N/A

-

12 Weeks

表面贴装

44

130mA

RAM, SDR, SRAM - Asynchronous

2011

e3

yes

活跃

3 (168 Hours)

44

Matte Tin (Sn) - annealed

85°C

-40°C

3.3V

DUAL

J BEND

260

1

INDUSTRIAL

Parallel

128kB

1

15 ns

3-STATE

16b

1 Mb

COMMON

Asynchronous

16b

3V

3.6V

3V

3.683mm

28.6mm

10.2mm

2.9mm

无

符合RoHS标准

无铅

N/A

-

7 Weeks

表面贴装

208

465mA

RAM, SDR, SRAM

Bulk

2009

e1

yes

活跃

3 (168 Hours)

208

Tin/Silver/Copper (Sn/Ag/Cu)

70°C

0°C

3.3V

BOTTOM

BALL

260

1

0.8mm

30

INDUSTRIAL

Parallel

128kB

2

12 ns

3-STATE

30b

1.1 Mb

0.015A

COMMON

Asynchronous

36b

3.45V

3.15V

15mm

15mm

1.4mm

无

符合RoHS标准

含铅

N/A

-

7 Weeks

表面贴装

PLCC

52

100mA

RAM, SDR, SRAM

2009

e3

yes

活跃

1 (Unlimited)

52

EAR99

Matte Tin (Sn) - annealed

70°C

0°C

3.3V

QUAD

J BEND

260

1

INDUSTRIAL

Parallel

2kB

2

25 ns

3-STATE

22b

16 kb

0.0015A

COMMON

Asynchronous

8b

2V

3.6V

3V

19mm

19mm

3.63mm

无

符合RoHS标准

无铅

N/A

-

11 Weeks

表面贴装

165

255mA

100MHz

RAM, SDR, SRAM

2006

e0

no

活跃

3 (168 Hours)

165

Tin/Lead (Sn63Pb37)

85°C

-40°C

3.3V

BOTTOM

BALL

225

1

100MHz

20

INDUSTRIAL

Parallel

512kB

1

5 ns

3-STATE

17b

4.5 Mb

0.045A

COMMON

Synchronous

36b

3.465V

3.135V

15mm

13mm

1.2mm

无

符合RoHS标准

含铅

N/A

-

7 Weeks

表面贴装

208

450mA

133MHz

RAM, SDR, SRAM

2010

e1

yes

活跃

3 (168 Hours)

208

Tin/Silver/Copper (Sn/Ag/Cu)

85°C

-40°C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

2.5V

BOTTOM

BALL

260

1

0.8mm

133MHz

30

INDUSTRIAL

Parallel

1.1MB

2

4.2 ns

3-STATE

38b

9 Mb

COMMON

Synchronous

18b

2.6V

2.4V

1.7mm

15mm

15mm

1.4mm

无

符合RoHS标准

无铅

N/A

-

7 Weeks

表面贴装

PLCC

52

100mA

RAM, SDR, SRAM

2009

e3

yes

活跃

1 (Unlimited)

52

EAR99

Matte Tin (Sn) - annealed

70°C

0°C

3.3V

QUAD

J BEND

260

1

COMMERCIAL

Parallel

2kB

2

25 ns

3-STATE

22b

16 kb

0.0015A

COMMON

Asynchronous

8b

2V

3.6V

3V

19mm

19mm

3.63mm

无

符合RoHS标准

无铅

N/A

-

8 Weeks

表面贴装

TQFP

100

245mA

166MHz

RAM, SDR, SRAM

2012

e3

yes

活跃

3 (168 Hours)

100

Matte Tin (Sn) - annealed

70°C

0°C

流水线结构

2.5V

QUAD

鸥翼

260

1

0.65mm

166MHz

30

COMMERCIAL

Parallel

2.3MB

1

3.5 ns

3-STATE

20b

18 Mb

0.04A

COMMON

Synchronous

18b

2.38V

2.625V

2.375V

20mm

14mm

1.4mm

无

符合RoHS标准

无铅

N/A

-

7 Weeks

表面贴装

PLCC

52

200mA

RAM, SDR, SRAM

2008

e3

yes

活跃

1 (Unlimited)

52

EAR99

Matte Tin (Sn) - annealed

70°C

0°C

自动断电

5V

QUAD

J BEND

260

1

5V

COMMERCIAL

Parallel

2kB

2

20 ns

3-STATE

22b

16 kb

0.0015A

COMMON

Asynchronous

8b

2V

5.5V

4.5V

19mm

19mm

3.63mm

无

符合RoHS标准

无铅

N/A

-

8 Weeks

表面贴装

BGA

119

275mA

RAM, SRAM

Tape & Reel

2012

e1

yes

活跃

3 (168 Hours)

