品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8662R09BD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 333 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8662R09BD-333I | 333 MHz | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.49 | BGA | Industrial grade | 333 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | -40 to 100 °C | Bulk | e0 | 无 | 3A991.B.2.B | 锡铅 | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | SRAMs | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 72 Mbit | 1 | SYNCHRONOUS | 545 mA | Pipelined | 8 M x 9 | 3-STATE | 1.4 mm | 9 | 21 Bit | 72 Mbit | 0.24 A | 75497472 bit | Industrial | PARALLEL | COMMON | 标准SRAM | 1.7 V | 1.9 V | 1.7 V | 15 mm | 13 mm | 无 | |||||||||||||
![]() | GS8322Z72C-133I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Industrial grade | 117.6@Flow-Through/133@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 133 MHz | + 85 C | 3.6 V | - 40 C | 14 | -40 to 85 °C | Tray | GS8322Z72C | NBT Pipeline/Flow Through | 85 °C | -40 °C | Memory & Data Storage | 36 Mbit | 8 | 220 mA, 255 mA | 8.5 ns | Flow-Through/Pipelined | 512 k x 72 | 19 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342Q10BD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Industrial grade | 333 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Bulk | GS8342Q10BD | SigmaQuad-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 895 mA | Pipelined | 4 M x 9 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662S08BGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 85 °C | 0 °C | 1.8 V | 2 | 22 b | 72 Mb | 72 | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z72C-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Commercial grade | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 72 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 250 MHz | + 70 C | 3.6 V | 0 C | 14 | 2.3 V | SMD/SMT | 0 to 70 °C | Tray | GS8322Z72C | NBT Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 36 Mbit | 8 | 275 mA, 380 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 72 | 19 b | SRAM | 36 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161Z36DD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Industrial grade | 250@Flow-Through/400@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 36 Bit | 表面贴装 | 2.7, 3.6 V | Compliant | 有 | 400 MHz | + 85 C | 3.6 V | - 40 C | 36 | -40 to 85 °C | Bulk | GS8161Z36DD | NBT | 85 °C | -40 °C | Memory & Data Storage | 18 Mbit | 4 | 300 mA, 385 mA | 4 ns | Flow-Through/Pipelined | 512 k x 36 | 19 Bit | SRAM | 18 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832218AB-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | 1.7, 2.3 V | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 150 MHz | + 70 C | 2.7 V | 0 C | 14 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | BGA, BGA119,7X17,50 | 网格排列 | 2000000 | PLASTIC/EPOXY | BGA119,7X17,50 | 未说明 | 7.5 ns | 70 °C | 无 | GS832218AB-150V | 150 MHz | 1.8 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.11 | BGA | Commercial grade | FBGA | SDR | 1.8, 2.5 V | 0 to 85 °C | Bulk | GS832218AB | e0 | 无 | 3A991.B.2.B | Pipeline/Flow Through | Tin/Lead (Sn/Pb) | 85 °C | 0 °C | ALSO OPERATES AT 2.5V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | 1.8/2.5 V | COMMERCIAL | 36 Mbit | 2 | SYNCHRONOUS | 185 mA, 200 mA | 7.5 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.99 mm | 18 | 21 b | SRAM | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | 缓存SRAM | 1.7 V | 2 V | 1.7 V | SRAM | 22 mm | 14 mm | 无 | ||||||
![]() | GS88236CGB-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | Compliant | 有 | 300 MHz | + 70 C | 3.6 V | 0 C | 42 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | BGA, | 网格排列 | 3 | 256000 | PLASTIC/EPOXY | 未说明 | 5 ns | 70 °C | 有 | GS88236CGB-300 | 262144 words | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.13 | BGA | Commercial grade | FBGA | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 36 Bit | 2.7, 3.6 V | 0 to 70 °C | Tray | GS88236CGB | e1 | 有 | 3A991.B.2.B | Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | COMMERCIAL | 9 Mbit | 4 | SYNCHRONOUS | 165 mA, 225 mA | 5@Flow-Through/2.5@P | 256 k x 36 | 1.77 mm | 36 | 18 b | SRAM | 9 Mb | 9 | Commercial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | 无 | |||||||||||||||
