD | e1 | 有 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 36 Mbit | 4 | SYNCHRONOUS | 305 mA, 415 mA | 4 ns | Flow-Through/Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 20 Bit | SRAM | 36 Mb | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | ||||||
![]() | GS8342T19BD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 1.9 V | 表面贴装 | 450 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 无 | GS8342T19BD-450 | 450 MHz | 1.8 V | LBGA | RECTANGULAR | GSI技术 | BGA | 5.22 | GSI TECHNOLOGY | 活跃 | Commercial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 0 to 85 °C | e0 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 36 Mbit | 1 | SYNCHRONOUS | 670 mA | Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 20 Bit | 36 Mbit | 0.23 A | 37748736 bit | Commercial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | 15 mm | 13 mm | |||||||||||||||||||||
![]() | GS881Z18CGD-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Commercial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 150 MHz | + 70 C | 3.6 V | 0 C | 72 | 2.3 V | 0 to 70 °C | Tray | GS881Z18CGD | NBT Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 1 | 120 mA, 130 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 18 | 18 Bit | SRAM | 9 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT10E-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR-II | Commercial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302TT10E | SigmaDDR-II+ B2 | Memory & Data Storage | 144 Mbit | 1 | 800 mA | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8640E32GT-167V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Commercial grade | 125@Flow-Through/167@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 32 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 167 MHz | + 70 C | 2.7 V | 0 C | 18 | 0 to 70 °C | Tray | GS8640E32GT | DCD | 70 °C | 0 °C | Memory & Data Storage | 72 Mbit | 4 | 220 mA, 270 mA | 8 ns | Flow-Through/Pipelined | 2 M x 32 | 21 Bit | SRAM | 64 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D37GE-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | SigmaQuad-II+ | QDR-II | Commercial grade | 350 MHz | FBGA | QDR | 1.8000 V | Synchronous | 4 MWords | 36 Bit | 表面贴装 | Compliant | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | 0 to 85 °C | Bulk | GS81302D37GE | SigmaQuad-II+ B4 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 1.055 A | Pipelined | 4 M x 36 | 20 Bit | SRAM | 144 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z36AD-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 375 MHz | + 85 C | 3.6 V | - 40 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 4.2 ns | 85 °C | 无 | GS8322Z36AD-375I | 375 MHz | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.12 | BGA | Industrial grade | 238@Flow-Through/375@Pipelined MHz | -40 to 100 °C | Bulk | GS8322Z36AD | e0 | 无 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 36 Mbit | 4 | SYNCHRONOUS | 290 mA, 400 mA | 4.2 ns | Flow-Through/Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 20 Bit | SRAM | 36 Mbit | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | 无 | ||||
![]() | GS8342DT07BD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8342DT07BD-350I | 350 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.22 | BGA | Industrial grade | 350 MHz | -40 to 100 °C | Bulk | GS8342DT07BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II+ B4 | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 675 mA | Pipelined | 4 M x 8 | 3-STATE | 1.4 mm | 8 | 20 Bit | SRAM | 36 Mbit | 33554432 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||||
![]() | GS881Z18CGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Industrial grade | 222.2@Flow-Through/333@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 表面贴装 | 2.7, 3.6 V | 18 Bit | 512 kWords | Compliant | 有 | 333 MHz | + 85 C | 3.6 V | - 40 C | 36 | -40 to 85 °C | Tray | GS881Z18CGD | NBT Pipeline/Flow Through | 85 °C | -40 °C | Memory & Data Storage | 9 Mbit | 1 | 185 mA, 240 mA | 4.5 ns | Flow-Through/Pipelined | 512 k x 18 | 18 Bit | SRAM | 9 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832218AB-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 200 MHz | + 85 C | 2.7 V | - 40 C | 14 | 1.7 V | SMD/SMT | -40 to 100 °C | Bulk | GS832218AB | Pipeline/Flow Through | 100 °C | -40 °C | Memory & Data Storage | 36 Mbit | 2 | 215 mA, 250 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 18 | 21 b | SRAM | 36 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88218CB-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | 2, 2.7 V | 18 Bit | 512 kWords | Synchronous | 1.7, 2.3 V | 1.8, 2.5 V | SDR | FBGA | 133.3@Flow-Through/150@Pipelined MHz | Compliant | 150 MHz | + 85 C | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 表面贴装 | -40 to 85 °C | GS88218CB | 85 °C | -40 °C | 9 Mbit | 2 | 125 mA, 135 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 18 | 18 Bit | 9 Mbit | Industrial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321E36AD-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 2.3, 3 V | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 375 MHz | + 70 C | 3.6 V | 0 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 4.2 ns | 85 °C | 无 | GS8321E36AD-375 | 375 MHz | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.31 | BGA | Commercial grade | FBGA | SDR | 2.5, 3.3 V | 0 to 85 °C | Bulk | GS8321E36AD | e0 | 无 | 3A991.B.2.B | DCD Pipeline/Flow Through | 锡铅 | 85 °C | 0 °C | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | OTHER | 36 Mbit | 4 | SYNCHRONOUS | 270 mA, 380 mA | 4.2 ns | Flow-Through/Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 20 b | SRAM | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | 无 |
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