品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 数据率 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8642Z18GB-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Industrial grade | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 4 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 300 MHz | + 85 C | 3.6 V | - 40 C | 14 | 2.3 V | SMD/SMT | Parallel | -40 to 85 °C | Tray | GS8642Z18GB | NBT Pipeline/Flow Through | Memory & Data Storage | 72 Mbit | 2 | 290 mA, 390 mA | 5.5 ns | Flow-Through/Pipelined | 4 M x 18 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS840H18AB-180 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 119 | 119 | BGA, BGA119,7X17,50 | 网格排列 | 3 | 256000 | PLASTIC/EPOXY | BGA119,7X17,50 | 未说明 | 8 ns | 70 °C | 无 | BGA | 5.21 | GSI TECHNOLOGY | 活跃 | GSI技术 | RECTANGULAR | BGA | 3.3 V | 262144 words | 180 MHz | GS840H18AB-180 | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | 2.5/3.3,3.3 V | COMMERCIAL | SYNCHRONOUS | 0.335 mA | 256KX18 | 3-STATE | 2.19 mm | 18 | 0.02 A | 4718592 bit | PARALLEL | COMMON | 缓存SRAM | 3.14 V | 3.6 V | 3 V | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662DT19BGD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Industrial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8662DT19BGD | SigmaQuad-II+ B4 | Memory & Data Storage | 72 Mbit | 2 | 830 mA | Pipelined | 4 M x 18 | 20 Bit | SRAM | 72 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8673ED18BK-675 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-260 | 260 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | N | DDR | Commercial grade | 675/450 MHz | BGA | QDR | 1.3500 V | 1.3 V | Synchronous | 4 MWords | 18 Bit | 1.4 V | 表面贴装 | 有 | 675 MHz | + 85 C | 1.4 V | 0 C | 8 | 1.3 V | 0 to 70 °C | Tray | GS8673ED18BK | SigmaQuad-IIIe B4 | Memory & Data Storage | 72 Mbit | 2.26 A | 1.35 Gb/s | Pipelined | 4 M x 18 | 20 Bit | SRAM | 72 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302Q10E-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | QDR-II | Commercial grade | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302Q10E | SigmaQuad-II+ B2 | Memory & Data Storage | 144 Mbit | 2 | 1.25 A | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662Q09BD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 200 MHz | FBGA | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 1.9 V | 9 Bit | 有 | 200 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | -40 to 100 °C | Tray | GS8662Q09BD | SigmaQuad-II | Memory & Data Storage | 72 Mbit | 610 mA | 0.45 | 8 M x 9 | SRAM | 72 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88118CGD-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | 未说明 | 70 °C | 有 | GS88118CGD-150 | 524288 words | 3.3 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.14 | BGA | 有 | 150 MHz | + 70 C | 3.6 V | 0 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LBGA, | Tray | GS88118CGD | 3A991.B.2.B | Pipeline/Flow Through | ALSO OPERATES WITH 2.3V TO 2.7V SUPPLY, FLOW THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 9 Mbit | SYNCHRONOUS | 120 mA, 130 mA | 7.5 ns | 512 k x 18 | 1.4 mm | 18 | SRAM | 9437184 bit | SERIAL | 缓存SRAM | 3.6 V | 3 V | SRAM | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||||||
![]() | GS8342D10BD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Industrial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS8342D10BD | SigmaQuad-II+ B4 | Memory & Data Storage | 36 Mbit | 2 | 715 mA | Pipelined | 4 M x 9 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8640E32GT-167IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 32 Bit | 2, 2.7 V | 表面贴装 | 有 | 167 MHz | + 85 C | 2.7 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | -40 to 85 °C | Tray | GS8640E32GT | DCD | Memory & Data Storage | 72 Mbit | 4 | 240 mA, 290 mA | 8 ns | Flow-Through/Pipelined | 2 M x 32 | SRAM | 64 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816273CC-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | Commercial grade | 250 MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 250 MHz | + 70 C | 3.6 V | 0 C | 21 | 2.3 V | 0 to 70 °C | Tray | GS816273CC | Pipeline | Memory & Data Storage | 18 Mbit | 8 | 350 mA | Pipelined | 256 k x 72 | 18 Bit | SRAM | 18 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662S08BD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR | Industrial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS8662S08BD | SigmaSIO DDR-II | Memory & Data Storage | 72 Mbit | 2 | 705 mA | Pipelined | 8 M x 8 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662DT37BD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 165 | 165 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8662DT37BD-300I | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.78 | BGA | Industrial grade | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | LBGA, | GRID ARRAY, LOW PROFILE | 2000000 | -40 to 100 °C | 3A991.B.2.B | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | INDUSTRIAL | 2 | SYNCHRONOUS | Pipelined | 2MX36 | 1.4 mm | 36 | 19 Bit | 72 Mb | 75497472 bit | Industrial | PARALLEL | QDR SRAM | 1.9 V | 1.7 V | 15 mm | 13 mm | 无 | |||||||||||||||||||||||||||||||||||||
