品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 数据总线宽度 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 访问模式 | 产品类别 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS864018GT-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | Parallel | LQFP, | FLATPACK, LOW PROFILE | 3 | 4000000 | PLASTIC/EPOXY | 未说明 | 5.5 ns | 70 °C | 有 | GS864018GT-300 | 4194304 words | 2.5 V | LQFP | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.37 | QFP | Commercial grade | 181.8@Flow-Through/300@Pipelined MHz | 3.3000 V | 3 V | 18 Bit | 3.6 V | Compliant | 300 MHz | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | 0 to 70 °C | GS864018GT | e3 | 有 | 3A991.B.2.B | 纯哑光锡 | 70 °C | 0 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | CMOS | 3.3 V | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | COMMERCIAL | 72 Mbit | 2 | SYNCHRONOUS | 270 mA, 370 mA | 5.5@Flow-Through/2.3 | 4 M x 18 | 1.6 mm | 18 | 22 b | 72 Mb | 72 | Commercial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | 20 mm | 14 mm | 无 | ||||||||||||||||||||||||||||
![]() | GS8662QT07BD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 300 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 300 MHz | -40 to 100 °C | Bulk | 100 °C | -40 °C | 1.8 V | 72 Mbit | 2 | 860 mA | Pipelined | 8 M x 8 | 22 Bit | 72 Mbit | Industrial | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS880Z18CGT-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | FLATPACK, LOW PROFILE | 512000 | UNSPECIFIED | 未说明 | 70 °C | 有 | GS880Z18CGT-200V | 524288 words | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | QFP | 有 | 200 MHz | + 70 C | 2.7 V | 0 C | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LQFP, | Tray | GS880Z18CGT | 3A991.B.2.B | NBT | 70 °C | 0 °C | PIPELINED ARCHITECTURE, FLOW-THROUGH, IT ALSO OPERATES WITH 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-XQFP-G100 | 不合格 | COMMERCIAL | 9 Mbit | 1 | SYNCHRONOUS | 115 mA, 140 mA | 6.5 ns | 512 k x 18 | 1.6 mm | 18 | 18 b | SRAM | 9 Mb | 9437184 bit | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 20 mm | 14 mm | 无 | ||||||||||||||||||||||||||||||||
![]() | GS881Z36CGT-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 256 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | Compliant | 150 MHz | + 85 C | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 133.3@Flow-Through/150@Pipelined MHz | -40 to 85 °C | 85 °C | -40 °C | 9 Mbit | 1 | 130 mA, 145 mA | 7.5 ns | Flow-Through/Pipelined | 256 k x 36 | 18 Bit | 9 Mbit | Industrial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342QT37BD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Compliant | Industrial grade | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8342QT37BD | SigmaQuad-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 895 mA | Pipelined | 1 M x 36 | 19 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302Q07GE-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaQuad-II+ | Details | QDR-II | Industrial grade | 300 MHz | FBGA | QDR | 1.8000 V | Synchronous | 16 MWords | 8 Bit | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | -40 to 100 °C | Tray | GS81302Q07GE | SigmaQuad-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 1.26 A | Pipelined | 16 M x 8 | 23 b | SRAM | 144 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302S18E-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | YES | 165 | 165 | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | N | DDR-II | LBGA, | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | 无 | GS81302S18E-333 | 1.8 V | LBGA | RECTANGULAR | 不推荐 | GSI TECHNOLOGY | 5.06 | BGA | Commercial grade | 333 MHz | FBGA | DDR | 0 to 85 °C | Tray | GS81302S18E | 无 | 3A991.B.2.B | SigmaSIO DDR-II | 85 °C | 0 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 144 Mbit | 2 | SYNCHRONOUS | 890 mA | Pipelined | 8 M x 18 | 1.5 mm | 18 | 22 Bit | SRAM | 144 Mbit | 150994944 bit | Commercial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 17 mm | 15 mm | 无 | ||||||||||||||||||