![]() | GS81302S08E-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 16 MWords | 8 Bit | 表面贴装 | Compliant | 250 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 250 MHz | FBGA | DDR | 1.8000 V | Synchronous | 0 to 85 °C | 85 °C | 0 °C | 1.8 V | 144 Mbit | 2 | 700 mA | Pipelined | 16 M x 8 | 23 Bit | 144 Mbit | Commercial | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS880E32CGT-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 153.8@Flow-Through/200@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 32 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 200 MHz | + 85 C | 2.7 V | - 40 C | 66 | -40 to 85 °C | Tray | GS880E32CGT | DCD | 85 °C | -40 °C | Memory & Data Storage | 9 Mbit | 2 | 145 mA, 170 mA | 6.5 ns | Flow-Through/Pipelined | 256 k x 32 | 18 Bit | SRAM | 8 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D37BD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8342D37BD-400I | 400 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.22 | BGA | Industrial grade | 400 MHz | -40 to 100 °C | Bulk | GS8342D37BD | 3A991.B.2.B | SigmaQuad-II+ B4 | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 915 mA | Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 18 Bit | SRAM | 36 Mbit | 0.235 A | 37748736 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||||
![]() | GS8642Z36B-167I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | 125@Flow-Through/167@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | SDR | NBT SRAM | GSI技术 | GSI技术 | Parallel | SMD/SMT | 2.3 V | 14 | - 40 C | 3.6 V | + 85 C | 167 MHz | BGA, BGA119,7X17,50 | 网格排列 | 3 | 2000000 | PLASTIC/EPOXY | BGA119,7X17,50 | -40 °C | 未说明 | 8 ns | 85 °C | 无 | GS8642Z36B-167I | 167 MHz | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.18 | BGA | Industrial grade | -40 to 85 °C | Tray | GS8642Z36B | e0 | 无 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 72 Mbit | 4 | SYNCHRONOUS | 240 mA, 290 mA | Flow-Through/Pipelined | 2 M x 36 | 3-STATE | 1.99 mm | 36 | 21 Bit | SRAM | 72 Mbit | 0.12 A | 75497472 bit | Industrial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | 无 | ||||
![]() | GS88236CB-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 200@Flow-Through/300@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 300 MHz | + 85 C | 3.6 V | - 40 C | 42 | -40 to 85 °C | Tray | GS88236CB | Pipeline/Flow Through | 85 °C | -40 °C | Memory & Data Storage | 9 Mbit | 4 | 185 mA, 245 mA | 5 ns | Flow-Through/Pipelined | 256 k x 36 | 18 Bit | SRAM | 9 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS882Z18CGB-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | 2.3, 3 V | Synchronous | 表面贴装 | 2.7, 3.6 V | 18 Bit | 512 kWords | Compliant | 有 | 300 MHz | + 85 C | 3.6 V | - 40 C | 42 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | BGA, | 网格排列 | 3 | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 5 ns | 85 °C | 有 | GS882Z18CGB-300I | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.13 | BGA | Industrial grade | FBGA | SDR | 2.5, 3.3 V | -40 to 85 °C | Tray | GS882Z18CGB | e1 | 有 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | INDUSTRIAL | 9 Mbit | 2 | SYNCHRONOUS | 170 mA, 225 mA | 5 ns | Flow-Through/Pipelined | 512 k x 18 | 1.77 mm | 18 | 18 b | SRAM | 9 Mbit | 9437184 bit | Industrial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | 无 | |||||||||||
![]() | GS864272GC-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Commercial grade | 表面贴装 | 2, 2.7 V | 72 Bit | 1 MWords | Synchronous | 1.7, 2.3 V | 1.8, 2.5 V | SDR | FBGA | Compliant | 有 | 250 MHz | + 70 C | 2.7 V | 0 C | 14 | 1.7 V | SMD/SMT | 0 to 70 °C | Bulk | GS864272GC | SCD/DCD Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 72 Mbit | 8 | 330 mA, 460 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 72 | 20 b | SRAM | 72 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182R18BGD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 85 °C | -40 °C | 1.8 V | 1 | 20 b | 18 Mb | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z18AD-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 250 MHz | + 70 C | 2.7 V | 0 C | 14 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 5.5 ns | 70 °C | 无 | GS8322Z18AD-250V | 250 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.13 | BGA | Commercial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 0 to 85 °C | Bulk | GS8322Z18AD | 3A991.B.2.B | NBT | 85 °C | 0 °C | ALSO OPERATED WITH 2.5V SUPPLY; PIPELINE/FLOW THROUGH ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.8/2.5 V | COMMERCIAL | 36 Mbit | 2 | SYNCHRONOUS | 225 mA, 265 mA | 5.5 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 21 Bit | SRAM | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | ZBT SRAM | 1.7 V | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||
