品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8662DT11BGD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Industrial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8662DT11BGD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 2 | 830 mA | Pipelined | 8 M x 9 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342TT10BD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | DDR | Industrial grade | 450 MHz | FBGA | DDR | 1.8000 V | Synchronous | 4 MWords | 9 Bit | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | -40 to 100 °C | Tray | GS8342TT10BD | SigmaDDR-II+ B2 | Memory & Data Storage | 36 Mbit | 1 | 680 mA | Pipelined | 4 M x 9 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816272CC-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-209 | YES | 209 | 209 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | SDR | N | SyncBurst | GSI技术 | GSI技术 | Parallel | SMD/SMT | 2.3 V | 21 | 0 C | 3.6 V | + 70 C | 333 MHz | 有 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | 未说明 | 4.5 ns | 70 °C | 无 | GS816272CC-333 | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.16 | BGA | Commercial grade | 222.2@Flow-Through/333@Pipelined MHz | FBGA | SDR | 0 to 70 °C | Tray | GS816272CC | 无 | 3A991.B.2.B | Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B209 | 不合格 | COMMERCIAL | 18 Mbit | 8 | SYNCHRONOUS | 320 mA, 390 mA | 4.5 ns | Flow-Through/Pipelined | 256 k x 72 | 1.7 mm | 72 | 18 Bit | SRAM | 18 Mbit | 18874368 bit | Commercial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | ||||||||||||
![]() | GS8182R36BD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 165 | 165 | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.19 | BGA | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | Synchronous | 512 kWords | 36 Bit | 表面贴装 | LBGA, | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | 无 | GS8182R36BD-400 | 1.8 V | 0 to 70 °C | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | not_compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 1 | SYNCHRONOUS | Pipelined | 512KX36 | 1.4 mm | 36 | 19 Bit | 18 Mbit | 18874368 bit | Commercial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||||||
![]() | GS8662QT07BD-300M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Military grade | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 125 C | 1.9 V | - 55 C | 15 | 1.7 V | SMD/SMT | -55 to 125 °C | Tray | GS8662QT07BD | SigmaQuad-II+ B2 | Memory & Data Storage | 72 Mbit | 2 | Pipelined | 8 M x 8 | 22 Bit | SRAM | 72 Mbit | Military | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321E18AGD-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | - 40 C | 2.7 V | + 85 C | 200 MHz | 有 | Industrial grade | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | SDR | Details | SyncBurst | GSI技术 | GSI技术 | Parallel | SMD/SMT | 1.7 V | 18 | -40 to 100 °C | Tray | GS8321E18AGD | 同步突发 | Memory & Data Storage | 36 Mbit | 2 | 215 mA, 250 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 18 | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D07E-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | QDR-II | Commercial grade | 333 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302D07E | SigmaQuad-II+ B4 | Memory & Data Storage | 144 Mbit | 2 | 890 mA | Pipelined | 16 M x 8 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662TT11BD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8662TT11BD-350I | 350 MHz | 8388608 words | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.23 | BGA | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Tray | GS8662TT11BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II+ | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 72 Mbit | SYNCHRONOUS | 600 mA | 8 M x 9 | 3-STATE | 1.4 mm | 9 | SRAM | 0.24 A | 72 | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||||||||||||||
![]() | GS8662TT20BGD-550 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 550 MHz | 1.8000 V | 1.7 V | Synchronous | 18 Bit | 1.9 V | 有 | 550 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | DDR | Details | SigmaDDR-II+ | GSI技术 | GSI技术 | Parallel | 0 to 85 °C | Tray | GS8662TT20BGD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 830 mA | 0.45 | 4 M x 18 | SRAM | 72 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8162Z18DGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Industrial grade | 250@Flow-Through/400@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 400 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | -40 to 100 °C | Tray | GS8162Z18DGD | NBT Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 2 | 275 mA, 355 mA | 4 ns | Flow-Through/Pipelined | 1 M x 18 | 20 Bit | SRAM | 18 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT11GE-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302TT11GE | SigmaDDR-II+ | Memory & Data Storage | 144 Mbit | 1 | 895 mA | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D09BD-350M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 表面贴装 | 有 | 350 MHz | + 125 C | 1.9 V | - 55 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | -55 °C | 未说明 | 0.45 ns | 125 °C | 无 | GS8662D09BD-350M | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.79 | Military grade | 350 MHz | FBGA | QDR | 1.8000 V | Synchronous | 8 MWords | 9 Bit | Tray | GS8662D09BD | 3A991.B.2.B | SigmaQuad-II | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | MILITARY | 72 Mbit | SYNCHRONOUS | 845 mA | Pipelined | 8 M x 9 | 1.4 mm | 9 | 23 Bit | SRAM | 72 Mbit | 75497472 bit | Military | PARALLEL | QDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||||||||||||||||
