品牌是'IDT' (6623)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

工厂交货时间

底架

包装/外壳

表面安装

引脚数

Current - Supply (Nom)

包装

已出版

JESD-609代码

无铅代码

零件状态

湿度敏感性等级(MSL)

终止次数

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

Reach合规守则

频率

时间@峰值回流温度-最大值(s)

JESD-30代码

资历状况

电源

温度等级

界面

内存大小

端口的数量

操作模式

电源电流-最大值

访问时间

组织结构

输出特性

内存宽度

地址总线宽度

密度

待机电流-最大值

记忆密度

访问时间(最大)

I/O类型

同步/异步

字长

待机电压-最小值

电压 - 供电 (最大值)

电压 - 供电 (最小值)

输出启用

座位高度(最大)

长度

宽度

器件厚度

辐射硬化

RoHS状态

无铅

70V7319S133BFI
70V7319S133BFI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

208

675mA

RAM, SRAM

2009

e0

no

活跃

3 (168 Hours)

208

Tin/Lead (Sn63Pb37)

85°C

-40°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

3.3V

BOTTOM

BALL

225

1

0.8mm

133MHz

INDUSTRIAL

Parallel

2

15 ns

3-STATE

18b

4 Mb

0.04A

COMMON

Synchronous

18b

3.45V

3.15V

15mm

15mm

1.4mm

符合RoHS标准

含铅

70V25L20JI
70V25L20JI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

84

195mA

RAM, SRAM

2008

e0

no

活跃

1 (Unlimited)

84

EAR99

Tin/Lead (Sn85Pb15)

85°C

-40°C

3.3V

QUAD

J BEND

225

1

INDUSTRIAL

Parallel

2

20 ns

8KX16

3-STATE

26b

128 kb

0.005A

COMMON

Asynchronous

16b

3V

3.6V

3V

29.21mm

29.21mm

3.63mm

符合RoHS标准

含铅

7142LA100J
7142LA100J
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

52

110mA

RAM, SDR, SRAM

2007

e0

no

活跃

3 (168 Hours)

52

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

AUTOMATIC POWER-DOWN

5V

QUAD

J BEND

225

1

5V

COMMERCIAL

Parallel

2kB

2

100 ns

3-STATE

22b

16 kb

0.0015A

COMMON

Asynchronous

8b

2V

5.5V

4.5V

4.57mm

19mm

19mm

3.63mm

符合RoHS标准

含铅

IDT71V2556XS133PF
IDT71V2556XS133PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

LQFP

YES

100

RAM, SRAM

2010

e0

3 (168 Hours)

100

3A991.B.2.A

锡铅

70°C

0°C

流水线结构

8542.32.00.41

3.3V

QUAD

鸥翼

240

1

0.65mm

133MHz

20

R-PQFP-G100

不合格

INDUSTRIAL

Parallel

SYNCHRONOUS

128KX36

36

4718592 bit

4.2 ns

3.465V

3.135V

1.6mm

20mm

14mm

Non-RoHS Compliant

71V321S55TF
71V321S55TF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

64

115mA

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

64

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

3.3V

QUAD

鸥翼

240

1

0.5mm

20

COMMERCIAL

Parallel

2kB

2

55 ns

3-STATE

22b

16 kb

0.005A

COMMON

Asynchronous

8b

3V

3.6V

3V

1.6mm

10mm

10mm

1.4mm

符合RoHS标准

含铅

70914S20J8
70914S20J8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

68

290mA

RAM, SRAM

Tape & Reel

2010

e0

no

活跃

1 (Unlimited)

68

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE; SELF TIMED WRITE

5V

QUAD

J BEND

225

1

50MHz

5V

COMMERCIAL

Parallel

2

20 ns

4KX9

3-STATE

12b

36 kb

0.015A

COMMON

Synchronous

9b

5.5V

4.5V

4.57mm

24mm

24mm

3.63mm

符合RoHS标准

含铅

IDT71V67603S133PF
IDT71V67603S133PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

LQFP

YES

100

RAM, SRAM

2009

e0

3 (168 Hours)

100

3A991.B.2.A

Tin/Lead (Sn85Pb15)

70°C

0°C

流水线结构

8542.32.00.41

3.3V

QUAD

鸥翼

240

1

0.65mm

not_compliant

133MHz

20

R-PQFP-G100

不合格

3.3V

COMMERCIAL

Parallel

SYNCHRONOUS

0.26mA

256KX36

3-STATE

36

0.05A

9437184 bit

4.2 ns

COMMON

3.14V

3.465V

3.135V

1.6mm

20mm

14mm

Non-RoHS Compliant

IDT7164L20Y8
IDT7164L20Y8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

28

RAM, SRAM - Asynchronous

Tape & Reel (TR)

2009

e0

3 (168 Hours)

