品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8662DT20BD-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | DDR | Commercial grade | 350 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662DT20BD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 2 | 695 mA | Pipelined | 4 M x 18 | 20 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS864036GT-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 153.8@Flow-Through/250@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 250 MHz | + 70 C | 3.6 V | 0 C | 18 | 2.3 V | 0 to 70 °C | Tray | GS864036GT | Pipeline/Flow Through | Memory & Data Storage | 72 Mbit | 4 | 255 mA, 360 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 36 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161E18DD-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | SyncBurst | SDR | Industrial grade | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 375 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | -40 to 85 °C | Tray | GS8161E18DD | DCD Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 2 | 270 mA, 340 mA | 4.2 ns | Flow-Through/Pipelined | 1 M x 18 | SRAM | 18 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342DT38BGD-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Commercial grade | 500 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8342DT38BGD | SigmaQuad-II+ | Memory & Data Storage | 36 Mbit | 2 | 1.115 A | Pipelined | 1 M x 36 | 18 Bit | SRAM | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662Q19BGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 333 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 333 MHz | FBGA | QDR | 0 to 85 °C | 72 Mbit | 2 | 920 mA | Pipelined | 4 M x 18 | 21 Bit | 72 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS864436E-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | SyncBurst | SDR | GSI技术 | GSI技术 | Industrial grade | 153.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 15 | 2.3 V | SMD/SMT | -40 to 85 °C | Tray | GS864436E | 同步突发 | Memory & Data Storage | 72 Mbit | 4 | 295 mA, 435 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 36 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS864218GB-167IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | 125@Flow-Through/167@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 4 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 167 MHz | + 85 C | 2.7 V | - 40 C | 14 | 1.7 V | -40 to 85 °C | Tray | GS864218GB | SCD/DCD Pipeline/Flow Through | Memory & Data Storage | 72 Mbit | 2 | 215 mA, 260 mA | 8 ns | Flow-Through/Pipelined | 4 M x 18 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161Z36DGD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 250@Flow-Through/400@Pipelined MHz | FBGA | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 400 MHz | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | GSI技术 | NBT SRAM | Details | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | 未说明 | 70 °C | 有 | GS8161Z36DGD-400 | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.26 | BGA | Commercial grade | SDR | 36 | GSI技术 | 4 ns | 0 to 70 °C | Tray | GS8161Z36DGD | 3A991.B.2.B | NBT | FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | COMMERCIAL | 18 Mbit | 4 | SYNCHRONOUS | 280 mA, 365 mA | 4 ns | Flow-Through/Pipelined | 512 k x 36 | 1.4 mm | 36 | 19 Bit | SRAM | 18 Mbit | 18874368 bit | Commercial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | |||||||||||||||||||
![]() | GS81302Q07GE-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | Commercial grade | 0 to 85 °C | 2 | Pipelined | 23 Bit | 144 Mbit | Commercial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182R36BD-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 375 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 512 kWords | 36 Bit | 1.9 V | 表面贴装 | Commercial grade | 0 to 70 °C | 1 | Pipelined | 19 Bit | 18 Mbit | Commercial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321E32AGD-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 32 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 85 C | 2.7 V | - 40 C | 18 | 1.7 V | -40 to 100 °C | Tray | GS8321E32AGD | 同步突发 | Memory & Data Storage | 36 Mbit | 4 | 235 mA, 270 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 32 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88118CD-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | + 85 C | 2.7 V | - 40 C | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | LQFP, | 网格排列 | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 5.5 ns | 85 °C | 无 | GS88118CD-250IV | 524288 words | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.14 | BGA | 181.8@Flow-Through/250@Pipelined MHz | FBGA | 1.8, 2.5 V | 1.7, 2.3 V | 18 Bit | 2, 2.7 V | 有 | 250 MHz | -40 to 85 °C | Tray | GS88118CD | 3A991.B.2.B | 同步突发 | ALSO OPERATES AT 2.5V | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 9 Mbit | SYNCHRONOUS | 145 mA, 185 mA | 5.5@Flow-Through/3@P | 512 k x 18 | 1.4 mm | 8 | SRAM | 9 | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||||||||||||||||||||
