品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | GS8662DT38BGD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Commercial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662DT38BGD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 2 | 1.055 A | Pipelined | 2 M x 36 | 19 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832236AD-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | SDR | SyncBurst | GSI技术 | GSI技术 | Parallel | SMD/SMT | 1.7 V | 18 | - 40 C | 2.7 V | + 85 C | 250 MHz | 有 | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 5.5 ns | 85 °C | 无 | GS832236AD-250IV | 250 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.12 | BGA | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | -40 to 100 °C | Tray | GS832236AD | e0 | 无 | 3A991.B.2.B | Pipeline/Flow Through | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 2.5V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.8/2.5 V | INDUSTRIAL | 36 Mbit | 4 | SYNCHRONOUS | 260 mA, 315 mA | 5.5 ns | Flow-Through/Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 20 Bit | SRAM | 36 Mbit | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | 缓存SRAM | 1.7 V | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||
![]() | GS881E36CGT-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | 153.8@Flow-Through/200@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 85 C | 2.7 V | - 40 C | 66 | 1.7 V | -40 to 85 °C | Tray | GS881E36CGT | DCD Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 4 | 145 mA, 170 mA | 6.5 ns | Flow-Through/Pipelined | 256 k x 36 | 18 Bit | SRAM | 9 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT20E-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR-II | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302TT20E | SigmaDDR-II+ | Memory & Data Storage | 144 Mbit | 1 | 895 mA | Pipelined | 8 M x 18 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662TT19BGD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | Commercial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662TT19BGD | SigmaDDR-II+ B2 | Memory & Data Storage | 72 Mbit | 1 | 695 mA | Pipelined | 4 M x 18 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS880Z18CGT-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 85 C | 2.7 V | GSI技术 | NBT SRAM | Details | SDR | GSI技术 | Parallel | SMD/SMT | 1.7 V | 66 | - 40 C | LQFP, | FLATPACK, LOW PROFILE | 512000 | UNSPECIFIED | -40 °C | 未说明 | 85 °C | 有 | GS880Z18CGT-150IV | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | QFP | Industrial grade | 133.3@Flow-Through/150@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | -40 to 85 °C | Tray | GS880Z18CGT | 3A991.B.2.B | NBT | PIPELINED ARCHITECTURE, FLOW-THROUGH, IT ALSO OPERATES WITH 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-XQFP-G100 | 不合格 | INDUSTRIAL | 9 Mbit | 1 | SYNCHRONOUS | 125 mA, 135 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 18 | 1.6 mm | 18 | 18 Bit | SRAM | 9 Mbit | 9437184 bit | Industrial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 20 mm | 14 mm | ||||||||||||||
![]() | GS8642Z72C-167IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-209 | YES | 209 | 209 | 1.7, 2.3 V | Synchronous | 1 MWords | 72 Bit | 2, 2.7 V | 表面贴装 | 有 | 167 MHz | + 85 C | 2.7 V | - 40 C | 14 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 8 ns | 85 °C | 无 | GS8642Z72C-167IV | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.18 | BGA | Industrial grade | 125@Flow-Through/167@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | -40 to 85 °C | Tray | GS8642Z72C | 无 | 3A991.B.2.B | NBT Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B209 | 不合格 | INDUSTRIAL | 72 Mbit | 8 | SYNCHRONOUS | 280 mA, 360 mA | 8 ns | Flow-Through/Pipelined | 1 M x 72 | 1.7 mm | 72 | 20 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 22 mm | 14 mm | |||||||||||||
![]() | GS881Z18CD-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Industrial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 85 C | 2.7 V | - 40 C | 66 | 1.7 V | SMD/SMT | -40 to 85 °C | Tray | GS881Z18CD | NBT | Memory & Data Storage | 9 Mbit | 1 | 125 mA, 135 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 18 | 18 Bit | SRAM | 9 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832132AD-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1 MWords | 32 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 70 C | 2.7 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 未说明 | 6.5 ns | 85 °C | 无 | GS832132AD-200V | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.3 | BGA | Commercial grade | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 0 to 85 °C | Tray | GS832132AD | 3A991.B.2.B | 同步突发 | PIPELINE OR FLOW THROUGH ARCHITECTURE; ALSO OPERATES AT 2.5 SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | OTHER | 36 Mbit | 4 | SYNCHRONOUS | 215 mA, 250 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 32 | 1.4 mm | 32 | SRAM | 36 Mbit | 33554432 bit | Commercial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||||||||||