28

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

8542.32.00.41

5V

DUAL

J BEND

225

1

1.27mm

not_compliant

30

不合格

5V

COMMERCIAL

Parallel

1

0.15mA

8KX8

3-STATE

8

0.00006A

65536 bit

19 ns

COMMON

2V

5.5V

4.5V

YES

3.556mm

17.9324mm

7.5184mm

Non-RoHS Compliant

70V657S15BC
70V657S15BC
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

256

440mA

RAM, SDR, SRAM

Bulk

2009

e0

no

活跃

3 (168 Hours)

256

Tin/Lead (Sn63Pb37)

70°C

0°C

3.3V

BOTTOM

BALL

225

1

1mm

COMMERCIAL

Parallel

128kB

2

15 ns

3-STATE

30b

1.1 Mb

0.015A

COMMON

Asynchronous

36b

3.45V

3.15V

1.5mm

17mm

17mm

1.4mm

符合RoHS标准

含铅

70914S15PF8
70914S15PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

80

300mA

RAM, SDR, SRAM

2010

e0

no

活跃

3 (168 Hours)

80

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE; SELF TIMED WRITE

5V

QUAD

鸥翼

240

1

0.65mm

50MHz

20

5V

COMMERCIAL

Parallel

4.5kB

2

15 ns

4KX9

3-STATE

24b

36 kb

0.015A

COMMON

Synchronous

9b

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

71V3558S133PFGI8
71V3558S133PFGI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

12 Weeks

表面贴装

TQFP

100

310mA

133MHz

RAM, SDR, SRAM

Tape & Reel

2006

e3

yes

活跃

3 (168 Hours)

100

Matte Tin (Sn) - annealed

85°C

-40°C

3.3V

QUAD

鸥翼

260

1

0.65mm

133MHz

30

INDUSTRIAL

Parallel

512kB

1

4.2 ns

3-STATE

18b

4.5 Mb

0.045A

COMMON

Synchronous

18b

3.465V

3.135V

20mm

14mm

1.4mm

符合RoHS标准

无铅

7027L25PFI
7027L25PFI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

305mA

RAM, SDR, SRAM

Bulk

2009

e0

no

活跃

3 (168 Hours)

100

EAR99

Tin/Lead (Sn85Pb15)

85°C

-40°C

5V

QUAD

鸥翼

240

1

0.5mm

20

5V

INDUSTRIAL

Parallel

64kB

2

25 ns

3-STATE

30b

512 kb

0.01A

COMMON

Asynchronous

16b

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

71T75802S166PFG8
71T75802S166PFG8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks

表面贴装

TQFP

100

245mA

RAM, SRAM

Tape & Reel

2012

e3

yes

活跃

3 (168 Hours)

100

Matte Tin (Sn) - annealed

70°C

0°C

流水线结构

2.5V

QUAD

鸥翼

260

1

0.65mm

166MHz

30

COMMERCIAL

Parallel

1

3.5 ns

3-STATE

20b

18 Mb

0.04A

COMMON

Synchronous

18b

2.38V

2.625V

2.375V

20mm

14mm

1.4mm

符合RoHS标准

无铅

7006L20J8
7006L20J8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

68

240mA

RAM, SDR, SRAM

2008

活跃

70°C

0°C

5V

Parallel

16kB

2

20 ns

28b

128 kb

Asynchronous

8b

5.5V

4.5V

24mm

24mm

3.63mm

符合RoHS标准

含铅

IDT70V7339S166DD
IDT70V7339S166DD
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

TQFP

YES

144

RAM, SRAM

2008

e0

4 (72 Hours)

144

3A991.B.2.A

Tin/Lead (Sn85Pb15)

70°C

0°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

8542.32.00.41

3.3V

QUAD

鸥翼

225

1

0.5mm

not_compliant

166MHz

30

S-PQFP-G144

不合格

2.5/3.33.3V

COMMERCIAL

Parallel

2

SYNCHRONOUS

0.79mA

512KX18

3-STATE

18

0.03A

9437184 bit

12 ns

COMMON

3.15V

3.45V

3.15V

1.6mm

20mm

20mm

Non-RoHS Compliant

71V65803S133BQG8
71V65803S133BQG8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

YES

165

133MHz

RAM, SDR, SRAM

2005

e1

yes

活跃

3 (168 Hours)

165

Tin/Silver/Copper (Sn/Ag/Cu)

70°C

0°C

流水线结构

3.3V

BOTTOM

BALL

260

1

133MHz

30

COMMERCIAL

Parallel

1.1MB

1

0.3mA

7.5 ns

3-STATE

19b

9 Mb

0.04A

COMMON

3.465V

3.135V

15mm

13mm

1.2mm

符合RoHS标准

无铅

70V7319S200BC
70V7319S200BC
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

256

950mA

RAM, SDR, SRAM

Bulk

2009

e0

no

活跃

3 (168 Hours)