![]() | GS8322Z36AB-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | 1.7, 2.3 V | Synchronous | 1 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | 14 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | BGA, BGA119,7X17,50 | 网格排列 | 1000000 | PLASTIC/EPOXY | BGA119,7X17,50 | -40 °C | 5.5 ns | 85 °C | 无 | GS8322Z36AB-250IV | 250 MHz | 1.8 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.12 | BGA | Industrial grade | FBGA | SDR | 1.8, 2.5 V | -40 to 100 °C | Bulk | GS8322Z36AB | 3A991.B.2.B | NBT | 100 °C | -40 °C | ALSO OPERATED WITH 2.5V SUPPLY; PIPELINE/FLOW THROUGH ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | 1.8/2.5 V | INDUSTRIAL | 36 Mbit | 4 | SYNCHRONOUS | 260 mA, 315 mA | 5.5 ns | Flow-Through/Pipelined | 1 M x 36 | 3-STATE | 1.99 mm | 36 | 20 b | SRAM | 36 Mbit | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | ZBT SRAM | 1.7 V | 2 V | 1.7 V | SRAM | 22 mm | 14 mm | 无 | ||||||||||
![]() | GS81302T19GE-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | Compliant | 450 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 450 MHz | -40 to 100 °C | Bulk | 100 °C | -40 °C | 1.8 V | 144 Mbit | 1 | 1.01 A | Pipelined | 8 M x 18 | 22 Bit | 144 Mbit | Industrial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832236AB-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | + 70 C | 3.6 V | 0 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | BGA, BGA119,7X17,50 | 无 | GS832236AB-400 | 活跃 | GSI TECHNOLOGY | BGA | Commercial grade | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 400 MHz | 0 to 85 °C | Bulk | GS832236AB | 无 | 3A991.B.2.B | Pipeline/Flow Through | 85 °C | 0 °C | 8542.32.00.41 | Memory & Data Storage | compliant | 36 Mbit | 4 | 285 mA, 395 mA | 4 ns | Flow-Through/Pipelined | 1 M x 36 | 20 b | SRAM | 36 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881E36CGT-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 70 C | 2.7 V | 0 C | 66 | 1.7 V | 0 to 70 °C | Tray | GS881E36CGT | DCD Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 9 Mbit | 4 | 125 mA, 150 mA | 6.5 ns | Flow-Through/Pipelined | 256 k x 36 | 18 Bit | SRAM | 9 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8644Z36GE-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Commercial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 150 MHz | + 70 C | 2.7 V | 0 C | 15 | 0 to 70 °C | Tray | GS8644Z36GE | NBT | 70 °C | 0 °C | Memory & Data Storage | 72 Mbit | 4 | 245 mA, 295 mA | 8.5 ns | Flow-Through/Pipelined | 2 M x 36 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662Q07BGD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | SigmaQuad-II+ | DDR | Industrial grade | 200 MHz | FBGA | QDR | 1.8000 V | Synchronous | 8 MWords | 8 Bit | 表面贴装 | Compliant | 有 | 200 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | -40 to 100 °C | Tray | GS8662Q07BGD | SigmaQuad-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 610 mA | Pipelined | 8 M x 8 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T08BGD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 300 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 300 MHz | 0 to 85 °C | GS8662T08BGD | 85 °C | 0 °C | 1.8 V | 72 Mbit | 1 | 495 mA | Pipelined | 8 M x 8 | 22 Bit | 72 Mbit | Commercial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342Q19BGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | 1.8000 V | 1.7 V | Synchronous | 18 Bit | 1.9 V | Compliant | 有 | 333 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Commercial grade | 0 to 85 °C | Bulk | GS8342Q19BGD | SigmaQuad-II+ B2 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 885 mA | 0.45 | 2 M x 18 | 20 b | SRAM | 36 Mb | 36 | Commercial | SRAM | 无 |
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