品牌是'IDT' (6623)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

工厂交货时间

底架

包装/外壳

表面安装

引脚数

Current - Supply (Nom)

包装

已出版

JESD-609代码

无铅代码

零件状态

湿度敏感性等级(MSL)

终止次数

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

Reach合规守则

频率

时间@峰值回流温度-最大值(s)

JESD-30代码

资历状况

电源

温度等级

界面

内存大小

端口的数量

操作模式

时钟频率

电源电流-最大值

访问时间

组织结构

输出特性

内存宽度

地址总线宽度

密度

待机电流-最大值

记忆密度

访问时间(最大)

I/O类型

同步/异步

字长

待机电压-最小值

电压 - 供电 (最大值)

电压 - 供电 (最小值)

输出启用

座位高度(最大)

长度

宽度

器件厚度

辐射硬化

RoHS状态

无铅

7014S15J
7014S15J
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

52

250mA

RAM, SDR, SRAM

2008

e0

no

活跃

3 (168 Hours)

52

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

LOW POWER STANDBY MODE; BATTERY BACK-UP

5V

QUAD

J BEND

225

1

5V

COMMERCIAL

Parallel

4.5kB

2

15 ns

4KX9

3-STATE

24b

36 kb

COMMON

Asynchronous

9b

5.5V

4.5V

19mm

19mm

3.63mm

无

符合RoHS标准

含铅

IDT71V124SA12PH8
IDT71V124SA12PH8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

SOIC

YES

32

RAM, SRAM - Asynchronous

Tape & Reel (TR)

2007

e0

no

3 (168 Hours)

32

3A991.B.2.B

Tin/Lead (Sn85Pb15)

70°C

0°C

8542.32.00.41

3.3V

DUAL

鸥翼

225

1

1.27mm

not_compliant

30

R-PDSO-G32

不合格

3.3V

COMMERCIAL

Parallel

0.13mA

128KX8

3-STATE

8

0.01A

1048576 bit

12 ns

COMMON

3V

3.6V

3.15V

1.2mm

20.95mm

10.16mm

Non-RoHS Compliant

70V9289L9PRF
70V9289L9PRF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

128

230mA

83MHz

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

128

Tin/Lead (Sn85Pb15)

70°C

-40°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

3.3V

QUAD

鸥翼

225

1

0.5mm

40MHz

COMMERCIAL

Parallel

128kB

2

9 ns

64KX16

3-STATE

32b

1 Mb

COMMON

Synchronous

16b

3V

3.6V

3V

20mm

14mm

1.4mm

无

符合RoHS标准

含铅

IDT71V3556S100BQGI8
IDT71V3556S100BQGI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

165

RAM, SRAM

Tape & Reel (TR)

2007

e1

3 (168 Hours)

165

Tin/Silver/Copper (Sn/Ag/Cu)

85°C

-40°C

3.3V

BOTTOM

BALL

1mm

unknown

100MHz

不合格

3.3V

INDUSTRIAL

Parallel

SYNCHRONOUS

0.255mA

128KX36

3-STATE

36

0.045A

4718592 bit

5 ns

COMMON

3.14V

符合RoHS标准

7008S55J
7008S55J
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

84

270mA

RAM, SDR, SRAM

2010

e0

no

活跃

1 (Unlimited)

84

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

5V

QUAD

J BEND

225

1

5V

COMMERCIAL

Parallel

64kB

2

55 ns

64KX8

3-STATE

32b

512 kb

0.015A

COMMON

Asynchronous

8b

5.5V

4.5V

4.57mm

29.21mm

29.21mm

3.63mm

无

符合RoHS标准

含铅

70V24S55J
70V24S55J
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

84

180mA

RAM, SDR, SRAM

2004

e0

no

活跃

1 (Unlimited)

84

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

3.3V

QUAD

J BEND

225

1

COMMERCIAL

Parallel

8kB

2

55 ns

4KX16

3-STATE

24b

64 kb

0.005A

COMMON

Asynchronous

16b

3V

3.6V

3V

29.21mm

29.21mm

3.63mm

无

符合RoHS标准

含铅

IDT71T75702S80PF8
IDT71T75702S80PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

LQFP

YES

100

RAM, SRAM

Tape & Reel (TR)

2005

e0

3 (168 Hours)

100

3A991.B.2.A

Tin/Lead (Sn85Pb15)

70°C

0°C

FLOW-THROUGH ARCHITECTURE

8542.32.00.41

2.5V

QUAD

鸥翼

240

1

0.65mm

not_compliant

20

R-PQFP-G100

不合格

2.5V

COMMERCIAL

Parallel

SYNCHRONOUS

95MHz

0.25mA

512KX36

3-STATE

36

0.04A

18874368 bit

8 ns

COMMON

2.38V

2.625V

2.375V

1.6mm

20mm

14mm

Non-RoHS Compliant

70V24S35PF8
70V24S35PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

TQFP

YES

100

RAM, SDR, SRAM

2004

e0

no

活跃

3 (168 Hours)

