品牌是'IDT' (6623)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

工厂交货时间

底架

包装/外壳

表面安装

引脚数

Current - Supply (Nom)

包装

已出版

JESD-609代码

无铅代码

零件状态

湿度敏感性等级(MSL)

终止次数

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

Reach合规守则

频率

时间@峰值回流温度-最大值(s)

JESD-30代码

资历状况

电源

温度等级

界面

内存大小

端口的数量

操作模式

时钟频率

电源电流-最大值

访问时间

组织结构

输出特性

内存宽度

地址总线宽度

密度

待机电流-最大值

记忆密度

访问时间(最大)

I/O类型

同步/异步

字长

待机电压-最小值

电压 - 供电 (最大值)

电压 - 供电 (最小值)

座位高度(最大)

长度

宽度

器件厚度

辐射硬化

RoHS状态

无铅

70T3539MS133BC8
70T3539MS133BC8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

BGA

256

740mA

RAM, SRAM

Tape & Reel

2009

e0

no

活跃

3 (168 Hours)

256

Tin/Lead (Sn63Pb37)

70°C

0°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

2.5V

BOTTOM

BALL

225

1

1mm

133MHz

20

COMMERCIAL

Parallel

2

15 ns

3-STATE

19b

18 Mb

COMMON

Synchronous

36b

2.6V

2.4V

1.5mm

17mm

17mm

1.4mm

符合RoHS标准

含铅

71V416S10PHGI8
71V416S10PHGI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

12 Weeks

TSOP

YES

44

RAM, SDR, SRAM - Asynchronous

2013

e3

yes

活跃

3 (168 Hours)

44

Matte Tin (Sn) - annealed

85°C

-40°C

3.3V

DUAL

鸥翼

260

1

0.8mm

INDUSTRIAL

Parallel

512kB

1

10 ns

18b

4 Mb

3.6V

3V

18.41mm

10.16mm

1mm

符合RoHS标准

无铅

IDT71V416VL10PHG
IDT71V416VL10PHG
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

TSOP

YES

44

RAM, SRAM - Asynchronous

2005

e3

yes

3 (168 Hours)

44

3A991.B.2.A

Matte Tin (Sn) - annealed

70°C

0°C

8542.32.00.41

3.3V

DUAL

鸥翼

260

1

0.8mm

30

R-PDSO-G44

不合格

3.3V

COMMERCIAL

Parallel

0.18mA

256KX16

3-STATE

16

0.01A

4194304 bit

10 ns

COMMON

3V

3.6V

3V

1.2mm

18.41mm

10.16mm

符合RoHS标准

71256SA12PZG8
71256SA12PZG8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TSSOP

28

160mA

RAM, SDR, SRAM - Asynchronous

2011

e3

yes

活跃

3 (168 Hours)

28

EAR99

Matte Tin (Sn) - annealed

70°C

0°C

5V

DUAL

鸥翼

260

1

0.55mm

30

5V

COMMERCIAL

Parallel

32kB

1

12 ns

32KX8

3-STATE

15b

256 kb

COMMON

Asynchronous

8b

5.5V

4.5V

8mm

11.8mm

1mm

符合RoHS标准

无铅

709349L9PF8
709349L9PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

TQFP

YES

100

RAM, SDR, SRAM

2008

e0

no

活跃

3 (168 Hours)

100

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

5V

QUAD

鸥翼

240

1

0.5mm

20

5V

COMMERCIAL

Parallel

9kB

2

0.36mA

9 ns

4KX18

3-STATE

24b

72 kb

0.003A

COMMON

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

71V3577S85BG8
71V3577S85BG8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

BGA

119

180mA

87MHz

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

119

Tin/Lead (Sn63Pb37)

70°C

0°C

FLOW-THROUGH ARCHITECTURE

3.3V

BOTTOM

BALL

225

1

87MHz

20

COMMERCIAL

Parallel

512kB

1

8.5 ns

3-STATE

17b

4.5 Mb

0.03A

COMMON

Synchronous

36b

3.465V

3.135V

2.36mm

14mm

22mm

2.15mm

符合RoHS标准

含铅

IDT71V416VL10PHG8
IDT71V416VL10PHG8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

TSOP

YES

44

RAM, SRAM - Asynchronous

Tape & Reel (TR)

2005

e3

yes

3 (168 Hours)

44

3A991.B.2.A

哑光锡

70°C

0°C

8542.32.00.41

3.3V

DUAL

鸥翼

260

1

0.8mm

30

R-PDSO-G44

不合格

COMMERCIAL

Parallel

256KX16

16

4194304 bit

10 ns

3.6V

3V

1.2mm

18.41mm

10.16mm

符合RoHS标准

7015S25PF8
7015S25PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

80

265mA

RAM, SDR, SRAM

2010

e0

no

活跃

3 (168 Hours)

