品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8182R09BGD-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 375 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | Commercial grade | 0 to 70 °C | 70 °C | 0 °C | 1.8 V | 1 | Pipelined | 19 Bit | 18 Mbit | Commercial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662Q08BD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 333 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | Industrial grade | -40 to 100 °C | Bulk | 100 °C | -40 °C | 1.8 V | 2 | Pipelined | 22 Bit | 72 Mbit | Industrial | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS864236B-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 300 MHz | + 70 C | 3.6 V | 0 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | BGA, | 网格排列 | 3 | 2000000 | PLASTIC/EPOXY | 未说明 | 5.5 ns | 70 °C | 无 | GS864236B-300 | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.18 | BGA | Commercial grade | 181.8@Flow-Through/300@Pipelined MHz | FBGA | SDR | 0 to 70 °C | Tray | GS864236B | e0 | 无 | 3A991.B.2.B | SCD/DCD Pipeline/Flow Through | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | COMMERCIAL | 72 Mbit | 4 | SYNCHRONOUS | 300 mA, 420 mA | 5.5 ns | Flow-Through/Pipelined | 2 M x 36 | 1.99 mm | 36 | 21 Bit | SRAM | 72 Mbit | 75497472 bit | Commercial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | 无 | |||||||||||
![]() | GS8321E36AD-333IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Compliant | Industrial grade | 200@Flow-Through/333@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | 表面贴装 | 2, 2.7 V | 36 Bit | 1 MWords | Synchronous | 有 | 333 MHz | + 85 C | 2.7 V | - 40 C | 18 | 1.7 V | -40 to 100 °C | Tray | GS8321E36AD | 同步突发 | 100 °C | -40 °C | Memory & Data Storage | 36 Mbit | 4 | 290 mA, 375 mA | 5 ns | Flow-Through/Pipelined | 1 M x 36 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881Z18CD-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Compliant | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | 66 | 1.7 V | -40 to 85 °C | Tray | GS881Z18CD | NBT | 85 °C | -40 °C | Memory & Data Storage | 9 Mbit | 1 | 145 mA, 185 mA | 5.5 ns | Flow-Through/Pipelined | 512 k x 18 | 18 Bit | SRAM | 9 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881E36CD-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Compliant | Commercial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 70 C | 2.7 V | 0 C | 66 | 1.7 V | 0 to 70 °C | Tray | GS881E36CD | DCD Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 9 Mbit | 4 | 110 mA, 125 mA | 7.5 ns | Flow-Through/Pipelined | 256 k x 36 | 18 Bit | SRAM | 9 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161E18DGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | 0 to 70 °C | Tray | GS8161E18DGD | DCD Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 18 Mbit | 2 | 240 mA, 285 mA | 4.5 ns | Flow-Through/Pipelined | 1 M x 18 | 20 b | SRAM | 18 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342R09BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaCIO DDR-II | Details | DDR | Industrial grade | 400 MHz | FBGA | DDR | 1.8000 V | Synchronous | 4 MWords | 9 Bit | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | -40 to 100 °C | Tray | GS8342R09BGD | SigmaDDR-II B4 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 1 | 610 mA | Pipelined | 4 M x 9 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D38BGD-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Commercial grade | 500 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 500 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 70 °C | Tray | GS8342D38BGD | SigmaQuad-II+ | 70 °C | 0 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 1.115 A | Pipelined | 1 M x 36 | 18 Bit | SRAM | 36 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T10BGD-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 表面贴装 | Compliant | 350 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | LBGA, | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | 有 | GS8662T10BGD-350 | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.49 | BGA | Commercial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 0 to 85 °C | Bulk | 3A991.B.2.B | 85 °C | 0 °C | PIPELINED ARCHITECTURE, LATE WRITE | 8542.32.00.41 | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 72 Mbit | 1 | SYNCHRONOUS | 590 mA | Pipelined | 8 M x 9 | 1.4 mm | 9 | 22 Bit | 72 Mbit | 75497472 bit | Commercial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | 15 mm | 13 mm | 无 | |||||||||||||||||||||||||
![]() | GS84018AGT-166IT | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 100 | 100 | 5.66 | QFP | Compliant | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 256000 | PLASTIC/EPOXY | QFP100,.63X.87 | -40 °C | 未说明 | 8.5 ns | 85 °C | 有 | GS84018AGT-166IT | 166 MHz | 262144 words | 3.3 V | LQFP | RECTANGULAR | GSI技术 | Obsolete | GSI TECHNOLOGY | Tape & Reel | e3 | 有 | 3A991.B.2.B | 纯哑光锡 | 85 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | 3.3 V | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 2.5/3.3,3.3 V | INDUSTRIAL | 2 | SYNCHRONOUS | 0.32 mA | 256KX18 | 3-STATE | 1.6 mm | 18 | 18 b | 4 Mb | 0.03 A | 4718592 bit | PARALLEL | COMMON | 缓存SRAM | 3.14 V | 3.6 V | 3 V | 20 mm | 14 mm | 无 | ||||||||||||||||||||||||||||||||||
![]() | GS881E36CD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Compliant | Commercial grade | 222.2@Flow-Through/333@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | 0 to 70 °C | Tray | GS881E36CD | DCD Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 9 Mbit | 4 | 180 mA, 240 mA | 4.5 ns | Flow-Through/Pipelined | 256 k x 36 | 18 Bit | SRAM | 9 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8644Z18E-225I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 有 | 225 MHz | + 85 C | 3.6 V | - 40 C | 15 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Compliant | BGA, BGA165,11X15,40 | 网格排列 | 3 | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 6.5 ns | 85 °C | 无 | GS8644Z18E-225I | 225 MHz | 4194304 words | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.14 | BGA | 153.8@Flow-Through/225@Pipelined MHz | 2.5, 3.3 V | 2.3, 3 V | 18 Bit | 2.7, 3.6 V | -40 to 85 °C | Tray | GS8644Z18E | 无 | 3A991.B.2.B | NBT | 85 °C | -40 °C | ALSO OPERATES AT 3.3V SUPPLY; PIPELINED OR FLOW-THROUGH ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 72 Mbit | 2 | SYNCHRONOUS | 275 mA, 370 mA | 6.5@Flow-Through/2.7 | 4 M x 18 | 3-STATE | 1.5 mm | 18 | 22 b | SRAM | 72 Mb | 0.16 A | 72 | PARALLEL | COMMON | ZBT SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 17 mm | 15 mm | 无 | ||||||||||||
