品牌是'IDT' (6623)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

工厂交货时间

底架

包装/外壳

表面安装

引脚数

Current - Supply (Nom)

包装

已出版

JESD-609代码

无铅代码

零件状态

湿度敏感性等级(MSL)

终止次数

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

Reach合规守则

频率

时间@峰值回流温度-最大值(s)

JESD-30代码

资历状况

电源

温度等级

界面

内存大小

端口的数量

操作模式

时钟频率

电源电流-最大值

访问时间

组织结构

输出特性

内存宽度

地址总线宽度

密度

待机电流-最大值

记忆密度

筛选水平

访问时间(最大)

I/O类型

同步/异步

字长

待机电压-最小值

电压 - 供电 (最大值)

电压 - 供电 (最小值)

座位高度(最大)

长度

宽度

器件厚度

辐射硬化

RoHS状态

无铅

IDT71V25761YSA183BG
IDT71V25761YSA183BG
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA

YES

119

RAM, SRAM

2009

e0

3 (168 Hours)

119

3A991.B.2.A

Tin/Lead (Sn63Pb37)

70°C

0°C

流水线结构

8542.32.00.41

3.3V

BOTTOM

BALL

未说明

1

1.27mm

not_compliant

183MHz

未说明

不合格

2.53.3V

COMMERCIAL

Parallel

SYNCHRONOUS

0.34mA

128KX36

3-STATE

36

0.03A

4718592 bit

3.3 ns

COMMON

3.14V

3.465V

3.135V

2.36mm

22mm

14mm

Non-RoHS Compliant

7140LA55PF
7140LA55PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

64

110mA

RAM, SRAM

2013

e0

no

活跃

3 (168 Hours)

64

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

5V

QUAD

鸥翼

240

1

0.8mm

20

5V

COMMERCIAL

Parallel

2

55 ns

1KX8

3-STATE

10b

8 kb

0.0015A

COMMON

Asynchronous

8b

2V

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

IDT6116SA45TPI
IDT6116SA45TPI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

DIP

NO

24

RAM, SRAM - Asynchronous

2008

e0

24

EAR99

Tin/Lead (Sn85Pb15)

85°C

-40°C

8542.32.00.41

5V

DUAL

THROUGH-HOLE

225

1

2.54mm

not_compliant

30

不合格

5V

INDUSTRIAL

Parallel

0.1mA

2KX8

3-STATE

8

0.002A

16384 bit

45 ns

COMMON

4.5V

5.5V

4.5V

4.191mm

31.75mm

7.62mm

Non-RoHS Compliant

7007L20PFI8
7007L20PFI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

80

315mA

RAM, SDR, SRAM

2010

e0

no

活跃

3 (168 Hours)

80

EAR99

Tin/Lead (Sn85Pb15)

85°C

-40°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

5V

QUAD

鸥翼

240

1

0.65mm

20

5V

INDUSTRIAL

Parallel

32kB

2

20 ns

3-STATE

30b

256 kb

0.01A

COMMON

Asynchronous

8b

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

7134LA25JI8
7134LA25JI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

52

260mA

RAM, SDR, SRAM

1999

e0

no

活跃

3 (168 Hours)

52

EAR99

Tin/Lead (Sn85Pb15)

85°C

-40°C

5V

QUAD

J BEND

225

1

5V

INDUSTRIAL

Parallel

4kB

2

25 ns

4KX8

3-STATE

24b

32 kb

0.004A

COMMON

Asynchronous

8b

2V

5.5V

4.5V

19mm

19mm

3.63mm

符合RoHS标准

含铅

IDT70T633S15DD
IDT70T633S15DD
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

TQFP

YES

144

RAM, SRAM

2008

e0

4 (72 Hours)

144

3A991.B.2.A

Tin/Lead (Sn85Pb15)

70°C

0°C

8542.32.00.41

2.5V

QUAD

鸥翼

225

1

0.5mm

not_compliant

30

S-PQFP-G144

不合格

2.52.5/3.3V

COMMERCIAL

Parallel

2

ASYNCHRONOUS

0.305mA

512KX18

3-STATE

18

0.01A

9437184 bit

15 ns

COMMON

2.4V

2.6V

2.4V

1.6mm

20mm

20mm

Non-RoHS Compliant

IDT71016S15YI
IDT71016S15YI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

RAM, SRAM - Asynchronous

2010

e0

no

3 (168 Hours)

44

3A991.B.2.B

Tin/Lead (Sn85Pb15)