80

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN

5V

QUAD

鸥翼

240

1

0.65mm

20

5V

COMMERCIAL

Parallel

9kB

2

25 ns

8KX9

3-STATE

26b

72 kb

0.015A

COMMON

Asynchronous

9b

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

709079S12PF8
709079S12PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

345mA

RAM, SRAM

Tape & Reel

2004

e0

no

活跃

3 (168 Hours)

100

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

5V

QUAD

鸥翼

240

1

0.5mm

33.3MHz

20

5V

COMMERCIAL

Parallel

2

25 ns

3-STATE

15b

256 kb

0.015A

COMMON

Synchronous

8b

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

71V321L25J8
71V321L25J8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

52

100mA

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

52

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

BATTERY BACKUP;AUTOMATIC POWER DOWN

3.3V

QUAD

J BEND

225

1

COMMERCIAL

Parallel

2kB

2

25 ns

3-STATE

22b

16 kb

0.0015A

COMMON

Asynchronous

8b

2V

3.6V

3V

4.57mm

19mm

19mm

3.63mm

符合RoHS标准

含铅

71V25761S166BG8
71V25761S166BG8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

BGA

119

320mA

166MHz

RAM, SDR, SRAM

2009

e0

no

Discontinued

3 (168 Hours)

119

Tin/Lead (Sn63Pb37)

70°C

0°C

流水线结构

3.3V

BOTTOM

BALL

225

1

166MHz

20

COMMERCIAL

Parallel

512kB

1

3.5 ns

3-STATE

17b

4.5 Mb

0.03A

COMMON

Synchronous

36b

3.465V

3.135V

2.36mm

14mm

22mm

2.15mm

符合RoHS标准

含铅

70V3579S5BFI
70V3579S5BFI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

208

415mA

RAM, SDR, SRAM

Bulk

2009

e0

no

活跃

3 (168 Hours)

208

Tin/Lead (Sn63Pb37)

85°C

-40°C

3.3V

BOTTOM

BALL

225

1

0.8mm

100MHz

20

INDUSTRIAL

Parallel

128kB

2

10 ns

3-STATE

30b

1.1 Mb

COMMON

Synchronous

36b

3.45V

3.15V

15mm

15mm

1.4mm

符合RoHS标准

含铅

71321SA25PF8
71321SA25PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

TQFP

YES

64

RAM, SDR, SRAM

2008

e0

no

活跃

3 (168 Hours)

64

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; AUTOMATIC POWER-DOWN

5V

QUAD

鸥翼

240

1

0.8mm

20

5V

COMMERCIAL

Parallel

2kB

2

25 ns

3-STATE

22b

16 kb

0.015A

COMMON

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

IDT71V3577SA80BGG8
IDT71V3577SA80BGG8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA

YES

119

RAM, SRAM

Tape & Reel (TR)

2005

e1

119

3A991.B.2.A

锡银铜

70°C

0°C

FLOW-THROUGH ARCHITECTURE

8542.32.00.41

3.3V

BOTTOM

BALL

1

1.27mm

unknown

不合格

COMMERCIAL

Parallel

SYNCHRONOUS

128KX36

36

4718592 bit

8 ns

3.465V

3.135V

2.36mm

22mm

14mm

符合RoHS标准

71V67803S133BG8
71V67803S133BG8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

BGA

119

260mA

RAM, SRAM

Tape & Reel

2009

e0

no

活跃

3 (168 Hours)

119

Tin/Lead (Sn63Pb37)

70°C

0°C

流水线结构

3.3V

BOTTOM

BALL

225

1

133MHz

20

COMMERCIAL

Parallel

1

4.2 ns

3-STATE

19b

9 Mb

0.05A

COMMON

Synchronous

18b

3.465V

3.135V

2.36mm

14mm

22mm

2.15mm

符合RoHS标准

含铅

IDT71V3577SA85BG8
IDT71V3577SA85BG8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA

YES

119

RAM, SRAM

Tape & Reel (TR)

2005

e0

3 (168 Hours)

119

3A991.B.2.A

Tin/Lead (Sn63Pb37)

70°C

0°C

FLOW-THROUGH ARCHITECTURE

8542.32.00.41

3.3V

BOTTOM

BALL

1

1.27mm

not_compliant

不合格

3.3V

COMMERCIAL

Parallel

SYNCHRONOUS

87MHz

0.18mA

128KX36

3-STATE

36

0.03A

4718592 bit

8.5 ns

COMMON

3.14V

3.465V

3.135V

2.36mm

22mm

14mm

Non-RoHS Compliant

71024S25TYGI
71024S25TYGI
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

32

RAM, SDR, SRAM - Asynchronous

2013

e3

yes

Discontinued

3 (168 Hours)