100

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

3.3V

QUAD

鸥翼

240

1

0.5mm

20

COMMERCIAL

Parallel

8kB

2

0.18mA

35 ns

4KX16

3-STATE

24b

64 kb

0.005A

COMMON

3V

3.6V

3V

1.6mm

14mm

14mm

1.4mm

无

符合RoHS标准

含铅

IDT71V3556S100PF8
IDT71V3556S100PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

LQFP

YES

100

RAM, SRAM

Tape & Reel (TR)

2007

e0

3 (168 Hours)

100

3A991.B.2.A

Tin/Lead (Sn85Pb15)

70°C

0°C

8542.32.00.41

3.3V

QUAD

鸥翼

240

1

0.65mm

not_compliant

100MHz

20

R-PQFP-G100

不合格

3.3V

COMMERCIAL

Parallel

SYNCHRONOUS

0.25mA

128KX36

3-STATE

36

0.04A

4718592 bit

5 ns

COMMON

3.14V

3.465V

3.135V

1.6mm

20mm

14mm

Non-RoHS Compliant

7024S55JI8
7024S55JI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

84

300mA

RAM, SDR, SRAM

2000

e0

no

活跃

1 (Unlimited)

84

EAR99

Tin/Lead (Sn85Pb15)

85°C

-40°C

备用电池操作

5V

QUAD

J BEND

225

1

5V

INDUSTRIAL

Parallel

8kB

2

55 ns

4KX16

3-STATE

24b

64 kb

0.03A

COMMON

Asynchronous

16b

5.5V

4.5V

4.57mm

29.21mm

29.21mm

3.63mm

无

符合RoHS标准

含铅

71421LA55PF
71421LA55PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

64

110mA

RAM, SDR, SRAM

2008

e0

no

活跃

3 (168 Hours)

64

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP

5V

QUAD

鸥翼

240

1

0.8mm

20

5V

COMMERCIAL

Parallel

2kB

2

55 ns

3-STATE

22b

16 kb

0.0015A

COMMON

Asynchronous

8b

2V

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

无

符合RoHS标准

含铅

7008L25J
7008L25J
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

84

265mA

RAM, SDR, SRAM

Bulk

2010

e0

no

活跃

1 (Unlimited)

84

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

5V

QUAD

J BEND

225

1

5V

COMMERCIAL

Parallel

64kB

2

25 ns

64KX8

3-STATE

32b

512 kb

0.005A

COMMON

Asynchronous

8b

5.5V

4.5V

4.57mm

29.21mm

29.21mm

3.63mm

无

符合RoHS标准

含铅

IDT71V416YL12PH
IDT71V416YL12PH
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

TSOP

YES

44

RAM, SRAM - Asynchronous

2008

e0

no

3 (168 Hours)

44

3A991.B.2.A

Tin/Lead (Sn85Pb15)

70°C

0°C

8542.32.00.41

3.3V

DUAL

鸥翼

225

1

0.8mm

not_compliant

20

R-PDSO-G44

不合格

3.3V

COMMERCIAL

Parallel

0.17mA

256KX16

3-STATE

16

0.01A

4194304 bit

12 ns

COMMON

3V

3.6V

3V

1.2mm

18.41mm

10.16mm

Non-RoHS Compliant

IDT71V3559S75PF8
IDT71V3559S75PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

LQFP

YES

100

RAM, SRAM

Tape & Reel (TR)

2009

e0

3 (168 Hours)

100

3A991.B.2.A

Tin/Lead (Sn85Pb15)

70°C

0°C

FLOW-THROUGH ARCHITECTURE

8542.32.00.41

3.3V

QUAD

鸥翼

240

1

0.65mm

not_compliant

20

R-PQFP-G100

不合格

3.3V

COMMERCIAL

Parallel

SYNCHRONOUS

100MHz

0.275mA

256KX18

3-STATE

18

0.04A

4718592 bit

7.5 ns

COMMON

3.14V

3.465V

3.135V

1.6mm

20mm

14mm

Non-RoHS Compliant

IDT71T75702S75PFG8
IDT71T75702S75PFG8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

LQFP

YES

100

RAM, SRAM

Tape & Reel (TR)

2005

e3

100

3A991.B.2.A

哑光锡

70°C

0°C

FLOW-THROUGH ARCHITECTURE

8542.32.00.41

2.5V

QUAD

鸥翼

1

0.65mm

R-PQFP-G100

不合格

2.5V

COMMERCIAL

Parallel

SYNCHRONOUS

100MHz

0.275mA

512KX36

3-STATE

36

0.04A

18874368 bit

7.5 ns

COMMON

2.38V

2.625V

2.375V

1.6mm

20mm

14mm

符合RoHS标准

IDT71016S15Y8
IDT71016S15Y8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

RAM, SRAM - Asynchronous

Tape & Reel (TR)

2010

e0

no

3 (168 Hours)

44

3A991.B.2.B

Tin/Lead (Sn85Pb15)

70°C

0°C

8542.32.00.41

5V

DUAL

J BEND

225

1

1.27mm

not_compliant

30

不合格

5V

COMMERCIAL

Parallel

1

0.18mA

64KX16

3-STATE

16

0.01A

1048576 bit

15 ns

COMMON

4.5V

5.5V

4.5V

YES

3.683mm

28.575mm

10.16mm

Non-RoHS Compliant

71V424L10YGI8
71V424L10YGI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

12 Weeks

表面贴装

36

RAM, SDR, SRAM - Asynchronous

2009

e3

yes

活跃

3 (168 Hours)

