品牌是'IDT' (6623)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

工厂交货时间

底架

包装/外壳

表面安装

引脚数

质量

Current - Supply (Nom)

包装

已出版

JESD-609代码

无铅代码

零件状态

湿度敏感性等级(MSL)

终止次数

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

Reach合规守则

频率

时间@峰值回流温度-最大值(s)

JESD-30代码

最大电流源

资历状况

电源

温度等级

界面

内存大小

端口的数量

操作模式

时钟频率

电源电流-最大值

访问时间

组织结构

输出特性

内存宽度

地址总线宽度

密度

待机电流-最大值

记忆密度

访问时间(最大)

I/O类型

同步/异步

字长

待机电压-最小值

电压 - 供电 (最大值)

电压 - 供电 (最小值)

输出启用

高度

座位高度(最大)

长度

宽度

器件厚度

辐射硬化

RoHS状态

无铅

IDT71V416VS12BE8
IDT71V416VS12BE8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

TFBGA

YES

48

RAM, SRAM - Asynchronous

Tape & Reel (TR)

2005

e0

48

3A991.B.2.A

锡铅

70°C

0°C

8542.32.00.41

3.3V

BOTTOM

BALL

225

1

0.75mm

30

S-PBGA-B48

不合格

COMMERCIAL

Parallel

256KX16

16

4194304 bit

12 ns

3.6V

3V

1.2mm

9mm

9mm

Non-RoHS Compliant

IDT71024S15TY8
IDT71024S15TY8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

32

RAM, SRAM - Asynchronous

Tape & Reel (TR)

2010

e0

3 (168 Hours)

32

3A991.B.2.B

Tin/Lead (Sn85Pb15)

70°C

0°C

5V

DUAL

J BEND

225

1

1.27mm

not_compliant

30

不合格

5V

COMMERCIAL

Parallel

1

0.155mA

128KX8

3-STATE

8

0.01A

1048576 bit

15 ns

COMMON

4.5V

5.5V

4.5V

YES

3.76mm

20.96mm

7.62mm

Non-RoHS Compliant

70V5388S166BG8
70V5388S166BG8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA

272

395mA

RAM, SDR, SRAM

2008

e0

no

Discontinued

3 (168 Hours)

272

3A991.B.2.A

Tin/Lead (Sn63Pb37)

70°C

0°C

流水线结构

3.3V

BOTTOM

BALL

225

1

166MHz

20

COMMERCIAL

Parallel

128kB

4

6 ns

3-STATE

16b

1.1 Mb

0.015A

COMMON

Synchronous

18b

3.45V

3.15V

27mm

27mm

2mm

符合RoHS标准

含铅

IDT71V35761YSA166BQ
IDT71V35761YSA166BQ
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

165

RAM, SRAM

2009

e0

3 (168 Hours)

165

3A991.B.2.A

Tin/Lead (Sn63Pb37)

70°C

0°C

流水线结构

8542.32.00.41

3.3V

BOTTOM

BALL

225

1

1mm

not_compliant

166MHz

20

不合格

3.3V

COMMERCIAL

Parallel

SYNCHRONOUS

0.32mA

128KX36

3-STATE

36

0.03A

4718592 bit

3.5 ns

COMMON

3.14V

3.465V

3.135V

1.2mm

15mm

13mm

Non-RoHS Compliant

71321LA25JI8
71321LA25JI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

52

220mA

RAM, SDR, SRAM

2001

e0

no

活跃

3 (168 Hours)

52

EAR99

Tin/Lead (Sn85Pb15)

85°C

-40°C

5V

QUAD

J BEND

225

1

5V

INDUSTRIAL

Parallel

2kB

2

25 ns

3-STATE

22b

16 kb

0.004A

COMMON

Asynchronous

8b

2V

5.5V

4.5V

19mm

19mm

3.63mm

符合RoHS标准

含铅

70V26L25JI8
70V26L25JI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

84

185mA

RAM, SDR, SRAM

2009

no

活跃

EAR99

85°C

-40°C

3.3V

Parallel

32kB

2

25 ns

14b

256 kb

Asynchronous

16b

3.6V

3V

29.21mm

29.21mm

3.63mm

符合RoHS标准

含铅

IDT71V3559S85PFI8
IDT71V3559S85PFI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

LQFP

YES

100

RAM, SRAM

Tape & Reel (TR)

2009

e0

3 (168 Hours)

100

3A991.B.2.A

Tin/Lead (Sn85Pb15)

85°C

-40°C

FLOW-THROUGH ARCHITECTURE

8542.32.00.41

3.3V

QUAD

鸥翼

240

1

0.65mm

not_compliant

20

R-PQFP-G100

不合格

3.3V

INDUSTRIAL

Parallel

SYNCHRONOUS

90MHz

0.235mA

256KX18

3-STATE

18

0.045A

4718592 bit

8.5 ns

COMMON

3.14V

3.465V

3.135V

1.6mm

20mm

14mm

Non-RoHS Compliant

IDT71V65603S100PF8
IDT71V65603S100PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