Matte Tin (Sn) - annealed

85°C

-40°C

5V

260

Parallel

128kB

1

25 ns

17b

1 Mb

Asynchronous

8b

5.5V

4.5V

21.95mm

7.6mm

2.67mm

符合RoHS标准

无铅

7134LA35P
7134LA35P
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

通孔

PDIP

48

210mA

RAM, SDR, SRAM

Bulk

2013

e0

no

Discontinued

1 (Unlimited)

48

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

AUTOMATIC POWER-DOWN; BATTERY BACKUP

5V

DUAL

245

1

5V

COMMERCIAL

Parallel

4kB

2

35 ns

4KX8

3-STATE

24b

32 kb

0.0015A

COMMON

Asynchronous

8b

2V

5.5V

4.5V

5.08mm

61.7mm

15.24mm

3.8mm

符合RoHS标准

含铅

IDT71V3577SA80BQI8
IDT71V3577SA80BQI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

165

RAM, SRAM

Tape & Reel (TR)

2005

e0

3 (168 Hours)

165

3A991.B.2.A

Tin/Lead (Sn63Pb37)

85°C

-40°C

FLOW-THROUGH ARCHITECTURE

8542.32.00.41

3.3V

BOTTOM

BALL

1

1mm

not_compliant

不合格

3.3V

INDUSTRIAL

Parallel

SYNCHRONOUS

100MHz

0.21mA

128KX36

3-STATE

36

0.035A

4718592 bit

8 ns

COMMON

3.14V

3.465V

3.135V

1.2mm

15mm

13mm

Non-RoHS Compliant

IDT71V3577SA85BG
IDT71V3577SA85BG
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA

YES

119

RAM, SRAM

2005

e1

yes

3 (168 Hours)

119

3A991.B.2.A

锡银铜

70°C

0°C

FLOW-THROUGH ARCHITECTURE

8542.32.00.41

3.3V

BOTTOM

BALL

260

1

1.27mm

30

不合格

INDUSTRIAL

Parallel

SYNCHRONOUS

128KX36

36

4718592 bit

8.5 ns

3.465V

3.135V

2.36mm

22mm

14mm

Non-RoHS Compliant

7164L25YGI8
7164L25YGI8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

YES

28

RAM, SDR, SRAM - Asynchronous

Tape & Reel

2009

e3

yes

活跃

3 (168 Hours)

28

EAR99

Matte Tin (Sn) - annealed

85°C

-40°C

5V

DUAL

J BEND

260

1

5V

INDUSTRIAL

Parallel

8kB

1

25 ns

8KX8

3-STATE

13b

64 kb

0.00006A

COMMON

2V

5.5V

4.5V

3.556mm

17.9mm

7.6mm

2.67mm

符合RoHS标准

无铅

7026L25J
7026L25J
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

PLCC

84

265mA

RAM, SDR, SRAM

2009

no

活跃

EAR99

70°C

0°C

5V

Parallel

32kB

2

25 ns

28b

256 kb

Asynchronous

16b

5.5V

4.5V

29.21mm

29.21mm

3.63mm

符合RoHS标准

含铅

71421LA35PF
71421LA35PF
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

64

120mA

RAM, SDR, SRAM

2008

e0

no

活跃

3 (168 Hours)

64

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP

5V

QUAD

鸥翼

240

1

0.8mm

20

5V

COMMERCIAL

Parallel

2kB

2

35 ns

3-STATE

22b

16 kb

0.0015A

COMMON

Asynchronous

8b

2V

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅

IDT71V3577SA80BQ8
IDT71V3577SA80BQ8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

165

RAM, SRAM

Tape & Reel (TR)

2005

e0

3 (168 Hours)

165

3A991.B.2.A

Tin/Lead (Sn63Pb37)

70°C

0°C

FLOW-THROUGH ARCHITECTURE

8542.32.00.41

3.3V

BOTTOM

BALL

1

1mm

not_compliant

不合格

3.3V

COMMERCIAL

Parallel

SYNCHRONOUS

100MHz

0.2mA

128KX36

3-STATE

36

0.03A

4718592 bit

8 ns

COMMON

3.14V

3.465V

3.135V

1.2mm

15mm

13mm

Non-RoHS Compliant

7027L55PF8
7027L55PF8
Integrated Device Technology (IDT) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7 Weeks

表面贴装

TQFP

100

230mA

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

100

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE

5V

QUAD

鸥翼

240

1

0.5mm

20

5V

COMMERCIAL

Parallel

64kB

2

55 ns

3-STATE

30b

512 kb

0.015A

COMMON

Asynchronous

16b

5.5V

4.5V

1.6mm

14mm

14mm

1.4mm

符合RoHS标准

含铅