![]() | GS8662Q07BGD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 250 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 250 MHz | 0 to 85 °C | GS8662Q07BGD | 85 °C | 0 °C | 1.8 V | 72 Mbit | 2 | 720 mA | Pipelined | 8 M x 8 | 22 Bit | 72 Mbit | Commercial | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182R36BGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 85 °C | -40 °C | 1.8 V | 1 | 19 b | 18 Mb | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T07BD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 300 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 300 MHz | -40 to 100 °C | Bulk | GS8662T07BD | 100 °C | -40 °C | 1.8 V | 72 Mbit | 1 | 505 mA | Pipelined | 8 M x 8 | 22 Bit | 72 Mbit | Industrial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662S18BD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR | Compliant | Industrial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8662S18BD | SigmaSIO DDR-II | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 745 mA | Pipelined | 4 M x 18 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T11BGD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 8000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8662T11BGD-450I | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.5 | BGA | Industrial grade | 450 MHz | FBGA | -40 to 100 °C | Tray | GS8662T11BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad-II+ | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 72 Mbit | 1 | SYNCHRONOUS | 705 mA | Pipelined | 8 M x 9 | 1.4 mm | 9 | 22 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||||||||||
![]() | GS8162Z36DD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Industrial grade | 222.2@Flow-Through/333@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 333 MHz | + 85 C | 3.6 V | - 40 C | 36 | -40 to 100 °C | Bulk | GS8162Z36DD | NBT Pipeline/Flow Through | 100 °C | -40 °C | Memory & Data Storage | 18 Mbit | 4 | 280 mA, 335 mA | 4.5 ns | Flow-Through/Pipelined | 512 k x 36 | 19 Bit | SRAM | 18 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS4288S09L-33 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 144 | GS4288S09L-33 | 33554432 words | 1.8 V | TBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.7 | BGA | Compliant | TBGA, | GRID ARRAY, THIN PROFILE | 32000000 | PLASTIC/EPOXY | 未说明 | 无 | 3A991.B.2.B | 95 °C | 0 °C | 自动刷新 | 8542.32.00.28 | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B144 | 1 | SYNCHRONOUS | 9 b | 32MX9 | 1.2 mm | 9 | 24 b | 288 Mb | 301989888 bit | 300 MHz | DDR DRAM | 1.9 V | 1.7 V | 多库页面突发 | 11 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8162Z18DGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 333 MHz | SDR | NBT SRAM | GSI技术 | GSI技术 | Parallel | SMD/SMT | 2.3 V | 36 | 0 C | 3.6 V | + 70 C | LBGA, | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 未说明 | 4.5 ns | 85 °C | 有 | GS8162Z18DGD-333 | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.27 | BGA | Commercial grade | 222.2@Flow-Through/333@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 0 to 85 °C | Bulk | GS8162Z18DGD | 3A991.B.2.B | NBT Pipeline/Flow Through | 85 °C | 0 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | OTHER | 18 Mbit | 2 | SYNCHRONOUS | 240 mA, 285 mA | 4.5 ns | Flow-Through/Pipelined | 1 M x 18 | 1.4 mm | 18 | 20 Bit | SRAM | 18 Mbit | 18874368 bit | Commercial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||||||||
![]() | GS8662R18BD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | DDR | Industrial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Bulk | GS8662R18BD | SigmaDDR-II B4 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 635 mA | Pipelined | 4 M x 18 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T07BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | SigmaDDR-II+ | DDR | Industrial grade | 400 MHz | FBGA | DDR | 1.8000 V | Synchronous | 8 MWords | 8 Bit | 表面贴装 | Compliant | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | -40 to 100 °C | Tray | GS8662T07BGD | SigmaDDR-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 635 mA | Pipelined | 8 M x 8 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81284Z36B-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-119 | YES | 