品牌是'IDT' (6623)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

工厂交货时间

底架

包装/外壳

表面安装

引脚数

Current - Supply (Nom)

包装

已出版

JESD-609代码

无铅代码

零件状态

湿度敏感性等级(MSL)

终止次数

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

Reach合规守则

频率

时间@峰值回流温度-最大值(s)

JESD-30代码

资历状况

电源

温度等级

界面

内存大小

端口的数量

操作模式

时钟频率

电源电流-最大值

访问时间

组织结构

输出特性

内存宽度

地址总线宽度

密度

待机电流-最大值

记忆密度

访问时间(最大)

I/O类型

同步/异步

字长

待机电压-最小值

电压 - 供电 (最大值)

电压 - 供电 (最小值)

座位高度(最大)

长度

宽度

器件厚度

辐射硬化

RoHS状态

无铅

7024S20J8
7024S20J8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

PLCC

YES

84

RAM, SDR, SRAM

2013

e0

no

活跃

1 (Unlimited)

84

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

5V

QUAD

J BEND

225

1

5V

COMMERCIAL

Parallel

8kB

2

20 ns

4KX16

3-STATE

24b

64 kb

0.015A

COMMON

5.5V

4.5V

4.57mm

29.21mm

29.21mm

3.63mm

符合RoHS标准

含铅

70V3589S166BC8
70V3589S166BC8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

256

500mA

RAM, SRAM

Tape & Reel

2009

e0

no

活跃

3 (168 Hours)

256

Tin/Lead (Sn63Pb37)

70°C

0°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

3.3V

BOTTOM

BALL

1

1mm

166MHz

COMMERCIAL

Parallel

2

12 ns

64KX36

3-STATE

32b

2.3 Mb

0.03A

COMMON

Synchronous

36b

3.45V

3.15V

1.7mm

17mm

17mm

1.4mm

符合RoHS标准

含铅

71V3556SA100BGG
71V3556SA100BGG
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

BGA

119

250mA

100MHz

RAM, SDR, SRAM

2006

e1

yes

活跃

3 (168 Hours)

119

Tin/Silver/Copper (Sn/Ag/Cu)

70°C

0°C

3.3V

BOTTOM

BALL

260

1

100MHz

30

COMMERCIAL

Parallel

512kB

1

5 ns

3-STATE

17b

4.5 Mb

0.04A

COMMON

Synchronous

36b

3.465V

3.135V

2.36mm

14mm

22mm

2.15mm

符合RoHS标准

无铅

7006S55PF
7006S55PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

64

250mA

RAM, SDR, SRAM

2008

e0

no

活跃

3 (168 Hours)

64

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

5V

QUAD

鸥翼

240

1

0.8mm

20

5V

COMMERCIAL

Parallel

16kB

2

55 ns

16KX8

3-STATE

28b

128 kb

0.015A

COMMON

Asynchronous

8b

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

71V3556SA166BGG
71V3556SA166BGG
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

BGA

119

350mA

166MHz

RAM, SDR, SRAM

2006

e1

yes

活跃

3 (168 Hours)

119

Tin/Silver/Copper (Sn/Ag/Cu)

70°C

0°C

3.3V

BOTTOM

BALL

260

1

166MHz

30

COMMERCIAL

Parallel

512kB

1

3.5 ns

3-STATE

17b

4.5 Mb

0.04A

COMMON

Synchronous

36b

3.465V

3.135V

2.36mm

14mm

22mm

2.15mm

符合RoHS标准

无铅

IDT71V424YL15PH
IDT71V424YL15PH
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

TSOP

YES

44

RAM, SRAM - Asynchronous

2009

e3

yes

3 (168 Hours)

44

3A991.B.2.A

Matte Tin (Sn) - annealed

70°C

0°C

8542.32.00.41

3.3V

DUAL

鸥翼

260

1

0.8mm

30

R-PDSO-G44

不合格

3.3V

INDUSTRIAL

Parallel

0.145mA

512KX8

3-STATE

8

0.01A

4194304 bit

15 ns

COMMON

3V

3.6V

3V

1.2mm

18.41mm

10.16mm

Non-RoHS Compliant

70V9269S15PRF
70V9269S15PRF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

128

220mA

RAM, SDR, SRAM

2008

e0

no

活跃

3 (168 Hours)

128

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

3.3V

QUAD

鸥翼

225

0.5mm

28.5MHz

COMMERCIAL

Parallel

32kB

2

15 ns

16KX16

3-STATE

28b

256 kb

0.005A

COMMON

Synchronous

16b

3V

3.6V

3V

20mm

14mm

1.4mm

符合RoHS标准

含铅

IDT70824L20PF
IDT70824L20PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

LQFP

YES

80

RAM

2009

e0

3 (168 Hours)