LQFP

YES

100

RAM, SRAM

Tape & Reel (TR)

2015

e0

3 (168 Hours)

100

3A991.B.2.A

Tin/Lead (Sn85Pb15)

70°C

0°C

流水线结构

8542.32.00.41

3.3V

QUAD

鸥翼

240

1

0.65mm

not_compliant

100MHz

20

R-PQFP-G100

不合格

3.3V

COMMERCIAL

Parallel

SYNCHRONOUS

0.25mA

256KX36

3-STATE

36

0.04A

9437184 bit

5 ns

COMMON

3.14V

3.465V

3.135V

1.6mm

20mm

14mm

Non-RoHS Compliant

71V416L15YGI8
71V416L15YGI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

12 Weeks

表面贴装

44

160mA

RAM, SDR, SRAM - Asynchronous

2013

e3

yes

活跃

3 (168 Hours)

44

哑光锡

85°C

-40°C

3.3V

DUAL

J BEND

260

1

INDUSTRIAL

Parallel

512kB

1

15 ns

3-STATE

18b

4 Mb

COMMON

Asynchronous

16b

3V

3.6V

3V

28.6mm

10.2mm

2.9mm

符合RoHS标准

无铅

71V416S15BEGI
71V416S15BEGI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

12 Weeks

表面贴装

TFBGA

48

170mA

RAM, SDR, SRAM - Asynchronous

Bulk

2014

e1

yes

活跃

3 (168 Hours)

48

Tin/Silver/Copper (Sn/Ag/Cu)

85°C

-40°C

3.3V

BOTTOM

BALL

260

1

0.75mm

INDUSTRIAL

Parallel

512kB

1

15 ns

3-STATE

18b

4 Mb

0.02A

COMMON

Asynchronous

16b

3V

3.6V

3V

9mm

9mm

1.2mm

符合RoHS标准

无铅

IDT71V424S15Y8
IDT71V424S15Y8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

36

RAM, SRAM - Asynchronous

Tape & Reel (TR)

2009

e0

3 (168 Hours)

36

3A991.B.2.A

Tin/Lead (Sn85Pb15)

70°C

0°C

8542.32.00.41

3.3V

DUAL

J BEND

1

1.27mm

not_compliant

不合格

3.3V

COMMERCIAL

Parallel

1

0.16mA

512KX8

3-STATE

8

0.02A

4194304 bit

15 ns

COMMON

3V

3.6V

3V

YES

3.683mm

23.495mm

10.16mm

Non-RoHS Compliant

709349L7PFGI
709349L7PFGI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

440mA

RAM, SRAM

2003

e3

yes

活跃

3 (168 Hours)

100

EAR99

Matte Tin (Sn) - annealed

85°C

-40°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

5V

QUAD

鸥翼

260

1

0.5mm

45.45MHz

30

5V

INDUSTRIAL

Parallel

2

18 ns

4KX18

3-STATE

12b

72 kb

0.003A

COMMON

Synchronous

18b

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

无铅

IDT70T631S15DD
IDT70T631S15DD
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

TQFP

YES

144

RAM, SRAM

2008

e0

4 (72 Hours)

144

3A991.B.2.A

Tin/Lead (Sn85Pb15)

70°C

0°C

8542.32.00.41

2.5V

QUAD

鸥翼

225

1

0.5mm

not_compliant

30

S-PQFP-G144

不合格

2.52.5/3.3V

COMMERCIAL

Parallel

2

ASYNCHRONOUS

0.305mA

256KX18

3-STATE

18

0.01A

4718592 bit

15 ns

COMMON

2.4V

2.6V

2.4V

1.6mm

20mm

20mm

Non-RoHS Compliant

71321LA55PF8
71321LA55PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

TQFP

YES

64

RAM, SDR, SRAM

Tape & Reel

2008

e0

no

活跃

3 (168 Hours)

64

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP

5V

QUAD

鸥翼

240

1

0.8mm

20

5V

COMMERCIAL

Parallel

2kB

2

0.11mA

55 ns

3-STATE

22b

16 kb

0.0015A

COMMON

2V

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

71V65603S133PFG8
71V65603S133PFG8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

13 Weeks

表面贴装

TQFP

100

300mA

133MHz

RAM, SDR, SRAM

Tape & Reel

2005

e3

yes

活跃

3 (168 Hours)

100

Matte Tin (Sn) - annealed

70°C

0°C

流水线结构

3.3V

QUAD

鸥翼

260

1

0.65mm

133MHz

30

COMMERCIAL

Parallel

1.1MB

1

4.2 ns

256KX36

3-STATE

18b

9 Mb

0.04A

COMMON

Synchronous

36b

3.465V

3.135V

20mm

14mm

1.4mm

符合RoHS标准

无铅

70T3339S133BC8
70T3339S133BC8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