85°C

-40°C

8542.32.00.41

5V

DUAL

J BEND

225

1

1.27mm

30

不合格

5V

INDUSTRIAL

Parallel

0.18mA

64KX16

3-STATE

16

0.01A

1048576 bit

15 ns

COMMON

4.5V

5.5V

4.5V

3.683mm

28.575mm

10.16mm

符合RoHS标准

709349L6PF8
709349L6PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

430mA

RAM, SDR, SRAM

2008

e0

no

活跃

3 (168 Hours)

100

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

5V

QUAD

鸥翼

240

1

0.5mm

52.6MHz

20

5V

COMMERCIAL

Parallel

9kB

2

6.5 ns

4KX18

3-STATE

12b

72 kb

0.003A

COMMON

Synchronous

18b

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

70V3389S4BCG
70V3389S4BCG
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

256

460mA

RAM, SDR, SRAM

Bulk

2009

e1

yes

活跃

3 (168 Hours)

256

Tin/Silver/Copper (Sn/Ag/Cu)

70°C

0°C

PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE

3.3V

BOTTOM

BALL

260

1

1mm

133MHz

30

COMMERCIAL

Parallel

128kB

2

4.2 ns

64KX18

3-STATE

32b

1.1 Mb

0.015A

COMMON

Synchronous

18b

3.45V

3.15V

1.7mm

17mm

17mm

1.4mm

符合RoHS标准

无铅

7140LA35L48B
7140LA35L48B
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

10 Weeks

表面贴装

LCC

48

170mA

RAM, SRAM

Military grade

Bulk

2013

e0

no

活跃

1 (Unlimited)

48

Tin/Lead (Sn/Pb)

125°C

-55°C

5V

QUAD

240

1

1.016mm

5V

MILITARY

Parallel

2

35 ns

1KX8

3-STATE

20b

8 kb

0.004A

MIL-PRF-38535

COMMON

Asynchronous

8b

2V

5.5V

4.5V

14.2mm

14.22mm

1.78mm

符合RoHS标准

含铅

70V9359L7PFI
70V9359L7PFI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

330mA

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

100

EAR99

Tin/Lead (Sn85Pb15)

85°C

-40°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

3.3V

QUAD

鸥翼

240

1

0.5mm

45.45MHz

20

INDUSTRIAL

Parallel

18kB

2

7 ns

8KX18

3-STATE

26b

144 kb

0.003A

COMMON

Synchronous

18b

3V

3.6V

3V

14mm

14mm

1.4mm

符合RoHS标准

含铅

70V3579S6BC
70V3579S6BC
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

256

310mA

RAM, SDR, SRAM

2008

e0

no

活跃

3 (168 Hours)

256

Tin/Lead (Sn63Pb37)

70°C

0°C

3.3V

BOTTOM

BALL

225

1

1mm

83MHz

COMMERCIAL

Parallel

128kB

2

6 ns

3-STATE

30b

1.1 Mb

COMMON

Synchronous

36b

3.45V

3.15V

17mm

17mm

1.4mm

符合RoHS标准

含铅

7164S85DB
7164S85DB
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

CDIP

NO

28

RAM, SRAM - Asynchronous

Military grade

Bulk

2011

e0

no

活跃

1 (Unlimited)

28

Tin/Lead (Sn63Pb37)

125°C

-55°C

5V

DUAL

THROUGH-HOLE

240

1

2.54mm

5V

MILITARY

Parallel

1

8KX8

3-STATE

13b

64 kb

0.02A

MIL-STD-883 Class B

85 ns

COMMON

37.2mm

15.24mm

1.65mm

符合RoHS标准

含铅

70V35L20PFGI8
70V35L20PFGI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

LQFP

YES

100

RAM, SRAM

Tape & Reel

2008

e3

yes

活跃

3 (168 Hours)

100

EAR99

Matte Tin (Sn)

85°C

-40°C

3.3V

QUAD

鸥翼

260

1

0.5mm

INDUSTRIAL

Parallel

2

8KX18

26b

144 kb

3.6V

3V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

无铅

70V24L35J8
70V24L35J8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

84

155mA

RAM, SDR, SRAM

2004

e0

no

活跃

1 (Unlimited)

84

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

3.3V

QUAD

J BEND

225

1

COMMERCIAL

Parallel

8kB

2

35 ns

4KX16

3-STATE

24b

64 kb

COMMON

Asynchronous

16b

2V

3.6V

3V

29.21mm

29.21mm

3.63mm

符合RoHS标准

含铅

70V3589S133DR
70V3589S133DR
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PQFP

208

400mA

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

208

Tin/Lead (Sn/Pb)