80

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

8542.32.00.41

5V

QUAD

鸥翼

240

1

0.65mm

not_compliant

20

S-PQFP-G80

不合格

5V

COMMERCIAL

Parallel

ASYNCHRONOUS

0.33mA

4KX16

16

0.0015A

65536 bit

20 ns

5.5V

4.5V

1.6mm

14mm

14mm

Non-RoHS Compliant

7028L15PF8
7028L15PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

340mA

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

100

Tin/Lead (Sn85Pb15)

70°C

0°C

5V

QUAD

鸥翼

240

1

0.5mm

20

5V

COMMERCIAL

Parallel

128kB

2

15 ns

64KX16

3-STATE

32b

1 Mb

0.003A

COMMON

Asynchronous

16b

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

7054L20PRF8
7054L20PRF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

128

250mA

RAM, SRAM

Tape & Reel

2009

e0

no

活跃

3 (168 Hours)

128

EAR99

Tin/Lead (Sn/Pb)

70°C

0°C

AUTOMATIC POWER DOWN; LOW POWER STANDBY MODE

5V

QUAD

鸥翼

225

1

0.5mm

5V

COMMERCIAL

Parallel

4

20 ns

3-STATE

12b

32 kb

0.0015A

COMMON

Asynchronous

8b

2V

5.5V

4.5V

1.6mm

20mm

14mm

1.4mm

符合RoHS标准

含铅

70V08S20PF
70V08S20PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

255mA

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

100

Tin/Lead (Sn85Pb15)

70°C

0°C

3.3V

QUAD

鸥翼

240

1

0.5mm

20

COMMERCIAL

Parallel

64kB

2

20 ns

64KX8

3-STATE

16b

512 kb

0.006A

COMMON

Asynchronous

8b

3V

3.6V

3V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

71321LA45J8
71321LA45J8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

52

RAM, SDR, SRAM

2008

活跃

70°C

0°C

5V

Parallel

2kB

2

45 ns

11b

16 kb

Asynchronous

8b

5.5V

4.5V

19mm

19mm

3.63mm

符合RoHS标准

含铅

70V9359L9PF
70V9359L9PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

TQFP

YES

100

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

100

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

3.3V

QUAD

鸥翼

240

1

0.5mm

20

COMMERCIAL

Parallel

18kB

2

9 ns

8KX18

3-STATE

26b

144 kb

0.003A

COMMON

3V

3.6V

3V

14mm

14mm

1.4mm

符合RoHS标准

含铅

7038L20PFGI
7038L20PFGI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

360mA

RAM, SDR, SRAM

Bulk

2009

e3

yes

活跃

3 (168 Hours)

100

Matte Tin (Sn) - annealed

85°C

-40°C

5V

QUAD

鸥翼

260

1

0.5mm

30

5V

INDUSTRIAL

Parallel

128kB

2

20 ns

64KX18

3-STATE

16b

1.1 Mb

0.003A

COMMON

Asynchronous

18b

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

无铅

71V547S100PFGI8
71V547S100PFGI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

12 Weeks

表面贴装

TQFP

100

210mA

66MHz

RAM, SDR, SRAM

Tape & Reel

2015

e3

yes

活跃

3 (168 Hours)

100

Matte Tin (Sn) - annealed

85°C

0°C

FLOW-THROUGH

3.3V

QUAD

FLAT

260

1

0.635mm

66.6MHz

30

INDUSTRIAL

Parallel

512kB

1

10 ns

3-STATE

17b

4.5 Mb

0.045A

COMMON

Synchronous

36b

3.465V

3.135V

20mm

14mm

1.4mm

符合RoHS标准

无铅

IDT71V3556S133BGI
IDT71V3556S133BGI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA

YES

119

RAM, SRAM

2007

e0

3 (168 Hours)

119

3A991.B.2.A

Tin/Lead (Sn63Pb37)

85°C

-40°C

8542.32.00.41

3.3V

BOTTOM

BALL

未说明

1

1.27mm

not_compliant

133MHz

未说明

不合格

3.3V

INDUSTRIAL

Parallel

SYNCHRONOUS

0.31mA

128KX36

3-STATE

36

0.045A

4718592 bit

4.2 ns

COMMON

3.14V

3.465V

3.135V

2.36mm

22mm

14mm

Non-RoHS Compliant

IDT71T75902S75PF8
IDT71T75902S75PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

LQFP

YES

100

RAM, SRAM

Tape & Reel (TR)

2005

e0

3 (168 Hours)

100

3A991.B.2.A

Tin/Lead (Sn85Pb15)

70°C

0°C

FLOW-THROUGH ARCHITECTURE

8542.32.00.41

2.5V

QUAD

鸥翼

240

1

0.65mm

not_compliant

20

R-PQFP-G100

不合格

2.5V

COMMERCIAL

Parallel

SYNCHRONOUS

100MHz

0.275mA

1MX18

3-STATE

18

0.04A

18874368 bit

7.5 ns

COMMON

2.38V

2.625V

2.375V

1.6mm

20mm

14mm

Non-RoHS Compliant

70T3589S133BC
70T3589S133BC
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