36

Matte Tin (Sn) - annealed

85°C

-40°C

3.3V

DUAL

J BEND

260

1

INDUSTRIAL

Parallel

512kB

1

10 ns

3-STATE

19b

4 Mb

COMMON

Asynchronous

8b

3V

3.6V

3V

23.4mm

10.2mm

2.2mm

无

符合RoHS标准

无铅

IDT71V25761YSA183BGI8
IDT71V25761YSA183BGI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA

YES

119

RAM, SRAM

Tape & Reel (TR)

2009

e0

3 (168 Hours)

119

3A991.B.2.A

Tin/Lead (Sn63Pb37)

85°C

-40°C

流水线结构

8542.32.00.41

3.3V

BOTTOM

BALL

1

1.27mm

not_compliant

183MHz

不合格

2.53.3V

INDUSTRIAL

Parallel

SYNCHRONOUS

0.35mA

128KX36

3-STATE

36

0.035A

4718592 bit

3.3 ns

COMMON

3.14V

3.465V

3.135V

2.36mm

22mm

14mm

Non-RoHS Compliant

70V639S12PRF
70V639S12PRF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

128

465mA

RAM, SDR, SRAM

Bulk

2009

e0

no

活跃

3 (168 Hours)

128

Tin/Lead (Sn85Pb15)

70°C

0°C

3.3V

QUAD

鸥翼

225

1

0.5mm

COMMERCIAL

Parallel

256kB

2

12 ns

3-STATE

34b

2.3 Mb

0.015A

COMMON

Asynchronous

18b

3.45V

3.15V

1.6mm

20mm

14mm

1.4mm

无

符合RoHS标准

含铅

IDT71V3556S133BGI8
IDT71V3556S133BGI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA

YES

119

RAM, SRAM

Tape & Reel (TR)

2007

e0

3 (168 Hours)

119

3A991.B.2.A

Tin/Lead (Sn63Pb37)

85°C

-40°C

8542.32.00.41

3.3V

BOTTOM

BALL

未说明

1

1.27mm

not_compliant

133MHz

未说明

不合格

3.3V

INDUSTRIAL

Parallel

SYNCHRONOUS

0.31mA

128KX36

3-STATE

36

0.045A

4718592 bit

4.2 ns

COMMON

3.14V

3.465V

3.135V

2.36mm

22mm

14mm

Non-RoHS Compliant

70V9089L9PF
70V9089L9PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

225mA

RAM, SRAM

2009

活跃

70°C

0°C

3.3V

40MHz

Parallel

2

20 ns

16b

512 kb

Synchronous

8b

3.6V

3V

14mm

14mm

1.4mm

无

符合RoHS标准

含铅

IDT71V424YS12PH8
IDT71V424YS12PH8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

TSOP

YES

44

RAM, SRAM - Asynchronous

Tape & Reel (TR)

2009

e0

3 (168 Hours)

44

3A991.B.2.A

Tin/Lead (Sn85Pb15)

70°C

0°C

8542.32.00.41

3.3V

DUAL

鸥翼

240

1

0.8mm

not_compliant

30

R-PDSO-G44

不合格

COMMERCIAL

Parallel

512KX8

8

4194304 bit

12 ns

3.6V

3V

1.2mm

18.41mm

10.16mm

Non-RoHS Compliant

71V124SA15PHGI8
71V124SA15PHGI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TSOP

32

120mA

RAM, SDR, SRAM - Asynchronous

2013

e3

yes

活跃

3 (168 Hours)

32

Matte Tin (Sn) - annealed

85°C

-40°C

3.3V

DUAL

鸥翼

260

1

30

INDUSTRIAL

Parallel

128kB

1

15 ns

3-STATE

17b

1 Mb

COMMON

Asynchronous

8b

3V

3.6V

3V

20.95mm

10.16mm

1mm

无

符合RoHS标准

无铅

70V06L20JGI
70V06L20JGI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

68

195mA

RAM, SRAM

Bulk

2008

e3

yes

活跃

3 (168 Hours)

68

EAR99

哑光锡

85°C

-40°C

3.3V

QUAD

J BEND

260

1

INDUSTRIAL

Parallel

2

20 ns

16KX8

28b

128 kb

Asynchronous

8b

3.6V

3V

4.57mm

24mm

24mm

3.63mm

无

符合RoHS标准

无铅

IDT70824S35PF
IDT70824S35PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

LQFP

YES

80

RAM

2009

e0

3 (168 Hours)

80

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

8542.32.00.41

5V

QUAD

鸥翼

240

1

0.65mm

not_compliant

20

S-PQFP-G80

不合格

5V

COMMERCIAL

Parallel

ASYNCHRONOUS

0.34mA

4KX16

16

0.015A

65536 bit

35 ns

5.5V

4.5V

1.6mm

14mm

14mm

Non-RoHS Compliant