119 | 119 | Synchronous | 4 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 250 MHz | + 70 C | 3.6 V | 0 C | 10 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SDR | 14 X 22 MM, 1.27 MM PITCH, FPBGA-119 | 网格排列 | 4000000 | PLASTIC/EPOXY | 未说明 | 6.5 ns | 70 °C | 无 | GS81284Z36B-250V | 1.8 V | BGA | RECTANGULAR | Obsolete | GSI TECHNOLOGY | 5.78 | BGA | Commercial grade | 250 MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | 0 to 70 °C | Tray | e0 | 无 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Lead (Sn/Pb) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES WITH 2.5V | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | COMMERCIAL | 144 Mbit | 4 | SYNCHRONOUS | 380 mA, 500 mA | 6.5 ns | Flow-Through/Pipelined | 4 M x 36 | 1.99 mm | 36 | 22 Bit | SRAM | 144 Mbit | 150994944 bit | Commercial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 22 mm | 14 mm | ||||||||||||||||||||
![]() | GS8662T07BGD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 450 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 450 MHz | 0 to 85 °C | 85 °C | 0 °C | 1.8 V | 72 Mbit | 1 | 695 mA | Pipelined | 8 M x 8 | 22 Bit | 72 Mbit | Commercial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321Z18AGD-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | Compliant | 150 MHz | + 70 C | 2.7 V | 0 C | 1.7 V | SMD/SMT | Parallel | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 7.5 ns | 70 °C | 有 | GS8321Z18AGD-150V | 150 MHz | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.16 | BGA | Commercial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 0 to 85 °C | Bulk | e1 | 有 | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | ALSO OPERATES AT 2.5V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.8/2.5 V | COMMERCIAL | 36 Mbit | 2 | SYNCHRONOUS | 185 mA, 200 mA | 7.5 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 21 Bit | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | ZBT SRAM | 1.7 V | 2 V | 1.7 V | 15 mm | 13 mm | 无 | ||||||||||||||||
![]() | GS832218AB-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 200 MHz | + 85 C | 2.7 V | - 40 C | 14 | 1.7 V | SMD/SMT | -40 to 100 °C | Bulk | GS832218AB | Pipeline/Flow Through | 100 °C | -40 °C | Memory & Data Storage | 36 Mbit | 2 | 215 mA, 250 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 18 | 21 b | SRAM | 36 Mbit | Industrial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88218CB-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | 2, 2.7 V | 18 Bit | 512 kWords | Synchronous | 1.7, 2.3 V | 1.8, 2.5 V | SDR | FBGA | 133.3@Flow-Through/150@Pipelined MHz | Compliant | 150 MHz | + 85 C | 2.7 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 表面贴装 | -40 to 85 °C | GS88218CB | 85 °C | -40 °C | 9 Mbit | 2 | 125 mA, 135 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 18 | 18 Bit | 9 Mbit | Industrial | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321E36AD-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 2.3, 3 V | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 375 MHz | + 70 C | 3.6 V | 0 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 4.2 ns | 85 °C | 无 | GS8321E36AD-375 | 375 MHz | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.31 | BGA | Commercial grade | FBGA | SDR | 2.5, 3.3 V | 0 to 85 °C | Bulk | GS8321E36AD | e0 | 无 | 3A991.B.2.B | DCD Pipeline/Flow Through | 锡铅 | 85 °C | 0 °C | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | OTHER | 36 Mbit | 4 | SYNCHRONOUS | 270 mA, 380 mA | 4.2 ns | Flow-Through/Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 20 b | SRAM | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||
![]() | GS8182R08BD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Compliant | 85 °C | -40 °C | 1.8 V | 1 | 19 b | 18 Mb | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662R08BGD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 300 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 300 MHz | 0 to 85 °C | GS8662R08BGD | 85 °C | 0 °C | 1.8 V | 72 Mbit | 1 | 495 mA | Pipelined | 8 M x 8 | 21 Bit | 72 Mbit | Commercial | 无 |
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