119

Tin/Silver/Copper (Sn/Ag/Cu)

70°C

0°C

流水线结构

2.5V

BOTTOM

BALL

260

1

200MHz

30

COMMERCIAL

Parallel

1

3.2 ns

3-STATE

20b

18 Mb

0.04A

COMMON

Synchronous

18b

2.38V

2.625V

2.375V

2.36mm

14mm

22mm

2.15mm

无

符合RoHS标准

无铅

N/A

-

12 Weeks

表面贴装

TQFP

100

250mA

100MHz

RAM, SDR, SRAM

2006

e3

yes

活跃

3 (168 Hours)

100

Matte Tin (Sn) - annealed

70°C

0°C

3.3V

QUAD

鸥翼

260

1

0.65mm

100MHz

30

COMMERCIAL

Parallel

512kB

1

5 ns

3-STATE

17b

4.5 Mb

0.04A

COMMON

Synchronous

36b

3.465V

3.135V

20mm

14mm

1.4mm

无

符合RoHS标准

无铅

N/A

-

7 Weeks

表面贴装

BGA

119

330mA

166MHz

RAM, SDR, SRAM

2009

e0

no

活跃

3 (168 Hours)

119

Tin/Lead (Sn63Pb37)

85°C

-40°C

流水线结构

3.3V

BOTTOM

BALL

225

1

166MHz

20

INDUSTRIAL

Parallel

512kB

1

3.5 ns

3-STATE

17b

4.5 Mb

0.035A

COMMON

Synchronous

36b

3.465V

3.135V

2.36mm

14mm

22mm

2.15mm

无

符合RoHS标准

含铅

N/A

-

8 Weeks

表面贴装

TQFP

100

195mA

133MHz

RAM, SDR, SRAM

2012

e3

yes

活跃

3 (168 Hours)

100

Matte Tin (Sn) - annealed

70°C

0°C

流水线结构

2.5V

QUAD

鸥翼

260

1

0.65mm

133MHz

30

COMMERCIAL

Parallel

2.3MB

1

4.2 ns

3-STATE

20b

18 Mb

0.04A

COMMON

Synchronous

18b

2.38V

2.625V

2.375V

20mm

14mm

1.4mm

无

符合RoHS标准

无铅

N/A

-

12 Weeks

表面贴装

48

160mA

RAM, SDR, SRAM - Asynchronous

2005

e0

no

活跃

3 (168 Hours)

48

Tin/Lead (Sn63Pb37)

85°C

-40°C

3.3V

BOTTOM

BALL

225

1

0.75mm

20

INDUSTRIAL

Parallel

128kB

1

12 ns

3-STATE

16b

1 Mb

COMMON

Asynchronous

16b

3.6V

3.15V

7mm

7mm

1.4mm

无

符合RoHS标准

含铅

N/A

-

8 Weeks

表面贴装

TQFP

100

260mA

RAM, SRAM

Tape & Reel

2009

e3

yes

活跃

3 (168 Hours)

100

Matte Tin (Sn) - annealed

70°C

0°C

流水线结构

3.3V

QUAD

鸥翼

260

1

0.65mm

133MHz

30

COMMERCIAL

Parallel

1

4.2 ns

3-STATE

19b

9 Mb

0.05A

COMMON

Synchronous

18b

3.465V

3.135V

20mm

14mm

1.4mm

无

符合RoHS标准

无铅

N/A

-

7 Weeks

表面贴装

PLCC

68

300mA

RAM, SDR, SRAM

2013

no

活跃

EAR99

85°C

-40°C

5V

Parallel

4kB

2

25 ns

22b

32 kb

Asynchronous

16b

5.5V

4.5V

24mm

24mm

3.63mm

无

符合RoHS标准

含铅

N/A

-

7 Weeks

通孔

PDIP

28

145mA

RAM, SDR, SRAM - Asynchronous

2011

e3

yes

活跃

1 (Unlimited)

28

EAR99

Matte Tin (Sn) - annealed

85°C

-40°C

5V

DUAL

260

1

2.54mm

INDUSTRIAL

Parallel

32kB

1

25 ns

32KX8

15b

256 kb

Asynchronous

8b

5.5V

4.5V

4.572mm

34.3mm

7.62mm

3.3mm

无

符合RoHS标准

无铅

N/A

-

YES

36

RAM, SRAM - Asynchronous

Tape & Reel (TR)

2009

e0

3 (168 Hours)

36

3A991.B.2.A

Tin/Lead (Sn85Pb15)