256

Tin/Lead (Sn63Pb37)

70°C

0°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

3.3V

BOTTOM

BALL

225

1

1mm

200MHz

COMMERCIAL

Parallel

512kB

2

15 ns

3-STATE

18b

4 Mb

0.03A

COMMON

Synchronous

18b

3.45V

3.15V

1.7mm

17mm

17mm

1.4mm

符合RoHS标准

含铅

7130LA100P
7130LA100P
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

通孔

PDIP

48

110mA

RAM, SDR, SRAM

Bulk

2013

e0

no

Discontinued

1 (Unlimited)

48

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

5V

DUAL

245

1

5V

COMMERCIAL

Parallel

1kB

2

100 ns

1KX8

3-STATE

20b

8 kb

0.0015A

COMMON

Asynchronous

8b

2V

5.5V

4.5V

5.08mm

61.7mm

15.24mm

3.8mm

符合RoHS标准

含铅

IDT71V2556S100PFI8
IDT71V2556S100PFI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

LQFP

YES

100

RAM, SRAM

Tape & Reel (TR)

2010

e0

3 (168 Hours)

100

3A991.B.2.A

Tin/Lead (Sn85Pb15)

85°C

-40°C

流水线结构

8542.32.00.41

3.3V

QUAD

鸥翼

240

1

0.65mm

not_compliant

100MHz

20

R-PQFP-G100

不合格

2.53.3V

INDUSTRIAL

Parallel

SYNCHRONOUS

0.25mA

128KX36

3-STATE

36

0.045A

4718592 bit

5 ns

COMMON

3.14V

3.465V

3.135V

1.6mm

20mm

14mm

Non-RoHS Compliant

709149S8PF
709149S8PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP

80

320mA

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

80

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

5V

QUAD

鸥翼

240

1

0.65mm

62.5MHz

20

5V

COMMERCIAL

Parallel

4.5kB

2

8 ns

4KX9

3-STATE

24b

36 kb

0.015A

COMMON

Synchronous

9b

5.5V

4.5V

14mm

14mm

1.4mm

符合RoHS标准

含铅

70261S25PFI8
70261S25PFI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

345mA

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

100

EAR99

Tin/Lead (Sn85Pb15)

85°C

-40°C

SEMAPHORE

5V

QUAD

鸥翼

240

1

0.5mm

20

5V

INDUSTRIAL

Parallel

32kB

2

25 ns

16KX16

3-STATE

28b

256 kb

0.03A

COMMON

Asynchronous

16b

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

IDT71V2576S150PF
IDT71V2576S150PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

LQFP

YES

100

RAM, SRAM

2009

e0

3 (168 Hours)

100

3A991.B.2.A

Tin/Lead (Sn85Pb15)

70°C

0°C

流水线结构

8542.32.00.41

3.3V

QUAD

鸥翼

240

1

0.65mm

not_compliant

150MHz

20

R-PQFP-G100

不合格

2.53.3V

COMMERCIAL

Parallel

SYNCHRONOUS

0.295mA

128KX36

3-STATE

36

0.03A

4718592 bit

3.8 ns

COMMON

3.13V

3.465V

3.135V

1.6mm

20mm

14mm

Non-RoHS Compliant

71V67803S166PFGI8
71V67803S166PFGI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks

LQFP

100

RAM, SRAM

Tape & Reel

2009

e3

yes

活跃

3 (168 Hours)

哑光锡

85°C

-40°C

3.3V

260

166MHz

Parallel

1

19b

9 Mb

20mm

14mm

1.4mm

符合RoHS标准

无铅

71V67703S80BGGI
71V67703S80BGGI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

BGA

119

230mA

RAM, SRAM

2009

e1

yes

活跃

3 (168 Hours)

119

Tin/Silver/Copper (Sn/Ag/Cu)

85°C

-40°C

FLOW-THROUGH ARCHITECTURE

3.3V

BOTTOM

BALL

260

1

100MHz

30

INDUSTRIAL

Parallel

1

8 ns

256KX36

3-STATE

18b

9 Mb

0.07A

COMMON

Synchronous

36b

3.465V

3.135V

2.36mm

14mm

22mm

2.15mm

符合RoHS标准

无铅

71V65703S85BGI8
71V65703S85BGI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

BGA

119

60mA

RAM, SRAM

Tape & Reel

2009

e0

no

活跃

3 (168 Hours)

119

Tin/Lead (Sn63Pb37)

85°C

-40°C

FLOW-THROUGH ARCHITECTURE

3.3V

BOTTOM

BALL

225

1

91MHz

20

INDUSTRIAL

Parallel

1

8.5 ns

256KX36

3-STATE

18b

9 Mb

0.06A

COMMON

Synchronous

36b

3.465V

3.135V

2.36mm

14mm

22mm

2.15mm

符合RoHS标准

含铅