![]() | GS881E36CGT-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | 222.2@Flow-Through/333@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | -40 to 85 °C | Tray | GS881E36CGT | DCD Pipeline/Flow Through | 85 °C | -40 °C | Memory & Data Storage | 9 Mbit | 4 | 200 mA, 260 mA | 4.5 ns | Flow-Through/Pipelined | 256 k x 36 | 18 Bit | SRAM | 9 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T09BGD-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 1.8000 V | Synchronous | 2 MWords | 9 Bit | 表面贴装 | Compliant | Industrial grade | 375 MHz | FBGA | DDR | -40 to 85 °C | 85 °C | -40 °C | 1.8 V | 1 | Pipelined | 20 b | 18 Mbit | Industrial | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T36BGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 333 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | Details | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8662T36BGD-333I | 333 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.2 | BGA | Industrial grade | -40 to 100 °C | Tray | GS8662T36BGD | e1 | 有 | 3A991.B.2.B | SigmaDDR-II B2 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | PIPELINED ARCHITECTURE, LATE WRITE | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 72 Mbit | 1 | SYNCHRONOUS | 695 mA | Pipelined | 2 M x 36 | 3-STATE | 1.4 mm | 36 | 21 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||
![]() | GS8642Z72C-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | Commercial grade | 166.6@Flow-Through/250@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 72 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 70 C | 2.7 V | 0 C | 14 | 1.7 V | 0 to 70 °C | Tray | GS8642Z72C | NBT Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 72 Mbit | 8 | 330 mA, 460 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 72 | 20 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T37BGD-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 2 MWords | 36 Bit | 表面贴装 | Compliant | 350 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 350 MHz | FBGA | DDR | 1.8000 V | Synchronous | 0 to 85 °C | Bulk | GS8662T37BGD | 85 °C | 0 °C | 1.8 V | 72 Mbit | 1 | 755 mA | Pipelined | 2 M x 36 | 20 b | 72 Mbit | Commercial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88218CGB-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 222.2@Flow-Through/333@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 42 | 2.3 V | 0 to 70 °C | Tray | GS88218CGB | Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 9 Mbit | 2 | 165 mA, 220 mA | 4.5 ns | Flow-Through/Pipelined | 512 k x 18 | 18 Bit | SRAM | 9 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302S08E-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | N | DDR-II | Commercial grade | 300 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302S08E | SigmaSIO DDR-II | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 815 mA | Pipelined | 16 M x 8 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182D08BD-375M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | Compliant | Military grade | 375 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 375 MHz | + 125 C | 1.9 V | - 55 C | 18 | 1.7 V | -55 to 125 °C | Tray | GS8182D08BD | SigmaQuad-II | 125 °C | -55 °C | Memory & Data Storage | 1.8 V | 18 Mbit | 2 | 730 mA | Pipelined | 2 M x 8 | 19 Bit | SRAM | 18 Mbit | Military | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T08BGD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 70 °C | 0 °C | 1.8 V | 1 | 20 b | 18 Mb | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832136AGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 400 MHz | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | Industrial grade | 250@Flow-Through/400@Pipelined MHz | -40 to 100 °C | Bulk | GS832136AGD | 100 °C | -40 °C | 36 Mbit | 4 | 305 mA, 415 mA | 4 ns | Flow-Through/Pipelined | 1 M x 36 | 20 Bit | 36 Mbit | Industrial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832218AB-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 375 MHz | + 85 C | 3.6 V | - 40 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | BGA, BGA119,7X17,50 | 网格排列 | 2000000 | PLASTIC/EPOXY | BGA119,7X17,50 | -40 °C | 未说明 | 4.2 ns | 85 °C | 无 | GS832218AB-375I | 375 MHz | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.11 | BGA | Industrial grade | 238@Flow-Through/375@Pipelined MHz | FBGA | -40 to 100 °C | Tray | GS832218AB | e0 | 无 | 3A991.B.2.B | Pipeline/Flow Through | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 270 mA, 370 mA | 4.2 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.99 mm | 18 | 21 Bit | SRAM | 36 Mb | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | |||||||||
![]() | GS8322Z18AB-333IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | GSI技术 | RECTANGULAR | BGA | 1.8 V | 2097152 words | 333 MHz | GS8322Z18AB-333IV | 无 | 85 °C | 5 ns | -40 °C | BGA119,7X17,50 | PLASTIC/EPOXY | 2000000 | 网格排列 | BGA, BGA119,7X17,50 | 333 MHz | + 85 C | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | 200@Flow-Through/333@Pipelined MHz | FBGA | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 18 Bit | 2, 2.7 V | BGA | 5.27 | GSI TECHNOLOGY | 活跃 | -40 to 100 °C | GS8322Z18AB | 3A991.B.2.B | ALSO OPERATED WITH 2.5V SUPPLY; PIPELINE/FLOW THROUGH ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | 1.8/2.5 V | INDUSTRIAL | 36 Mbit | SYNCHRONOUS | 0.275 mA | 5@Flow-Through/3@Pip | 2MX18 | 3-STATE | 1.99 mm | 18 | 0.04 A | 36 | PARALLEL | COMMON | ZBT SRAM | 1.7 V | 2 V | 1.7 V | 22 mm | 14 mm | |||||||||||||||||||||||||||||||
![]() | GS88136CGT-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 256000 | UNSPECIFIED | 未说明 | 70 °C | 有 | GS88136CGT-333 | 3.3 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.28 | QFP | Commercial grade | 222.2@Flow-Through/333@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | 0 to 70 °C | Tray | GS88136CGT | 3A991.B.2.B | Pipeline/Flow Through | ALSO OPERATES WITH 2.3V TO 2.7V SUPPLY, FLOW THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-XQFP-G100 | 不合格 | COMMERCIAL | 9 Mbit | 1 | SYNCHRONOUS | 180 mA, 240 mA | 4.5 ns | Flow-Through/Pipelined | 256 k x 36 | 1.6 mm | 36 | 17 Bit | SRAM | 9 Mbit | 9437184 bit | Commercial | SERIAL | 缓存SRAM | 3.6 V | 3 V | SRAM | 20 mm | 14 mm |
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