品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8342T11BD-550I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 550 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8342T11BD-550I | 550 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.35 | BGA | Industrial grade | 550 MHz | FBGA | -40 to 100 °C | Tray | GS8342T11BD | e0 | 3A991.B.2.B | SigmaQuad-II+ | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 1 | SYNCHRONOUS | 810 mA | Pipelined | 4 M x 9 | 3-STATE | 1.4 mm | 9 | 21 Bit | SRAM | 36 Mbit | 0.265 A | 37748736 bit | Industrial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||
![]() | GS8322Z72C-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | Commercial grade | 117.6@Flow-Through/150@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 150 MHz | + 70 C | 3.6 V | 0 C | 14 | 2.3 V | 0 to 70 °C | Tray | GS8322Z72C | NBT Pipeline/Flow Through | Memory & Data Storage | 36 Mbit | 8 | 210 mA, 260 mA | 8.5 ns | Flow-Through/Pipelined | 512 k x 72 | 19 Bit | SRAM | 36 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302Q10GE-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | Commercial grade | 250 MHz | FBGA | QDR | 表面贴装 | 1.9 V | 9 Bit | 16 MWords | Synchronous | 1.7 V | 1.8000 V | 有 | 250 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302Q10GE | SigmaQuad-II+ B2 | Memory & Data Storage | 144 Mbit | 2 | 1.06 A | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302Q19E-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | 165 | 1.9 V | 有 | 200 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | LBGA, | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | BGA | 5.33 | GSI TECHNOLOGY | 不推荐 | RECTANGULAR | LBGA | 1.8 V | GS81302Q19E-200I | 无 | 85 °C | 200 MHz | FBGA | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | -40 to 100 °C | Tray | GS81302Q19E | 无 | 3A991.B.2.B | SigmaQuad-II+ B2 | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 144 Mbit | SYNCHRONOUS | 885 mA | 0.45 | 8 M x 18 | 1.5 mm | 18 | SRAM | 144 | PARALLEL | QDR SRAM | 1.9 V | 1.7 V | SRAM | 17 mm | 15 mm | |||||||||||||||||||||
![]() | GS8662TT38BD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8662TT38BD-350I | 350 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.19 | BGA | Industrial grade | 350 MHz | FBGA | -40 to 100 °C | Tray | GS8662TT38BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II+ | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 72 Mbit | 1 | SYNCHRONOUS | 765 mA | Pipelined | 2 M x 36 | 3-STATE | 1.4 mm | 36 | 20 Bit | SRAM | 72 Mbit | 0.25 A | 75497472 bit | Industrial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||
![]() | GS832032AGT-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 32 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 18 | 2.3 V | SMD/SMT | Parallel | 0 to 85 °C | Tray | GS832032AGT | Pipeline/Flow Through | Memory & Data Storage | 36 Mbit | 4 | 260 mA, 345 mA | 4.5 ns | Flow-Through/Pipelined | 1 M x 32 | 20 Bit | SRAM | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT19E-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR-II | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302TT19E | SigmaDDR-II+ B2 | Memory & Data Storage | 144 Mbit | 1 | 895 mA | Pipelined | 8 M x 18 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D10BGD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Commercial grade | 400 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8342D10BGD | SigmaQuad-II+ B4 | Memory & Data Storage | 36 Mbit | 2 | 705 mA | Pipelined | 4 M x 9 | 20 Bit | SRAM | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z72C-133IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-209 | YES | 209 | 209 | 512 kWords | 72 Bit | 2, 2.7 V | 表面贴装 | 有 | 133 MHz | + 85 C | 2.7 V | - 40 C | 14 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 8.5 ns | 85 °C | 无 | GS8322Z72C-133IV | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.14 | BGA | Industrial grade | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | -40 to 85 °C | Tray | GS8322Z72C | 无 | 3A991.B.2.B | NBT | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B209 | 不合格 | INDUSTRIAL | 36 Mbit | 8 | SYNCHRONOUS | 220 mA, 255 mA | 8.5 ns | Flow-Through/Pipelined | 512 k x 72 | 1.7 mm | 72 | SRAM | 36 Mbit | 37748736 bit | Industrial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 22 mm | 14 mm | |||||||||||||||
![]() | GS8342T38BGD-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | Commercial grade | 500 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8342T38BGD | SigmaQuad-II+ | Memory & Data Storage | 36 Mbit | 1 | 945 mA | Pipelined | 1 M x 36 | 19 Bit | SRAM | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88218CB-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 70 C | 2.7 V | 0 C | 42 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | BGA, | 网格排列 | 512000 | PLASTIC/EPOXY | 未说明 | 6.5 ns | 70 °C | 无 | GS88218CB-200V | 1.8 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.13 | BGA | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 0 to 70 °C | Tray | GS88218CB | e0 | 无 | 3A991.B.2.B | SCD/DCD Pipeline/Flow Through | Tin/Lead (Sn/Pb) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | COMMERCIAL | 9 Mbit | 2 | SYNCHRONOUS | 115 mA, 140 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 18 | 1.77 mm | 18 | 18 Bit | SRAM | 9 Mbit | 9437184 bit | Commercial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 22 mm | 14 mm | |||||||||||