![]() | GS8662Q18BD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | Compliant | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8662Q18BD-200I | 200 MHz | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.34 | BGA | 200 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 200 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | -40 to 100 °C | GS8662Q18BD | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | SRAMs | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 72 Mbit | 2 | SYNCHRONOUS | 0.61 mA | Pipelined | 4MX18 | 3-STATE | 1.4 mm | 18 | 21 Bit | 72 Mbit | 75497472 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | 15 mm | 13 mm | 无 | ||||||||||||||
![]() | GS8342D07BD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Commercial grade | 400 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 表面贴装 | 1.9 V | Compliant | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 0 to 70 °C | Tray | GS8342D07BD | SigmaQuad-II+ B4 | 70 °C | 0 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 705 mA | Pipelined | 4 M x 8 | 20 Bit | SRAM | 36 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8640E36GT-167IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 125@Flow-Through/167@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 167 MHz | + 85 C | 2.7 V | - 40 C | 18 | -40 to 85 °C | Tray | GS8640E36GT | DCD | 85 °C | -40 °C | Memory & Data Storage | 72 Mbit | 4 | 240 mA, 290 mA | 8 ns | Flow-Through/Pipelined | 2 M x 36 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D37BGD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 36 Bit | 1.9 V | Compliant | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8662D37BGD-450I | 2097152 words | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.45 | BGA | 450 MHz | FBGA | 1.8000 V | 1.7 V | Synchronous | -40 to 100 °C | Tray | GS8662D37BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad-II+ B4 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 管道结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 72 Mbit | 2 | SYNCHRONOUS | 1.065 A | 0.45 | 2 M x 36 | 1.4 mm | 36 | 19 Bit | SRAM | 72 Mb | 72 | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||||
![]() | GS8662TT07BGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | DDR | Industrial grade | FBGA | 1.8000 V | 1.7 V | Synchronous | 1.9 V | 8 Bit | 8 MWords | Compliant | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | -40 to 100 °C | Bulk | GS8662TT07BGD | SigmaDDR-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 545 mA | 0.45 | 8 M x 8 | 22 b | SRAM | 72 Mb | 72 | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662DT07BD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Industrial grade | 333 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Bulk | GS8662DT07BD | SigmaQuad-II+ B4 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 640 mA | Pipelined | 8 M x 8 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T18BD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | DDR-II | Commercial grade | 300 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 15 | 0 to 85 °C | Bulk | GS8662T18BD | SigmaDDR-II B2 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 495 mA | Pipelined | 4 M x 18 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D36BGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | SigmaQuad-II | DDR | Industrial grade | 333 MHz | FBGA | QDR | 1.8000 V | Synchronous | 2 MWords | 36 Bit | 表面贴装 | Compliant | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | -40 to 100 °C | Tray | GS8662D36BGD | SigmaQuad-II | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 820 mA | Pipelined | 2 M x 36 | 19 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816136DGT-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | GSI技术 | Parallel | SMD/SMT | 2.3 V | 36 | 0 C | 3.6 V | Commercial grade | 222.2@Flow-Through/333@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 333 MHz | + 70 C | SDR | SyncBurst | GSI技术 | 0 to 70 °C | Bulk | GS816136DGT | Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 18 Mbit | 4 | 260 mA, 315 mA | 4.5 ns | Flow-Through/Pipelined | 512 k x 36 | 19 Bit | SRAM | 18 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662QT37BD-357I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 357 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | Industrial grade | -40 to 100 °C | Bulk | 100 °C | -40 °C | 1.8 V | 2 | Pipelined | 20 Bit | 72 Mbit | Industrial | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8160E32DGT-333IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 32 Bit | 2, 2.7 V | 表面贴装 | Compliant | 333 MHz | + 100 C | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 333 MHz | -40 to 85 °C | GS8160E32DGT | 18 Mbit | 4 | 260 mA, 330 mA | 5 ns | Flow-Through/Pipelined | 512 k x 32 | 19 Bit | 18 Mbit | Industrial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS840H36AGT-166I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 100 | 100 | 5.34 | QFP | Compliant | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 128000 | PLASTIC/EPOXY | QFP100,.63X.87 | -40 °C | 未说明 | 8.5 ns | 85 °C | 有 | GS840H36AGT-166I | 166 MHz | 131072 words | 3.3 V | LQFP | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | e3 | 有 | 3A991.B.2.B | 纯哑光锡 | 85 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | 3.3 V | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 2.5/3.3,3.3 V | INDUSTRIAL | 4 | SYNCHRONOUS | 0.32 mA | 128KX36 | 3-STATE | 1.6 mm | 36 | 17 b | 4.5 Mb | 0.03 A | 4718592 bit | PARALLEL | COMMON | 缓存SRAM | 3.14 V | 3.6 V | 3 V | 20 mm | 14 mm | 无 |
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