256

370mA

RAM, SRAM

Tape & Reel

2010

e0

no

活跃

3 (168 Hours)

256

Tin/Lead (Sn63Pb37)

70°C

0°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

2.5V

BOTTOM

BALL

225

1

1mm

133MHz

20

COMMERCIAL

Parallel

2

15 ns

3-STATE

19b

9 Mb

0.015A

COMMON

Synchronous

18b

2.6V

2.4V

1.5mm

17mm

17mm

1.4mm

符合RoHS标准

含铅

70261S25PF
70261S25PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

305mA

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

100

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE

5V

QUAD

鸥翼

240

1

0.5mm

20

5V

COMMERCIAL

Parallel

32kB

2

25 ns

16KX16

3-STATE

28b

256 kb

0.015A

COMMON

Asynchronous

16b

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

70V24L15PFG8
70V24L15PFG8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

657.000198mg

185mA

RAM, SDR, SRAM

2005

e3

yes

活跃

3 (168 Hours)

100

EAR99

Matte Tin (Sn) - annealed

70°C

0°C

3.3V

QUAD

鸥翼

260

1

0.5mm

30

185mA

COMMERCIAL

Parallel

8kB

2

15 ns

4KX16

3-STATE

24b

64 kb

COMMON

Asynchronous

16b

3V

3.6V

3V

1.4mm

14mm

14mm

1.4mm

符合RoHS标准

无铅

70V9169L6PF
70V9169L6PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

330mA

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

100

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

3.3V

QUAD

鸥翼

240

1

0.5mm

52.6MHz

20

COMMERCIAL

Parallel

18kB

2

6 ns

16KX9

3-STATE

28b

144 kb

0.003A

COMMON

Synchronous

9b

3V

3.6V

3V

14mm

14mm

1.4mm

符合RoHS标准

含铅

70V38L20PF8
70V38L20PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

205mA

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

100

Tin/Lead (Sn85Pb15)

70°C

0°C

3.3V

QUAD

鸥翼

240

1

0.5mm

20

COMMERCIAL

Parallel

128kB

2

20 ns

64KX18

3-STATE

32b

1.1 Mb

0.003A

COMMON

Asynchronous

18b

3V

3.6V

3V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

7015L35J
7015L35J
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

68

210mA

RAM, SDR, SRAM

2010

e0

no

活跃

1 (Unlimited)

68

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

5V

QUAD

J BEND

225

1

5V

COMMERCIAL

Parallel

9kB

2

35 ns

8KX9

3-STATE

26b

72 kb

0.005A

COMMON

Asynchronous

9b

5.5V

4.5V

4.57mm

24mm

24mm

3.63mm

符合RoHS标准

含铅

IDT71V2558S200PF8
IDT71V2558S200PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

LQFP

YES

100

RAM, SRAM

Tape & Reel (TR)

2007

e0

3 (168 Hours)

100

3A991.B.2.A

Tin/Lead (Sn85Pb15)

70°C

0°C

流水线结构

8542.32.00.41

3.3V

QUAD

鸥翼

240

1

0.65mm

not_compliant

200MHz

20

R-PQFP-G100

不合格

2.53.3V

COMMERCIAL

Parallel

SYNCHRONOUS

0.4mA

256KX18

3-STATE

18

0.04A

4718592 bit

3.2 ns

COMMON

3.14V

3.465V

3.135V

1.6mm

20mm

14mm

Non-RoHS Compliant

70V3389S6BF
70V3389S6BF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

208

310mA

RAM, SDR, SRAM

Bulk

2009

e0

no

活跃

3 (168 Hours)

208

Tin/Lead (Sn63Pb37)

70°C

0°C

PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE

3.3V

BOTTOM

BALL

225

1

0.8mm

83.3MHz

20

COMMERCIAL

Parallel

128kB

2

6 ns

64KX18

3-STATE

32b

1.1 Mb

0.015A

COMMON

Synchronous

18b

3.45V

3.15V

15mm

15mm

1.4mm

符合RoHS标准

含铅

709089L12PF8
709089L12PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

657.000198mg

305mA

RAM, SDR, SRAM

2010

no

活跃

70°C

0°C

5V

33.3MHz

305mA

Parallel

64kB

2

12 ns

32b

512 kb

Synchronous

8b

5.5V

4.5V

1.4mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

70V659S10BC8
70V659S10BC8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

256

500mA

RAM, SRAM

Tape & Reel

2009

e0

no

活跃

3 (168 Hours)

256

Tin/Lead (Sn63Pb37)

70°C

0°C

3.3V

BOTTOM

BALL

225

1

1mm

COMMERCIAL

Parallel

2

10 ns

3-STATE

17b

4.5 Mb

0.015A

COMMON

Asynchronous

36b

3.45V

3.15V

1.5mm

17mm

17mm

1.4mm

符合RoHS标准

含铅