![]() | GS8673EQ18BGK-625 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-260 | 260 | BGA | 1.3500 V | Synchronous | 18 Bit | 有 | 625 MHz | + 85 C | 1.4 V | 0 C | 8 | 1.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-IIIe | Details | QDR-III | 625/400 MHz | 0 to 70 °C | Tray | GS8673EQ18BGK | SigmaQuad-IIIe B2 | Memory & Data Storage | 72 Mbit | 2.11 A | 0.4 | 4 M x 18 | SRAM | 72 | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D06BD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | DDR | Industrial grade | 450 MHz | FBGA | QDR | 1.8000 V | Synchronous | 8 MWords | 8 Bit | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | -40 to 100 °C | Tray | GS8662D06BD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 2 | 830 mA | Pipelined | 8 M x 8 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT38E-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR-II | Industrial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS81302TT38E | SigmaDDR-II+ | Memory & Data Storage | 144 Mbit | 1 | 905 mA | Pipelined | 4 M x 36 | 21 Bit | SRAM | 144 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342T07BGD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | Industrial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8342T07BGD | SigmaDDR-II+ B2 | Memory & Data Storage | 36 Mbit | 1 | 575 mA | Pipelined | 4 M x 8 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T18BGD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 18 Bit | 表面贴装 | 1.9 V | Commercial grade | 0 to 70 °C | 1 | Pipelined | 20 Bit | 18 Mbit | Commercial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8640FZ36GT-7.5 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | 3 V | Synchronous | 2 MWords | 36 Bit | 3.6 V | 表面贴装 | 有 | + 70 C | 3.6 V | 0 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | 未说明 | 7.5 ns | 70 °C | 有 | GS8640FZ36GT-7.5 | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | QFP | Commercial grade | 133.3 MHz | TQFP | SDR | 3.3000 V | 0 to 70 °C | Tray | GS8640FZ36GT | e3 | 有 | 3A991.B.2.B | NBT Flow Through | Matte Tin (Sn) | 70 °C | 0 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY. | 8542.32.00.41 | Memory & Data Storage | CMOS | 3.3 V | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | COMMERCIAL | 72 Mbit | 4 | SYNCHRONOUS | 230 mA | 7.5 ns | Flow-Through | 2 M x 36 | 1.6 mm | 36 | 21 Bit | SRAM | 72 Mbit | 75497472 bit | Commercial | PARALLEL | ZBT SRAM | 2.75 V | 2.25 V | SRAM | 20 mm | 14 mm | 无 | |||||||||||
![]() | GS8320Z18AGT-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Industrial grade | 400 MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 400 MHz | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | -40 to 85 °C | Tray | GS8320Z18AGT | NBT Pipeline/Flow Through | Memory & Data Storage | 36 Mbit | 2 | 285 mA, 375 mA | 4 ns | Flow-Through/Pipelined | 2 M x 18 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161Z18DGD-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Industrial grade | 238@Flow-Through/375@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 375 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | -40 to 85 °C | Tray | GS8161Z18DGD | NBT | 85 °C | -40 °C | Memory & Data Storage | 18 Mbit | 2 | 270 mA, 340 mA | 4.2 ns | Flow-Through/Pipelined | 1 M x 18 | 20 Bit | SRAM | 18 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832236AGD-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | 133@Flow-Through/150@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 85 C | 2.7 V | - 40 C | 18 | 1.7 V | -40 to 100 °C | Tray | GS832236AGD | Pipeline/Flow Through | 100 °C | -40 °C | Memory & Data Storage | 36 Mbit | 4 | 220 mA, 230 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 36 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321E18AGD-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.7, 2.3 V | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 70 C | 2.7 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | 未说明 | 6.5 ns | 85 °C | 有 | GS8321E18AGD-200V | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.38 | BGA | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 0 to 85 °C | Tray | GS8321E18AGD | 3A991.B.2.B | 同步突发 | 85 °C | 0 °C | ALSO OPERATES AT 2.5 V SUPPLY; PIPELINE MODE | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | OTHER | 36 Mbit | 2 | SYNCHRONOUS | 195 mA, 230 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 18 | 1.4 mm | 18 | 21 Bit | SRAM | 36 Mbit | 37748736 bit | Commercial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||||||
![]() | GS832218AGB-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | 222@Flow-Through/333@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 85 C | 3.6 V | - 40 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | BGA, BGA119,7X17,50 | 网格排列 | 3 | 2000000 | PLASTIC/EPOXY | BGA119,7X17,50 | -40 °C | 未说明 | 4.5 ns | 85 °C | 有 | GS832218AGB-333I | 333 MHz | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.11 | BGA | Industrial grade | -40 to 100 °C | Tray | GS832218AGB | e1 | 有 | 3A991.B.2.B | Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 255 mA, 340 mA | 4.5 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.99 mm | 18 | 21 Bit | SRAM | 36 Mbit | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | 无 | |||
![]() | GS8662D38BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Industrial grade | 400 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8662D38BGD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 2 | 950 mA | Pipelined | 2 M x 36 | 19 Bit | SRAM | 72 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8640Z18GT-167V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Commercial grade | 125@Flow-Through/167@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 4 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 167 MHz | + 70 C | 2.7 V | 0 C | 18 | 1.7 V | 0 to 70 °C | Tray | GS8640Z18GT | NBT Pipeline/Flow Through | Memory & Data Storage | 72 Mbit | 2 | 195 mA, 240 mA | 8 ns | Flow-Through/Pipelined | 4 M x 18 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM |
GS8662DT20BD-350
GSI Technology
分类:Memory
GS864036GT-250
GSI Technology
分类:Memory
GS8161E18DD-375I
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