品牌是'IDT' (6623)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

工厂交货时间

底架

包装/外壳

表面安装

引脚数

Current - Supply (Nom)

包装

已出版

JESD-609代码

无铅代码

零件状态

湿度敏感性等级(MSL)

终止次数

终端

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

Reach合规守则

频率

时间@峰值回流温度-最大值(s)

JESD-30代码

资历状况

电源

温度等级

界面

内存大小

端口的数量

操作模式

时钟频率

电源电流-最大值

访问时间

组织结构

输出特性

内存宽度

地址总线宽度

密度

待机电流-最大值

记忆密度

访问时间(最大)

I/O类型

同步/异步

字长

待机电压-最小值

电压 - 供电 (最大值)

电压 - 供电 (最小值)

输出启用

座位高度(最大)

长度

宽度

器件厚度

辐射硬化

RoHS状态

无铅

IDT71V416YL12PHI
IDT71V416YL12PHI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

TSOP

YES

44

RAM, SRAM - Asynchronous

2008

e0

no

3 (168 Hours)

44

3A991.B.2.A

Tin/Lead (Sn85Pb15)

85°C

-40°C

8542.32.00.41

3.3V

DUAL

鸥翼

225

1

0.8mm

not_compliant

20

R-PDSO-G44

不合格

3.3V

INDUSTRIAL

Parallel

0.17mA

256KX16

3-STATE

16

0.01A

4194304 bit

12 ns

COMMON

3V

3.6V

3V

1.2mm

18.41mm

10.16mm

Non-RoHS Compliant

71V67603S166PFG8
71V67603S166PFG8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks

TQFP

YES

100

166MHz

RAM, SDR, SRAM

Tape & Reel

2007

e3

yes

活跃

3 (168 Hours)

100

Matte Tin (Sn) - annealed

70°C

0°C

流水线结构

3.3V

QUAD

鸥翼

260

1

0.65mm

166MHz

30

COMMERCIAL

Parallel

1.1MB

1

0.34mA

3.5 ns

256KX36

3-STATE

18b

9 Mb

0.05A

COMMON

3.465V

3.135V

20mm

14mm

1.4mm

符合RoHS标准

无铅

7015L35PF
7015L35PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

80

210mA

RAM, SDR, SRAM

2010

e0

no

活跃

3 (168 Hours)

80

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

5V

QUAD

鸥翼

240

1

0.65mm

20

5V

COMMERCIAL

Parallel

9kB

2

35 ns

8KX9

3-STATE

26b

72 kb

0.005A

COMMON

Asynchronous

9b

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

IDT71V3577S80PF
IDT71V3577S80PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP

100

200mA

RAM, SRAM

2005

e0

3 (168 Hours)

100

70°C

0°C

FLOW-THROUGH ARCHITECTURE

3.3V

QUAD

鸥翼

240

1

0.65mm

not_compliant

100MHz

20

不合格

COMMERCIAL

Parallel

1

8 ns

3-STATE

36

17b

4.5 Mb

0.03A

COMMON

Synchronous

36b

3.465V

3.135V

20mm

Non-RoHS Compliant

IDT71V256SA20YG
IDT71V256SA20YG
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

28

85mA

RAM, SRAM, SRAM - Asynchronous

Rail/Tube

2010

e3

yes

28

SMD/SMT

EAR99

哑光锡

70°C

0°C

3.3V

DUAL

J BEND

260

1

30

不合格

COMMERCIAL

Parallel

32kB

1

20 ns

32KX8

3-STATE

8

15b

256 kb

Asynchronous

8b

3.6V

3V

YES

3.556mm

符合RoHS标准

709379L7PF
709379L7PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

465mA

RAM, SDR, SRAM

Bulk

2009

活跃

70°C

0°C

5V

83.3MHz

Parallel

72kB

2

7.5 ns

30b

576 kb

Synchronous

18b

5.5V

4.5V

14mm

14mm

1.4mm

符合RoHS标准

含铅

71V321S35PF8
71V321S35PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

64

125mA

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

64

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

BATTERY BACKUP;AUTOMATIC POWER DOWN

3.3V

QUAD

鸥翼

240

1

0.8mm

20

COMMERCIAL

Parallel

2kB

2

35 ns

3-STATE

22b

16 kb

0.005A

COMMON

Asynchronous

8b

3V

3.6V

3V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

7140LA35PF8
7140LA35PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

64

120mA

RAM, SDR, SRAM

2013

e0

no

活跃

3 (168 Hours)