![]() | GS816273CGC-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | 333 MHz | BGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 85 C | 3.6 V | - 40 C | 21 | 2.3 V | -40 to 85 °C | Tray | GS816273CGC | Pipeline | Memory & Data Storage | 18 Mbit | 8 | 470 mA | 4.5 ns | Pipelined | 256 k x 72 | 18 Bit | SRAM | 18 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342DT06BD-550 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 550 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 85 °C | 无 | GS8342DT06BD-550 | 550 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.35 | BGA | Commercial grade | 550 MHz | FBGA | 0 to 85 °C | Tray | GS8342DT06BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II+ | Tin/Lead (Sn/Pb) | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | OTHER | 36 Mbit | 2 | SYNCHRONOUS | 940 mA | Pipelined | 4 M x 8 | 3-STATE | 1.4 mm | 8 | 20 Bit | SRAM | 36 Mbit | 33554432 bit | Commercial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||
![]() | GS81302S18E-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR-II | Industrial grade | 250 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 250 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS81302S18E | SigmaSIO DDR-II | Memory & Data Storage | 144 Mbit | 2 | 710 mA | Pipelined | 8 M x 18 | 22 Bit | SRAM | 144 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8644Z36E-133I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 133 MHz | + 85 C | 3.6 V | - 40 C | 15 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | BGA, BGA165,11X15,40 | 网格排列 | 3 | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 8.5 ns | 85 °C | 无 | GS8644Z36E-133I | 133 MHz | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.15 | BGA | Industrial grade | 117.6@Flow-Through/133@Pipelined MHz | -40 to 85 °C | Tray | GS8644Z36E | 无 | 3A991.B.2.B | NBT | ALSO OPERATES AT 3.3V SUPPLY; PIPELINED OR FLOW-THROUGH ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 72 Mbit | 4 | SYNCHRONOUS | 255 mA, 305 mA | 8.5 ns | Flow-Through/Pipelined | 2 M x 36 | 3-STATE | 1.5 mm | 36 | 21 Bit | SRAM | 72 Mbit | 0.16 A | 75497472 bit | Industrial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 17 mm | 15 mm | |||||
![]() | GS8662D09BGD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | DDR | Industrial grade | 350 MHz | FBGA | QDR | 1.8000 V | 1.7 V | 表面贴装 | 1.9 V | 9 Bit | 8 MWords | Synchronous | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8662D09BGD | SigmaQuad-II | Memory & Data Storage | 72 Mbit | 2 | 705 mA | Pipelined | 8 M x 9 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS880E18CGT-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 70 C | 2.7 V | 0 C | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | QFP100,.63X.87 | 未说明 | 5.5 ns | 70 °C | 有 | GS880E18CGT-250V | 250 MHz | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | QFP | Commercial grade | 181.5@Flow-Through/250@Pipelined MHz | 0 to 70 °C | Tray | GS880E18CGT | e3 | 有 | 3A991.B.2.B | DCD | 纯哑光锡 | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 1.8/2.5 V | COMMERCIAL | 9 Mbit | 2 | SYNCHRONOUS | 125 mA, 165 mA | 5.5 ns | Flow-Through/Pipelined | 512 k x 18 | 3-STATE | 1.6 mm | 18 | 18 Bit | SRAM | 9 Mbit | 0.025 A | 9437184 bit | Commercial | PARALLEL | COMMON | 缓存SRAM | 1.7 V | 2 V | 1.7 V | SRAM | 20 mm | 14 mm | |||
![]() | GS8162Z72CC-150I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-209 | YES | 209 | 209 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 150 MHz | + 85 C | 3.6 V | - 40 C | 21 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | -40 °C | 未说明 | 7.5 ns | 85 °C | 无 | GS8162Z72CC-150I | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.17 | BGA | Industrial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | -40 to 85 °C | Tray | GS8162Z72CC | 无 | 3A991.B.2.B | NBT Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B209 | 不合格 | INDUSTRIAL | 18 Mbit | 8 | SYNCHRONOUS | 220 mA, 240 mA | 7.5 ns | Flow-Through/Pipelined | 256 k x 72 | 1.7 mm | 72 | 18 Bit | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | ||||||||||||
![]() | GS8342DT07BD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | DDR | Commercial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8342DT07BD | SigmaQuad-II+ B4 | Memory & Data Storage | 36 Mbit | 2 | 785 mA | Pipelined | 4 M x 8 | 20 Bit | SRAM | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832272C-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-209 | YES | 209 | 209 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 250 MHz | + 70 C | 3.6 V | 0 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | LBGA, BGA209,11X19,40 | GRID ARRAY, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | BGA209,11X19,40 | 未说明 | 6.5 ns | 70 °C | 无 | GS832272C-250 | 250 MHz | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.14 | BGA | Commercial grade | FBGA | SDR | 0 to 70 °C | Tray | GS832272C | 无 | 3A991.B.2.B | SCD/DCD Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B209 | 不合格 | 2.5/3.3 V | COMMERCIAL | 36 Mbit | 8 | SYNCHRONOUS | 275 mA, 380 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 72 | 3-STATE | 1.7 mm | 72 | SRAM | 36 Mbit | 0.06 A | 37748736 bit | Commercial | PARALLEL | COMMON | 缓存SRAM | 2.38 V | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | |||||||