256

370mA

RAM, SRAM

2009

e0

no

活跃

3 (168 Hours)

256

Tin/Lead (Sn63Pb37)

70°C

0°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

2.5V

BOTTOM

BALL

225

1

1mm

133MHz

COMMERCIAL

Parallel

2

15 ns

64KX36

3-STATE

32b

2.3 Mb

0.015A

COMMON

Synchronous

36b

2.6V

2.4V

1.5mm

17mm

17mm

1.4mm

符合RoHS标准

含铅

IDT71T75902S80BGI
IDT71T75902S80BGI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA

YES

119

RAM, SRAM

2005

e0

3 (168 Hours)

119

3A991.B.2.A

Tin/Lead (Sn63Pb37)

85°C

-40°C

FLOW-THROUGH ARCHITECTURE

8542.32.00.41

2.5V

BOTTOM

BALL

未说明

1

1.27mm

not_compliant

未说明

不合格

2.5V

INDUSTRIAL

Parallel

SYNCHRONOUS

95MHz

0.27mA

1MX18

3-STATE

18

0.06A

18874368 bit

8 ns

COMMON

2.38V

2.625V

2.375V

2.36mm

22mm

14mm

Non-RoHS Compliant

71V3557S85PFG8
71V3557S85PFG8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

12 Weeks

表面贴装

TQFP

100

225mA

100MHz

RAM, SDR, SRAM

Tape & Reel

2009

e3

yes

活跃

3 (168 Hours)

100

Matte Tin (Sn) - annealed

70°C

0°C

FLOW-THROUGH ARCHITECTURE

3.3V

QUAD

鸥翼

260

1

0.65mm

91MHz

30

COMMERCIAL

Parallel

512kB

1

8.5 ns

3-STATE

17b

4.5 Mb

0.04A

COMMON

Synchronous

36b

3.465V

3.135V

20mm

14mm

1.4mm

符合RoHS标准

无铅

IDT71T75902S80BGI8
IDT71T75902S80BGI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA

YES

119

RAM, SRAM

Tape & Reel (TR)

2005

e0

3 (168 Hours)

119

3A991.B.2.A

Tin/Lead (Sn63Pb37)

85°C

-40°C

FLOW-THROUGH ARCHITECTURE

8542.32.00.41

2.5V

BOTTOM

BALL

未说明

1

1.27mm

not_compliant

未说明

不合格

2.5V

INDUSTRIAL

Parallel

SYNCHRONOUS

95MHz

0.27mA

1MX18

3-STATE

18

0.06A

18874368 bit

8 ns

COMMON

2.38V

2.625V

2.375V

2.36mm

22mm

14mm

Non-RoHS Compliant

7008S20J8
7008S20J8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

84

325mA

RAM, SDR, SRAM

2010

e0

no

活跃

1 (Unlimited)

84

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE

5V

QUAD

J BEND

225

1

5V

COMMERCIAL

Parallel

64kB

2

20 ns

64KX8

3-STATE

32b

512 kb

0.015A

COMMON

Asynchronous

8b

5.5V

4.5V

4.57mm

29.21mm

29.21mm

3.63mm

符合RoHS标准

含铅

7024L35PF8
7024L35PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

210mA

RAM, SDR, SRAM

2000

e0

no

活跃

3 (168 Hours)

100

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

5V

QUAD

鸥翼

240

1

0.5mm

20

5V

COMMERCIAL

Parallel

8kB

2

35 ns

4KX16

3-STATE

24b

64 kb

0.0015A

COMMON

Asynchronous

16b

2V

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

71V25761S200BG8
71V25761S200BG8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

BGA

119

360mA

RAM, SRAM

Tape & Reel

2009

e0

no

3 (168 Hours)

119

Tin/Lead (Sn63Pb37)

70°C

0°C

流水线结构

3.3V

BOTTOM

BALL

225

1

200MHz

20

COMMERCIAL

Parallel

1

3.1 ns

3-STATE

17b

4.5 Mb

0.03A

COMMON

Synchronous

36b

3.465V

3.135V

2.36mm

14mm

22mm

2.15mm

符合RoHS标准

含铅

IDT71V25761S166PF8
IDT71V25761S166PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

LQFP

YES

100

RAM, SRAM

Tape & Reel (TR)

2009

e0

3 (168 Hours)

100

3A991.B.2.A

Tin/Lead (Sn85Pb15)

70°C

0°C

流水线结构

8542.32.00.41

3.3V

QUAD

鸥翼

240

1

0.65mm

not_compliant

166MHz

20

R-PQFP-G100

不合格

2.53.3V

COMMERCIAL

Parallel

SYNCHRONOUS

0.32mA

128KX36

3-STATE

36

0.03A

4718592 bit

3.5 ns

COMMON

3.14V

3.465V

3.135V

1.6mm

20mm

14mm

Non-RoHS Compliant