64

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

5V

QUAD

鸥翼

240

1

0.8mm

20

5V

COMMERCIAL

Parallel

1kB

2

35 ns

1KX8

3-STATE

20b

8 kb

0.0015A

COMMON

Asynchronous

8b

2V

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

7025S35J8
7025S35J8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

84

250mA

RAM, SDR, SRAM

2008

e0

no

活跃

1 (Unlimited)

84

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE

5V

QUAD

J BEND

225

1

5V

COMMERCIAL

Parallel

16kB

2

35 ns

8KX16

3-STATE

26b

128 kb

0.015A

COMMON

Asynchronous

16b

5.5V

4.5V

4.57mm

29.21mm

29.21mm

3.63mm

符合RoHS标准

含铅

IDT71V256SA12YI8
IDT71V256SA12YI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

28

RAM, SRAM - Asynchronous

Tape & Reel (TR)

2010

e0

no

3 (168 Hours)

28

EAR99

Tin/Lead (Sn85Pb15)

85°C

-40°C

8542.32.00.41

3.3V

DUAL

J BEND

225

1

1.27mm

not_compliant

30

不合格

3.3V

INDUSTRIAL

Parallel

0.09mA

32KX8

3-STATE

8

0.002A

262144 bit

12 ns

COMMON

3V

3.6V

3V

3.556mm

17.9324mm

7.5184mm

Non-RoHS Compliant

70V9269S7PRFI
70V9269S7PRFI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

128

370mA

RAM, SDR, SRAM

Bulk

2008

e0

no

活跃

3 (168 Hours)

128

EAR99

Tin/Lead (Sn85Pb15)

85°C

-40°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

3.3V

QUAD

鸥翼

225

1

0.5mm

100MHz

20

INDUSTRIAL

Parallel

32kB

2

7 ns

16KX16

3-STATE

14b

512 kb

COMMON

Synchronous

16b

3V

3.6V

3V

1.6mm

20mm

14mm

1.4mm

符合RoHS标准

含铅

70V9079L12PF
70V9079L12PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

205mA

RAM, SDR, SRAM

Bulk

2009

e0

no

活跃

3 (168 Hours)

100

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

3.3V

QUAD

鸥翼

240

1

33.3MHz

COMMERCIAL

Parallel

32kB

2

12 ns

30b

256 kb

Synchronous

8b

3.6V

3V

14mm

14mm

1.4mm

符合RoHS标准

含铅

IDT71V416L12PHI8
IDT71V416L12PHI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TSOP

44

170mA

RAM, SRAM - Asynchronous

卷带

2007

e0

no

3 (168 Hours)

44

85°C

-40°C

3.3V

DUAL

鸥翼

225

1

0.8mm

not_compliant

20

不合格

INDUSTRIAL

Parallel

1

12 ns

3-STATE

16

18b

4 Mb

COMMON

Asynchronous

16b

3V

3.6V

3V

Non-RoHS Compliant

7024L20PFI8
7024L20PFI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

TQFP

YES

100

RAM, SDR, SRAM

2000

e0

no

活跃

3 (168 Hours)

100

EAR99

Tin/Lead (Sn85Pb15)

85°C

-40°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

5V

QUAD

鸥翼

240

1

0.5mm

20

5V

INDUSTRIAL

Parallel

8kB

2

20 ns

4KX16

3-STATE

24b

64 kb

0.0015A

COMMON

2V

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

IDT71V416YS10PH
IDT71V416YS10PH
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

TSOP

YES

RAM, SRAM - Asynchronous

2008

e0

3 (168 Hours)

44

Tin/Lead (Sn85Pb15)

70°C

0°C

3.3V

DUAL

鸥翼

0.8mm

not_compliant

R-PDSO-G44

不合格

3.3V

COMMERCIAL

Parallel

0.2mA

256KX16

3-STATE

16

0.02A

4194304 bit

10 ns

COMMON

3V

Non-RoHS Compliant

70V07S25PF
70V07S25PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

80

170mA

RAM, SDR, SRAM

2005

e0

no

活跃

3 (168 Hours)

80

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

3.3V

QUAD

鸥翼

240

1

0.65mm

20

不合格

COMMERCIAL

Parallel

32kB

2

25 ns

3-STATE

30b

256 kb

0.006A

COMMON

Asynchronous

8b

3V

3.6V

3V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

7132SA25J
7132SA25J
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

52

220mA

RAM, SDR, SRAM

2007

活跃

70°C

0°C

5V

Parallel

2kB

2

25 ns

22b

16 kb

Asynchronous

8b

5.5V

4.5V

19mm

19mm

3.63mm

符合RoHS标准

含铅

70V658S15BC8
70V658S15BC8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

256

440mA

RAM, SRAM

Tape & Reel

2009

e0

no

活跃

3 (168 Hours)