![]() | GS8162Z72CGC-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 21 | 2.3 V | -40 to 85 °C | Tray | GS8162Z72CGC | NBT Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 8 | 275 mA, 360 mA | 5.5 ns | Flow-Through/Pipelined | 256 k x 72 | 18 Bit | SRAM | 18 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8128436GB-167V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | YES | 119 | 119 | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 4 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 167 MHz | + 70 C | 3.6 V | 0 C | 10 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | BGA, | 网格排列 | 3 | 4000000 | PLASTIC/EPOXY | 未说明 | 8 ns | 70 °C | 有 | GS8128436GB-167V | 1.8 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.34 | BGA | Commercial grade | 167 MHz | FBGA | 0 to 70 °C | Tray | GS8128436GB | e1 | 有 | 3A991.B.2.B | SCD/DCD Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINE AND FLOW THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 2.3V TO 2.7V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | COMMERCIAL | 144 Mbit | 4 | SYNCHRONOUS | 340 mA, 395 mA | 8 ns | Flow-Through/Pipelined | 4 M x 36 | 1.99 mm | 36 | 22 Bit | SRAM | 144 Mbit | 150994944 bit | Commercial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 22 mm | 14 mm | |||||||||||
![]() | GS8342DT10BGD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Commercial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8342DT10BGD | SigmaQuad-II+ B4 | Memory & Data Storage | 36 Mbit | 2 | 785 mA | Pipelined | 4 M x 9 | 20 Bit | SRAM | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T08BD-375M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 8 Bit | 表面贴装 | Military grade | 375 MHz | FBGA | DDR | 1.8000 V | Synchronous | 2 MWords | Pipelined | 21 Bit | 18 Mbit | Military | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88237CB-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 333 MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 85 C | 3.6 V | - 40 C | 42 | 2.3 V | SMD/SMT | -40 to 85 °C | Tray | GS88237CB | SCD/DCD Pipeline | Memory & Data Storage | 9 Mbit | 2 | 260 mA | Pipelined | 256 k x 36 | 18 Bit | SRAM | 9 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182D19BGD-435I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 435 MHz | FBGA | SDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 435 MHz | + 85 C | 1.9 V | - 40 C | 18 | 1.7 V | SigmaQuad-II+ | Details | DDR | SMD/SMT | Parallel | GSI技术 | GSI技术 | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8182D19BGD-435I | 435 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.21 | BGA | Industrial grade | -40 to 85 °C | Tray | GS8182D19BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad II+ | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 18 Mbit | 2 | SYNCHRONOUS | 780 mA | Pipelined | 1 M x 18 | 3-STATE | 1.4 mm | 18 | 18 Bit | SRAM | 18 Mbit | 0.2 A | 18874368 bit | Industrial | PARALLEL | SEPARATE | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 10 mm | |||
![]() | GS8662D38BGD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 表面贴装 | 450 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | 有 | GS8662D38BGD-450 | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.48 | BGA | Commercial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 0 to 85 °C | GS8662D38BGD | e1 | 有 | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 8542.32.00.41 | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 72 Mbit | 2 | SYNCHRONOUS | 1.055 A | Pipelined | 2 M x 36 | 1.4 mm | 36 | 19 Bit | 72 Mbit | 75497472 bit | Commercial | PARALLEL | QDR SRAM | 1.9 V | 1.7 V | 15 mm | 13 mm | ||||||||||||||||||||||
![]() | GS88236CB-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 85 C | 2.7 V | - 40 C | 42 | 1.7 V | SMD/SMT | -40 to 85 °C | Tray | GS88236CB | SCD/DCD Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 4 | 130 mA, 145 mA | 7.5 ns | Flow-Through/Pipelined | 256 k x 36 | 18 Bit | SRAM | 9 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT07GE-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | Commercial grade | 表面贴装 | 1.9 V | 8 Bit | 16 MWords | Synchronous | 1.7 V | 1.8000 V | DDR | FBGA | 400 MHz | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302TT07GE | SigmaDDR-II+ B2 | Memory & Data Storage | 144 Mbit | 1 | 895 mA | Pipelined | 16 M x 8 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662TT11BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaDDR-II+ | Details | DDR | Industrial grade | 400 MHz | FBGA | DDR | 1.8000 V | Synchronous | 8 MWords | 9 Bit | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | -40 to 100 °C | Tray | GS8662TT11BGD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 1 | 635 mA | Pipelined | 8 M x 9 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D06BGD-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8662D06BGD-500I | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.23 | BGA | Industrial grade | 500 MHz | FBGA | QDR | -40 to 100 °C | Tray | GS8662D06BGD | 3A991.B.2.B | SigmaQuad-II+ | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 72 Mbit | 2 | SYNCHRONOUS | 900 mA | Pipelined | 8 M x 8 | 1.4 mm | 8 | 21 Bit | SRAM | 72 Mbit | 67108864 bit | Industrial | PARALLEL | QDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||||||||
![]() | GS81302D38E-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | Industrial grade | 350 MHz | FBGA | QDR | 1.8000 V | Synchronous | 4 MWords | 36 Bit | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | QDR-II | SigmaQuad-II+ | GSI技术 | -40 to 100 °C | Tray | GS81302D38E | SigmaQuad-II+ | Memory & Data Storage | 144 Mbit | 2 | 1.18 A | Pipelined | 4 M x 36 | 20 Bit | SRAM | 144 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662TT19BD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR | Commercial grade | 300 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662TT19BD | SigmaDDR-II+ B2 | Memory & Data Storage | 72 Mbit | 1 | 495 mA | Pipelined | 4 M x 18 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT07E-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | Industrial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS81302DT07E | SigmaQuad-II+ B4 | Memory & Data Storage | 144 Mbit | 2 | 1.185 A | Pipelined | 16 M x 8 | 22 Bit | SRAM | 144 Mbit | Industrial | SRAM |
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