70°C

0°C

3.3V

QUAD

鸥翼

225

1

0.5mm

133MHz

COMMERCIAL

Parallel

256kB

2

25 ns

64KX36

3-STATE

32b

2.3 Mb

0.03A

COMMON

Synchronous

36b

3.45V

3.15V

28mm

28mm

3.5mm

符合RoHS标准

含铅

70V24L35PFG
70V24L35PFG
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

155mA

RAM, SDR, SRAM

Bulk

2008

e3

yes

活跃

3 (168 Hours)

100

EAR99

Matte Tin (Sn) - annealed

70°C

0°C

3.3V

QUAD

鸥翼

260

1

0.5mm

30

COMMERCIAL

Parallel

8kB

2

35 ns

4KX16

3-STATE

24b

64 kb

COMMON

Asynchronous

16b

3V

3.6V

3V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

无铅

IDT71V3577S75PFI
IDT71V3577S75PFI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

LQFP

YES

100

RAM, SRAM

2005

e0

3 (168 Hours)

100

3A991.B.2.A

Tin/Lead (Sn85Pb15)

85°C

-40°C

FLOW-THROUGH ARCHITECTURE

8542.32.00.41

3.3V

QUAD

鸥翼

240

1

0.65mm

not_compliant

20

R-PQFP-G100

不合格

INDUSTRIAL

Parallel

SYNCHRONOUS

128KX36

36

4718592 bit

7.5 ns

3.465V

3.135V

1.6mm

20mm

14mm

Non-RoHS Compliant

7006L20PF8
7006L20PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

TQFP

YES

64

RAM, SDR, SRAM

Tape & Reel

2008

e0

no

活跃

3 (168 Hours)

64

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

5V

QUAD

鸥翼

240

1

0.8mm

20

5V

COMMERCIAL

Parallel

16kB

2

20 ns

16KX8

3-STATE

28b

128 kb

0.0015A

COMMON

2V

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

709269L15PF8
709269L15PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

TQFP

YES

100

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

100

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

5V

QUAD

鸥翼

240

1

0.5mm

20

5V

COMMERCIAL

Parallel

32kB

2

40MHz

15 ns

16KX16

3-STATE

28b

256 kb

0.005A

COMMON

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

70261L20PFI8
70261L20PFI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

315mA

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

100

EAR99

Tin/Lead (Sn85Pb15)

85°C

-40°C

5V

QUAD

鸥翼

240

1

0.5mm

20

5V

INDUSTRIAL

Parallel

32kB

2

20 ns

16KX16

3-STATE

28b

256 kb

0.01A

COMMON

Asynchronous

16b

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

71V35761SA183BGI
71V35761SA183BGI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

BGA

119

350mA

183MHz

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

119

Tin/Lead (Sn63Pb37)

85°C

-40°C

流水线结构

3.3V

BOTTOM

BALL

225

1

183MHz

20

INDUSTRIAL

Parallel

512kB

1

3.3 ns

3-STATE

17b

4.5 Mb

0.035A

COMMON

Synchronous

36b

3.465V

3.135V

2.36mm

14mm

22mm

2.15mm

符合RoHS标准

含铅

71321LA25J8
71321LA25J8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

52

170mA

RAM, SDR, SRAM

2005

e0

no

活跃

3 (168 Hours)

52

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP

5V

QUAD

J BEND

225

1

5V

COMMERCIAL

Parallel

2kB

2

25 ns

3-STATE

11b

16 kb

0.0015A

COMMON

Asynchronous

8b

2V

5.5V

4.5V

19mm

19mm

3.63mm

符合RoHS标准

含铅

70V9169L7PFGI8
70V9169L7PFGI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

LQFP

YES

100

RAM, SRAM

Tape & Reel

2003

e3

yes

活跃

3 (168 Hours)

100

EAR99

Matte Tin (Sn) - annealed

85°C

-40°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

3.3V

QUAD

鸥翼

260

1

0.5mm

30

INDUSTRIAL

Parallel

2

16KX9

28b

144 kb

18 ns

3.6V

3V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

无铅

71V321S55J8
71V321S55J8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

52

115mA

RAM, SDR, SRAM

2001

e0

no

活跃

3 (168 Hours)

52

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

BATTERY BACKUP;AUTOMATIC POWER DOWN

3.3V

QUAD

J BEND

225

1

COMMERCIAL

Parallel

2kB

2

55 ns

3-STATE

22b

16 kb

0.005A

COMMON

Asynchronous

8b

3V

3.6V

3V

4.57mm

19mm

19mm

3.63mm

符合RoHS标准

含铅