256

Tin/Lead (Sn63Pb37)

70°C

0°C

3.3V

BOTTOM

BALL

225

1

1mm

COMMERCIAL

Parallel

2

15 ns

64KX36

3-STATE

32b

2.3 Mb

0.015A

COMMON

Asynchronous

36b

3.45V

3.15V

1.5mm

17mm

17mm

1.4mm

符合RoHS标准

含铅

7130LA55P
7130LA55P
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

通孔

PDIP

48

110mA

RAM, SDR, SRAM

Bulk

2013

e0

no

Discontinued

1 (Unlimited)

48

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

5V

DUAL

245

1

5V

COMMERCIAL

Parallel

1kB

2

55 ns

1KX8

3-STATE

20b

8 kb

0.0015A

COMMON

Asynchronous

8b

2V

5.5V

4.5V

5.08mm

61.7mm

15.24mm

3.8mm

符合RoHS标准

含铅

IDT71V67603S133PFI8
IDT71V67603S133PFI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

LQFP

YES

100

RAM, SRAM

Tape & Reel (TR)

2009

e0

3 (168 Hours)

100

3A991.B.2.A

Tin/Lead (Sn85Pb15)

85°C

-40°C

流水线结构

8542.32.00.41

3.3V

QUAD

鸥翼

240

1

0.65mm

not_compliant

133MHz

20

R-PQFP-G100

不合格

3.3V

INDUSTRIAL

Parallel

SYNCHRONOUS

0.28mA

256KX36

3-STATE

36

0.07A

9437184 bit

4.2 ns

COMMON

3.14V

3.465V

3.135V

1.6mm

20mm

14mm

Non-RoHS Compliant

IDT71V65802S100BG
IDT71V65802S100BG
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA

YES

119

RAM, SRAM

2007

e0

3 (168 Hours)

119

3A991.B.2.A

Tin/Lead (Sn63Pb37)

70°C

0°C

流水线结构

8542.32.00.41

3.3V

BOTTOM

BALL

未说明

1

1.27mm

not_compliant

100MHz

未说明

不合格

3.3V

COMMERCIAL

Parallel

SYNCHRONOUS

0.25mA

512KX18

3-STATE

18

0.04A

9437184 bit

5 ns

COMMON

3.465V

3.135V

2.36mm

22mm

14mm

Non-RoHS Compliant

IDT71V3577S85PF
IDT71V3577S85PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

LQFP

YES

100

RAM, SRAM

2005

e0

3 (168 Hours)

100

3A991.B.2.A

Tin/Lead (Sn85Pb15)

70°C

0°C

FLOW-THROUGH ARCHITECTURE

8542.32.00.41

3.3V

QUAD

鸥翼

240

1

0.65mm

not_compliant

20

R-PQFP-G100

不合格

3.3V

COMMERCIAL

Parallel

SYNCHRONOUS

87MHz

0.18mA

128KX36

3-STATE

36

0.03A

4718592 bit

8.5 ns

COMMON

3.14V

3.465V

3.135V

1.6mm

20mm

14mm

Non-RoHS Compliant

70V25L25PF
70V25L25PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

165mA

RAM, SDR, SRAM

2008

e0

no

活跃

3 (168 Hours)

100

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

3.3V

QUAD

鸥翼

240

1

0.5mm

20

COMMERCIAL

Parallel

16kB

2

25 ns

8KX16

3-STATE

26b

128 kb

COMMON

Asynchronous

16b

3V

3.6V

3V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

70V5388S133BG
70V5388S133BG
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA

272

320mA

RAM, SDR, SRAM

2008

e3

yes

Discontinued

272

Matte Tin (Sn)

70°C

0°C

3.3V

BOTTOM

BALL

260

1

133MHz

30

COMMERCIAL

Parallel

128kB

4

7.5 ns

3-STATE

16b

1.1 Mb

0.015A

COMMON

Synchronous

18b

3.45V

3.15V

27mm

27mm

2mm

符合RoHS标准

含铅

71T75602S133BGGI8
71T75602S133BGGI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks

表面贴装

BGA

119

215mA

133MHz

RAM, SDR, SRAM

2012

e1

yes

活跃

3 (168 Hours)

119

Tin/Silver/Copper (Sn/Ag/Cu)

85°C

-40°C

流水线结构

2.5V

BOTTOM

BALL

260

1

133MHz

30

INDUSTRIAL

Parallel

2.3MB

1

4.2 ns

3-STATE

19b

18 Mb

0.06A

COMMON

Synchronous

36b

2.38V

2.625V

2.375V

2.36mm

14mm

22mm

2.15mm

符合RoHS标准

无铅