![]() | GS832236AB-333V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 333 MHz | SDR | N | SyncBurst | GSI技术 | GSI技术 | Parallel | SMD/SMT | 1.7 V | 14 | 0 C | 2.7 V | + 70 C | BGA, BGA119,7X17,50 | 网格排列 | 1000000 | PLASTIC/EPOXY | BGA119,7X17,50 | 未说明 | 5 ns | 70 °C | 无 | GS832236AB-333V | 333 MHz | 1.8 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.12 | BGA | Commercial grade | 200@Flow-Through/333@Pipelined MHz | FBGA | 0 to 85 °C | Tray | GS832236AB | e0 | 无 | 3A991.B.2.B | Pipeline/Flow Through | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 2.5V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | 1.8/2.5 V | COMMERCIAL | 36 Mbit | 4 | SYNCHRONOUS | 270 mA, 355 mA | 5 ns | Flow-Through/Pipelined | 1 M x 36 | 3-STATE | 1.99 mm | 36 | 20 Bit | SRAM | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | 缓存SRAM | 1.7 V | 2 V | 1.7 V | SRAM | 22 mm | 14 mm | ||||
![]() | GS8662D07BD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | DDR | Commercial grade | 400 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662D07BD | SigmaQuad-II+ B4 | Memory & Data Storage | 72 Mbit | 2 | 735 mA | Pipelined | 8 M x 8 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8162Z72CC-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-209 | YES | 209 | 209 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 150 MHz | + 70 C | 3.6 V | 0 C | 21 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | 未说明 | 7.5 ns | 70 °C | 无 | GS8162Z72CC-150 | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.17 | BGA | Commercial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 0 to 70 °C | Tray | GS8162Z72CC | 无 | 3A991.B.2.B | NBT Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B209 | 不合格 | COMMERCIAL | 18 Mbit | 8 | SYNCHRONOUS | 210 mA, 230 mA | 7.5 ns | Flow-Through/Pipelined | 256 k x 72 | 1.7 mm | 72 | 18 Bit | SRAM | 18 Mbit | 18874368 bit | Commercial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | ||||||||||||
![]() | GS8342T10BGD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | Industrial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8342T10BGD | SigmaDDR-II+ B2 | Memory & Data Storage | 36 Mbit | 1 | 575 mA | Pipelined | 4 M x 9 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS72116AU-8 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 48 | 3.6 V | 3.3000 V | 3 V | Asynchronous | 128 kWords | 16 Bit | 0 to 70 °C | 8 | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88118CD-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 153.8@Flow-Through/200@Pipelined MHz | FBGA | 1.8, 2.5 V | 1.7, 2.3 V | 18 Bit | 2, 2.7 V | 有 | 200 MHz | + 70 C | 2.7 V | 0 C | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | Commercial grade | 0 to 70 °C | Tray | GS88118CD | 同步突发 | Memory & Data Storage | 9 Mbit | 115 mA, 140 mA | 6.5@Flow-Through/3@P | 512 k x 18 | SRAM | 9 | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321Z18AD-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 18 Bit | 2 MWords | Synchronous | 1.7, 2.3 V | 1.8, 2.5 V | SDR | FBGA | 153.8@Flow-Through/200@Pipelined MHz | 有 | 200 MHz | + 100 C | 2.7 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 6.5 ns | 85 °C | 无 | GS8321Z18AD-200IV | 200 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.16 | BGA | Industrial grade | 表面贴装 | 2, 2.7 V | -40 to 100 °C | Tray | GS8321Z18AD | e0 | 无 | 3A991.B.2.B | NBT | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 2.5V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.8/2.5 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 215 mA, 250 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 21 Bit | SRAM | 36 Mbit | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | ZBT SRAM | 1.7 V | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||
![]() | GS840H32AB-180 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 119 | 119 | BGA, BGA119,7X17,50 | 网格排列 | 3 | 128000 | PLASTIC/EPOXY | BGA119,7X17,50 | 未说明 | 8 ns | 70 °C | 无 | GS840H32AB-180 | 180 MHz | 131072 words | 3.3 V | BGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.29 | BGA | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | 2.5/3.3,3.3 V | COMMERCIAL | SYNCHRONOUS | 0.335 mA | 128KX32 | 3-STATE | 2.19 mm | 32 | 0.02 A | 4194304 bit | PARALLEL | COMMON | 缓存SRAM | 3.14 V | 3.6 V | 3 V | 22 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | GS8342T19BGD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | Commercial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8342T19BGD | SigmaDDR-II+ B2 | Memory & Data Storage | 36 Mbit | 1 | 670 mA | Pipelined | 2 M x 18 | 20 Bit | SRAM | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662QT37BGD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Industrial grade | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8662QT37BGD | SigmaQuad-II+ B2 | Memory & Data Storage | 72 Mbit | 2 | 1.07 A | Pipelined | 2 M x 36 | 20 Bit | SRAM | 72 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8320Z36AGT-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Industrial grade | 250@Flow-Through/400@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 400 MHz | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | -40 to 100 °C | Tray | GS8320Z36AGT | NBT Pipeline/Flow Through | Memory & Data Storage | 36 Mbit | 4 | 305 mA, 415 mA | 4 ns | Flow-Through/Pipelined | 1 M x 36 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS72116AU-10 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | YES | 48 | 48 | 未说明 | 10 ns | 70 °C | 无 | GS72116AU-10 | 131072 words | 3.3 V | TFBGA | RECTANGULAR | GSI技术 | 不推荐 | GSI TECHNOLOGY | 5.22 | BGA | TFBGA, | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | 128000 | PLASTIC/EPOXY | 无 | 3A991.B.2.B | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 0.75 mm | compliant | R-PBGA-B48 | 不合格 | COMMERCIAL | ASYNCHRONOUS | 128KX16 | 1.2 mm | 16 | 2097152 bit | PARALLEL | 标准SRAM | 3.6 V | 3 V | 8 mm | 6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832018AGT-333V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | SDR | Details | SyncBurst | GSI技术 | GSI技术 | Parallel | SMD/SMT | Commercial grade | 200@Flow-Through/333@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 333 MHz | + 70 C | 2.7 V | 0 C | 18 | 1.7 V | 0 to 85 °C | Tray | GS832018AGT | 同步突发 | Memory & Data Storage | 36 Mbit | 2 | 245 mA, 330 mA | 5 ns | Flow-Through/Pipelined | 2 M x 18 | 21 Bit | SRAM | 36 Mbit | Commercial | SRAM |
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