70°C

0°C

8542.32.00.41

3.3V

DUAL

J BEND

225

1

1.27mm

not_compliant

30

不合格

3.3V

COMMERCIAL

Parallel

0.18mA

512KX8

3-STATE

8

0.02A

4194304 bit

10 ns

COMMON

3V

3.6V

3V

3.683mm

23.495mm

10.16mm

Non-RoHS Compliant

N/A

-

7 Weeks

PLCC

YES

68

RAM, SDR, SRAM

2008

e0

no

活跃

1 (Unlimited)

68

EAR99

Tin/Lead (Sn85Pb15)

70°C

0°C

5V

QUAD

J BEND

225

1

5V

COMMERCIAL

Parallel

4kB

2

35 ns

3-STATE

22b

32 kb

0.0015A

COMMON

2V

5.5V

4.5V

24mm

24mm

3.63mm

无

符合RoHS标准

含铅

N/A

-

表面贴装

TQFP

100

255mA

RAM, SRAM

2007

e0

3 (168 Hours)

100

85°C

-40°C

3.3V

QUAD

鸥翼

240

1

0.65mm

not_compliant

100MHz

20

不合格

INDUSTRIAL

Parallel

1

5 ns

3-STATE

18

18b

4.5 Mb

0.045A

COMMON

Synchronous

18b

3.465V

3.135V

20mm

Non-RoHS Compliant

N/A

-

7 Weeks

TQFP

YES

100

RAM, SDR, SRAM

2009

e3

yes

活跃

3 (168 Hours)

100

Matte Tin (Sn) - annealed

70°C

0°C

3.3V

QUAD

鸥翼

260

1

0.5mm

30

COMMERCIAL

Parallel

72kB

2

15 ns

3-STATE

30b

576 kb

0.003A

COMMON

3V

3.6V

3V

1.6mm

14mm

14mm

1.4mm

无

符合RoHS标准

无铅

N/A

-

7 Weeks

表面贴装

256

810mA

RAM, SRAM

Tape & Reel

2009

e0

no

活跃

3 (168 Hours)

256

Tin/Lead (Sn63Pb37)

70°C

0°C

2.5V

BOTTOM

BALL

225

1

1mm

20

COMMERCIAL

Parallel

2

10 ns

3-STATE

19b

18 Mb

COMMON

Asynchronous

36b

2.6V

2.4V

1.5mm

17mm

17mm

1.4mm

无

符合RoHS标准

含铅

N/A

-

7 Weeks

表面贴装

165

60mA

RAM, SRAM

Tape & Reel

2009

e1

yes

活跃

3 (168 Hours)

165

Tin/Silver/Copper (Sn/Ag/Cu)

85°C

-40°C

FLOW-THROUGH ARCHITECTURE

3.3V

BOTTOM

BALL

260

1

91MHz

30

INDUSTRIAL

Parallel

1

8.5 ns

256KX36

3-STATE

18b

9 Mb

0.06A

COMMON

Synchronous

36b

3.465V

3.135V

15mm

13mm

1.2mm

无

符合RoHS标准

无铅

N/A

-

7 Weeks

表面贴装

256

440mA

RAM, SRAM

Tape & Reel

2009

e0

no

活跃

3 (168 Hours)

256

Tin/Lead (Sn63Pb37)

70°C

0°C

3.3V

BOTTOM

BALL

225

1

1mm

COMMERCIAL

Parallel

2

15 ns

3-STATE

34b

4.5 Mb

0.015A

COMMON

Asynchronous

36b

3.45V

3.15V

1.5mm

17mm

17mm

1.4mm

无

符合RoHS标准

含铅

N/A

-

12 Weeks

表面贴装

TSOP

44

160mA

RAM, SDR, SRAM - Asynchronous

Tape & Reel

2013

e3

yes

活跃

3 (168 Hours)

44

Matte Tin (Sn) - annealed

85°C

-40°C

3.3V

DUAL

鸥翼

260

1

0.8mm

30

INDUSTRIAL

Parallel

512kB

1

15 ns

3-STATE

18b

4 Mb

COMMON

Asynchronous

16b

3V

3.6V

3V

18.41mm

10.16mm

1mm

无

符合RoHS标准

无铅

N/A

-

8 Weeks

表面贴装

BGA

119

175mA

100MHz

RAM, SDR, SRAM

2012

e0

no

活跃

3 (168 Hours)

119

Tin/Lead (Sn63Pb37)

70°C

0°C

流水线结构

2.5V

BOTTOM

BALL

225

1

100MHz

COMMERCIAL

Parallel

2.3MB

1

5 ns

3-STATE

20b

18 Mb

0.04A

COMMON

Synchronous

18b

2.38V

2.625V

2.375V

2.36mm

14mm

22mm

2.15mm

无

符合RoHS标准

含铅