![]() | GS8662QT37BGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 333 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | Commercial grade | 0 to 85 °C | 2 | Pipelined | 20 Bit | 72 Mbit | Commercial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321E18AD-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 375 MHz | + 70 C | 3.6 V | 0 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 4.2 ns | 85 °C | 无 | GS8321E18AD-375 | 375 MHz | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | BGA | 5.31 | Commercial grade | 238@Flow-Through/375@Pipelined MHz | FBGA | 0 to 85 °C | Tray | GS8321E18AD | e0 | 无 | 3A991.B.2.B | DCD Pipeline/Flow Through | 锡铅 | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | OTHER | 36 Mbit | 2 | SYNCHRONOUS | 250 mA, 350 mA | 4.2 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 21 Bit | SRAM | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | |||||
![]() | GS8342DT11BD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Industrial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS8342DT11BD | SigmaQuad-II+ | Memory & Data Storage | 36 Mbit | 2 | 795 mA | Pipelined | 4 M x 9 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662QT10BGD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Commercial grade | 表面贴装 | 1.9 V | 9 Bit | 8 MWords | Synchronous | 1.7 V | 1.8000 V | QDR | FBGA | 300 MHz | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662QT10BGD | SigmaQuad-II+ B2 | Memory & Data Storage | 72 Mbit | 2 | 850 mA | Pipelined | 8 M x 9 | 22 Bit | SRAM | 72 Mb | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D06BD-550I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 550 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 0.45 ns | 85 °C | 无 | GS8342D06BD-550I | 550 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | BGA | Industrial grade | 550 MHz | FBGA | QDR | -40 to 100 °C | Tray | GS8342D06BD | 3A991.B.2.B | SigmaQuad-II+ | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 950 mA | Pipelined | 4 M x 8 | 3-STATE | 1.4 mm | 8 | 20 Bit | SRAM | 36 Mbit | 0.275 A | 33554432 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||||
![]() | GS8662Q07BD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 8 Bit | 表面贴装 | 有 | 250 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 无 | GS8662Q07BD-250 | 250 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.49 | BGA | Commercial grade | 250 MHz | QDR | 1.8000 V | Synchronous | 8 MWords | 0 to 85 °C | Tray | GS8662Q07BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II+ B2 | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 72 Mbit | 2 | SYNCHRONOUS | 720 mA | Pipelined | 8 M x 8 | 3-STATE | 1.4 mm | 8 | 22 Bit | SRAM | 72 Mbit | 0.24 A | 67108864 bit | Commercial | PARALLEL | SEPARATE | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||
![]() | GS8640FZ36GT-5.5 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | 36 Bit | 表面贴装 | 有 | + 70 C | 3.6 V | 0 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | 未说明 | 5.5 ns | 70 °C | 有 | GS8640FZ36GT-5.5 | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.6 | QFP | Commercial grade | 181.8 MHz | TQFP | SDR | 3.3000 V | Synchronous | 2 MWords | 0 to 70 °C | Tray | GS8640FZ36GT | e3 | 有 | 3A991.B.2.B | NBT Flow Through | Matte Tin (Sn) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY. | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | COMMERCIAL | 72 Mbit | 4 | SYNCHRONOUS | 300 mA | 5.5 ns | Flow-Through | 2 M x 36 | 1.6 mm | 36 | 21 Bit | SRAM | 72 Mbit | 75497472 bit | Commercial | PARALLEL | ZBT SRAM | 2.75 V | 2.25 V | SRAM | 20 mm | 14 mm |
GS8662DT38BGD-450
GSI Technology
分类:Memory
GS832236AD-250IV
GSI Technology
分类:Memory
GS881E36CGT-200IV
GSI Technology
分类:Memory
GS81302TT20E-400
GSI Technology
分类:Memory
GS8662TT19BGD-450
GSI Technology
分类:Memory
GS880Z18CGT-150IV
GSI Technology
分类:Memory
GS8642Z72C-167IV
GSI Technology
分类:Memory
GS881Z18CD-150IV
GSI Technology
分类:Memory
GS832132AD-200V
GSI Technology
分类:Memory
GS816273CGC-333I
GSI Technology
分类:Memory
GS8342DT06BD-550
GSI Technology
分类:Memory
GS81302S18E-250I
GSI Technology
分类:Memory
GS8644Z36E-133I
GSI Technology
分类:Memory
GS8662D09BGD-350I
GSI Technology
分类:Memory
GS880E18CGT-250V
GSI Technology
分类:Memory
GS8162Z72CC-150I
GSI Technology
分类:Memory
GS8342DT07BD-450
GSI Technology
分类:Memory
GS832272C-250
GSI Technology
分类:Memory
GS8662QT37BGD-333
GSI Technology
分类:Memory
GS8321E18AD-375
GSI Technology
分类:Memory
GS8342DT11BD-450I
GSI Technology
分类:Memory
GS8662QT10BGD-300
GSI Technology
分类:Memory
GS8342D06BD-550I
GSI Technology
分类:Memory
GS8662Q07BD-250
GSI Technology
分类:Memory
GS8640FZ36GT-5.5
GSI Technology
分类:Memory
