品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 记忆密度 | 筛选水平 | 并行/串行 | 内存IC类型 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | GS81302T06E-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR-II | Commercial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 0 to 85 °C | Tray | GS81302T06E | SigmaDDR-II+ | Memory & Data Storage | 144 Mbit | 1 | 800 mA | Pipelined | 16 M x 8 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881Z18CD-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 70 C | 2.7 V | 0 C | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | 未说明 | 6.5 ns | 70 °C | 无 | GS881Z18CD-200V | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.14 | BGA | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | 0 to 70 °C | Tray | GS881Z18CD | e0 | 无 | 3A991.B.2.B | NBT | Tin/Lead (Sn/Pb) | IT ALSO OPERATE WITH 2.5 V, FLOW THROUGH AND PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | not_compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 9 Mbit | 1 | SYNCHRONOUS | 115 mA, 140 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 18 | 1.4 mm | 18 | 18 Bit | SRAM | 9 Mbit | 9437184 bit | Commercial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||
![]() | GS8644Z18GE-166IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Industrial grade | 142.8@Flow-Through/166@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 4 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 166 MHz | + 85 C | 2.7 V | - 40 C | -40 to 85 °C | Tray | GS8644Z18GE | NBT | Memory & Data Storage | 72 Mbit | 2 | 260 mA, 320 mA | 8 ns | Flow-Through/Pipelined | 4 M x 18 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D36E-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | N | QDR-II | Commercial grade | 250 MHz | 表面贴装 | 1.9 V | 36 Bit | 4 MWords | Synchronous | 1.7 V | 1.8000 V | QDR | FBGA | 有 | 250 MHz | + 70 C | 1.9 V | 0 C | 0 to 85 °C | Tray | GS81302D36E | SigmaQuad-II | Memory & Data Storage | 144 Mbit | 2 | 790 mA | Pipelined | 4 M x 36 | 20 Bit | SRAM | 144 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662R18BGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 333 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | Commercial grade | 0 to 85 °C | 1 | Pipelined | 22 Bit | 72 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT07E-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | GSI技术 | SigmaQuad-II+ | N | QDR-II | Commercial grade | 333 MHz | FBGA | QDR | 1.8000 V | Synchronous | 16 MWords | 8 Bit | 表面贴装 | 有 | 333 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | 0 to 85 °C | Tray | GS81302DT07E | SigmaQuad-II+ B4 | Memory & Data Storage | 144 Mbit | 2 | 890 mA | Pipelined | 16 M x 8 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D11BD-450M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 8 MWords | 9 Bit | 表面贴装 | 有 | 450 MHz | + 125 C | 1.9 V | - 55 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | -55 °C | 未说明 | 0.45 ns | 125 °C | 无 | GS8662D11BD-450M | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.81 | Military grade | 450 MHz | FBGA | QDR | 1.8000 V | Synchronous | Tray | GS8662D11BD | 3A991.B.2.B | SigmaQuad-II+ | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | MILITARY | 72 Mbit | SYNCHRONOUS | Pipelined | 8 M x 9 | 1.4 mm | 9 | 23 Bit | SRAM | 72 Mbit | 75497472 bit | Military | PARALLEL | QDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||||||||||
![]() | GS81302DT10GE-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | Commercial grade | 400 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 0 to 85 °C | Tray | GS81302DT10GE | SigmaQuad-II+ B4 | Memory & Data Storage | 144 Mbit | 2 | 1.055 A | Pipelined | 16 M x 9 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302Q37E-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 200 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 200 MHz | 0 to 85 °C | GS81302Q37E | 144 Mbit | 2 | 930 mA | Pipelined | 4 M x 36 | 21 Bit | 144 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88118CD-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 85 C | 2.7 V | - 40 C | 66 | -40 to 85 °C | Tray | GS88118CD | 同步突发 | Memory & Data Storage | 9 Mbit | 1 | 125 mA, 160 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 18 | 18 Bit | SRAM | 9 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161Z36DD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | Commercial grade | 222.2@Flow-Through/333@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 0 to 70 °C | Tray | GS8161Z36DD | NBT | Memory & Data Storage | 18 Mbit | 4 | 260 mA, 315 mA | 4.5 ns | Flow-Through/Pipelined | 512 k x 36 | 19 Bit | SRAM | 18 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302T10GE-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | Commercial grade | 300 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 0 to 85 °C | Tray | GS81302T10GE | SigmaDDR-II+ B2 | Memory & Data Storage | 144 Mbit | 1 | 690 mA | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881E32CD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 32 Bit | 2.7, 3.6 V | 表面贴装 | 300 MHz | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | Industrial grade | 200@Flow-Through/300@Pipelined MHz | -40 to 85 °C | GS881E32CD | 9 Mbit | 4 | 185 mA, 245 mA | 5 ns | Flow-Through/Pipelined | 256 k x 32 | 18 Bit | 8 Mbit | Industrial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832218AD-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 133@Flow-Through/150@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 85 C | 2.7 V | - 40 C | 18 | -40 to 100 °C | Tray | GS832218AD | Pipeline/Flow Through | Memory & Data Storage | 36 Mbit | 2 | 205 mA, 220 mA | 7.5 ns | Flow-Through/Pipelined | 2 M x 18 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832272C-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 117.6@Flow-Through/150@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 72 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 85 C | 2.7 V | - 40 C | 14 | -40 to 85 °C | Tray | GS832272C | 同步突发 | Memory & Data Storage | 36 Mbit | 8 | 220 mA, 280 mA | 8.5 ns | Flow-Through/Pipelined | 512 k x 72 | 19 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8642Z72C-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | 14 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | Commercial grade | 133.3@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 72 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 70 C | 2.7 V | 0 C | 0 to 70 °C | Tray | GS8642Z72C | NBT Pipeline/Flow Through | Memory & Data Storage | 72 Mbit | 8 | 285 mA, 385 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 72 | 20 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662QT37BD-300M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | 165 | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 125 C | 1.9 V | - 55 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | -55 °C | 未说明 | 0.45 ns | 125 °C | 无 | GS8662QT37BD-300M | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.79 | Military grade | 300 MHz | FBGA | QDR | -55 to 125 °C | Tray | GS8662QT37BD | 3A991.B.2.B | SigmaQuad-II+ B2 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | MILITARY | 72 Mbit | 2 | SYNCHRONOUS | Pipelined | 2 M x 36 | 1.4 mm | 36 | 21 Bit | SRAM | 72 Mbit | 75497472 bit | Military | PARALLEL | QDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||||||
![]() | GS8662D11BGD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 400 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | Commercial grade | 0 to 85 °C | 2 | Pipelined | 21 Bit | 72 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302R36GE-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | Details | DDR-II | Industrial grade | 333 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | -40 to 100 °C | Tray | GS81302R36GE | SigmaDDR-II B4 | Memory & Data Storage | 144 Mbit | 2 | 860 mA | Pipelined | 4 M x 36 | 22 Bit | SRAM | 144 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8320E36AGT-333IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | 100 | 有 | 333 MHz | + 85 C | 2.7 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | , | 有 | GS8320E36AGT-333IV | 活跃 | GSI TECHNOLOGY | 5.8 | Industrial grade | 333 MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | -40 to 85 °C | Tray | GS8320E36AGT | DCD Synchronous Burst | Memory & Data Storage | compliant | 36 Mbit | 4 | 290 mA, 375 mA | 5 ns | Flow-Through/Pipelined | 1 M x 36 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||
![]() | GS864436B-133I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 119 | 119 | 网格排列 | 3 | 2000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 8.5 ns | 85 °C | 无 | GS864436B-133I | 2097152 words | 2.5 V | BGA | RECTANGULAR | GSI技术 | Obsolete | GSI TECHNOLOGY | 5.71 | BGA | BGA, | e0 | 无 | 3A991.B.2.B | 锡铅 | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES WITH 3.3V SUPPLY | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | INDUSTRIAL | SYNCHRONOUS | 2MX36 | 1.99 mm | 36 | 75497472 bit | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | 22 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | GS8662DT06BD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | + 85 C | 450 MHz | 有 | Industrial grade | 450 MHz | FBGA | QDR | 1.8000 V | Synchronous | 8 MWords | 8 Bit | 表面贴装 | DDR | SigmaQuad-II+ | GSI技术 | GSI技术 | Parallel | SMD/SMT | 1.7 V | 15 | - 40 C | 1.9 V | -40 to 100 °C | Tray | GS8662DT06BD | SigmaQuad-II+ | Memory & Data Storage | 72 Mbit | 2 | 830 mA | Pipelined | 8 M x 8 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D11BGD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 9 Bit | 1.9 V | 表面贴装 | 450 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 8000000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | 有 | GS8662D11BGD-450 | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.5 | BGA | Commercial grade | 450 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 0 to 85 °C | GS8662D11BGD | e1 | 有 | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 8542.32.00.41 | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 72 Mbit | 2 | SYNCHRONOUS | 820 mA | Pipelined | 8 M x 9 | 1.4 mm | 9 | 21 Bit | 72 Mbit | 75497472 bit | Commercial | PARALLEL | QDR SRAM | 1.9 V | 1.7 V | 15 mm | 13 mm | |||||||||||||||
![]() | GS81302T38E-500 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | 500 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | Commercial grade | 0 to 85 °C | 1 | Pipelined | 21 Bit | 144 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161E36DGT-333IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | 200@Flow-Through/333@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 333 MHz | + 85 C | 2.7 V | - 40 C | -40 to 85 °C | Tray | GS8161E36DGT | DCD Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 4 | 260 mA, 330 mA | 5 ns | Flow-Through/Pipelined | 512 k x 36 | 19 Bit | SRAM | 18 Mbit | Industrial | SRAM |
GS81302T06E-350
GSI Technology
分类:Memory
GS881Z18CD-200V
GSI Technology
分类:Memory
GS8644Z18GE-166IV
GSI Technology
分类:Memory
GS81302D36E-250
GSI Technology
分类:Memory
GS8662R18BGD-333
GSI Technology
分类:Memory
GS81302DT07E-333
GSI Technology
分类:Memory
GS8662D11BD-450M
GSI Technology
分类:Memory
GS81302DT10GE-400
GSI Technology
分类:Memory
GS81302Q37E-200
GSI Technology
分类:Memory
GS88118CD-200IV
GSI Technology
分类:Memory
GS8161Z36DD-333
GSI Technology
分类:Memory
GS81302T10GE-300
GSI Technology
分类:Memory
GS881E32CD-300I
GSI Technology
分类:Memory
GS832218AD-150IV
GSI Technology
分类:Memory
GS832272C-150IV
GSI Technology
分类:Memory
GS8642Z72C-200V
GSI Technology
分类:Memory
GS8662QT37BD-300M
GSI Technology
分类:Memory
GS8662D11BGD-400
GSI Technology
分类:Memory
GS81302R36GE-333I
GSI Technology
分类:Memory
GS8320E36AGT-333IV
GSI Technology
分类:Memory
GS864436B-133I
GSI Technology
分类:Memory
GS8662DT06BD-450I
GSI Technology
分类:Memory
GS8662D11BGD-450
GSI Technology
分类:Memory
GS81302T38E-500
GSI Technology
分类:Memory
GS8161E36DGT-333IV
GSI Technology
分类:Memory
